二手 K&S 8090 #9118886 待售

Large area wedge bonder Bond Head: Z-axis travel: 0.5" Z-axis resolution: 0.29um Theta travel resolution: 0.04"/pulse (total of 360° rotation) Wire size: Au 18.0 to 50.0um; Al: 25.4 to 50.0um Wire feed angle: 38°, 45°, 60°, 68° Bond speed rate: 5 wires per second (200 msec/bond) based on a 2.5mm (0.100") wire and clamp tear XY Table: Bondable area: 16.0" x 14.0" Resolution: 0.1um Bond placement accuracy: 2.75um Bond placement repeatability: 1.84um at 1 sigma Bond pitch: 70um at 3 sigma Vision System: ESI digital vision system with CCD camera pattern recognition system image rotation handling: +/-5° from taught image Tilt: +/-2° maximum Optics: Magnification: 2X (4.5 um/pixel) Working distance: 3.75", aperture f 5.7 Focus range: .5" (programmable focus) Material Handling Package Types: Ceramic substrates Snapstrates PC Boards Hybrids MCM Chip on flex Smart cards Chip on board Chip on glass RFID Lead frames BGA Automatic Material Handling Options: Material width: 2" to 10.5" Material length: 4" to 12" Boat handling Custom handling solutions Environmental Specifications: Temperature required: 15° to 30°C Humidity: 30-70% relative humidity (non-condensing) Atmospheric pressure: 540-810 mmHg Utilities: Voltage: 100 to 240VAC Frequency: 50-60Hz, 30A Power consumption: 2.5kVA nominal Air consumption: 65 psi minimum at 5cfm Factory communications: ethernet interface (EIA RS-2323-C) SEC I; RS-232 interface (EIA RS-232-C) SEC I Safety protocol: CE compliant 2001 & 2003 vintages.