二手 ESEC 3088iP #9091743 待售
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ID: 9091743
優質的: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Max. bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / Post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / Post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: Single / Multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Max. wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2002 vintage.
ESEC 3088iP是一種專為精密裝配應用自動化而設計的專用粘合機.ESEC 3088I P利用微型工作頭和可互換進紙器,提供了無與倫比的靈活性和對粘合過程中接合零件的精確控制。微型工作臺裝有一個2軸機器人,設計用於在裝配過程中對每個零件進行伺服控制。機器人能夠獨立移動每一部分,以及同步移動,這使得更快,更精確的鍵形成。此外,其靈活的設計允許輕松集成到現有的裝配線中。機器的金屬底座是一個平臺,可以安裝一組進紙器,每個進紙器最多可管理16個零件。此外,該機器還具有視覺系統,能夠識別部件。當合並到裝配過程中時,它會自動排序並為每個項目提供正確的零件。工作頭還具有精確的溫度和壓力控制功能,以確保對每個部件的條件進行優化。熱應用是可調節的,溫度範圍為200 °F至800 °F (93°C至427°C)。此外,還根據所用材料的類型對施加的壓力進行監測和調整。3088 IP是一個強大而多用途的鍵合器。適用於大小不一的項目,對零件提供多層次的控制。該機的溫壓控制、視覺系統、靈活的設計、可互換的進紙器,使得ESEC 3088 IP非常適合精確高效的精密組裝和粘合應用。
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