二手 SHINKAWA ACB-3000 #9383146 待售

Wire bonders Target material Variety: Small signal transistors, diodes Lead frame Width: Universal 20-92mm, sealed 8-60 mm Length: Universal / Sealed common 95-262 mm Thickness: Universal 0.1-0.3 mm, sealed 0.1-0.5 mm Wire: Gold wire, Φ 15-38 μm (2" both flange spools used) Bonding method: Au wire bonding by thermosonic bonding Bond speed: 50 ms / 0.7mm wire Wire length: 4 mm (Maximum) Wire bend: Within 50 μm Bond area: X Bond Area: Universal / Sealed Common 66 mm (Camera offset 4-10 mm) Y Bond Area: Universal 80 mm, sealed 70 mm (Camera offset 6-12 mm) Bonding accuracy: ± 3.5 μm (± 4.5 μm when using forming gas) Load time: 3-150 ms (0.1 ms / Step) Bond load: 30-2940 mN (1 mN / Step) Search speed: 1-80 mm / s (0.1 mm / Step) Bonding position setting: Self-teaching method Roader / Unloader section Magazine size: Width 23-102 mm, length 110-265 mm Movement pitch in each direction: 10 μm / Step Transport method: Universal: Digital type clamp method Sealed: Digital pin feed method Feed pitch: 71 mm (5 μm / Step) Heat block heating range: Room temperature to 320°C Heating range when using forming gas: Room temperature to 300°C Compressed air: 0.5 MPa, 90 L / min Vacuum: -74kPa Forming gas: 200 kPa 10L / min Power supply: Single phase, 100VAC, 50/60 Hz 2011 vintage.