二手 DATACON / BESI 2100FC #9312392 待售

Die bonders, 4"-12" Leadframes CSP Strips Singulated devices STH125-FC Strip handler Flip chip wafer handler, 5" Wafer handler, 12" Vision System: DVI: Dispense position FOV: 18 x 18 mm PVI / EVI: Pick / Exchange Position FOV: 9 x 9 mm BVI: Bond position FOV: 9 x 9 mm Indirect Illumination (IILL): DVI and BVI Indirect illumination (EVI) Flip module Patented Phi-Y pick and place Accessories: 102325189 Die ejector set A with 90G Chuck 841.270 Needle set R0.1/0.7/8 102223273 Die ejector needle setting tool 1000-6877 Pick-up shank type B (2) Insert cold QFN standards with vacuum foil set Options: STH84-FC, SP84, TOS, MHIN, DINP, MHOUT, SMEMIN, SMEMOUT, SMU, SLFLX, PDS, PELD, ION-P, ION-B, PXRAY, DQC BQC, WMP, HOST, UPS, MIS Power supply: 208 to 230 VAC, ±10%, 47 Hz to 63 Hz Maximum standby voltage: 800 VA Maximum running voltage: 1100 VA (Maximum 2300 VA with hot air blower on) Compressed air inlet: 500 kPa: 5.0 Bar 850 kPa: 8.5 Bar PSI: 73 to 123 Average: 20 l/min Peak: 25 l/min Vacuum: Minimum: -75 kPa (-0.75 bar) / min Average: -11 PSI, 10 l/min Peak: 20 l/min Nitrogen (For bond blow): 180 kPa (1.8 Bar) 600 kPa (6 Bar) PSI: 26 to 87 2014 vintage.