二手 ESEC 3088iP #9091742 待售
網址複製成功！
單擊可縮放
ID: 9091742
優質的: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Maximum bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / Post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / Post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: Single / Multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Maximum wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2002 vintage.
ESEC 3088iP是一種全自動化、低容量、精密的線材粘合器,能夠產生可靠、高質量的粘合劑。它采用了一種專有的高速多步自動工藝，用於銀、金和鋁線的粘合。ESEC 3088I P的卓越設計能夠針對特定的組件,因此非常適合高密度組件和大型組件。3088 IP具有最高的粘結精度,可執行可重復、高速、精確的粘結條件。ESEC 3088 IP采用硬化鋼制成的四軸頭和先進的伺服控制止動設備,確保了粘結力的恒定和可重復性。頭部還設計了一個目標擬合系統，允許更精確地對準粘合墊，從而實現完美的粘合結果。3088iP還具有直觀的用戶界面、用戶友好的圖形操作單元以及速度能力高達每秒60個周期的運動控制機器。該工具易於學習和操作，用戶界面允許快速、輕松地進行設置和編程。圖形用戶界面提供錯誤代碼和視覺反饋,以便用戶可以隨時檢查計算機的狀態。3088I P非常適合各種制造環境,尤其是醫療設備、電氣/電子和汽車OEM。它是市場上最可靠、準確、最具成本效益的電線綁定器之一。該機設計可靠、靈活、產品高效。因此,它是要求苛刻、精細的焊接要求的理想選擇.
還沒有評論