二手 TORAY FC 3000WS #9236573 待售

CS System Machine type: Semi-automatic Substrate size: 8"-12" (t=0.725-1 (mm)) Chip size: 3-20 mm long x 3-20 mm wide (t=0.05-1.0 mm) Chip type: 1-4 Chip loading method: 2"/4" Tray Chip orientation: Face down Cycle time: 6.0 Sec Alignment accuracy: ±2µm (X.Y) Bonding head type: Ceramic heater head Temperature: RT-450°C Overview Flip chip bonder Capable of stacking Can be used in various work processes Pillars: NCP NCF & Cu Features: Able to handle 12-inch wafer Able to achieve high accuracy (±2µm) Able to achieve the most appropriate gap Operating conditions: Floor strength: 14500 N/m² Atmosphere: Class 10,000 clean room Temperature: 20-26°C Humidity: 40-70 Vibration: 10 gal & below (-10 cm/s=0.1 m/A) Noise level: 70 dBA Utilities: Power requirements: 3 Phase, 200 ±10%, 50/60 Hz ± 1 Hz Ground: 100 Ω Lower resistance Electrical capacity: 19.1 kVA Connection size: Ring terminal M5 Air pressure source: Dry air: 0.49-1.0 MPa Connection size: Quick connect coupling: Tube, 12 mm Vacuum: Vacuum exhaust rate: 100 L/min Ultimate vacuum: -80 kPa Connection size: Quick connect coupling: Tube, 12 mm Vacuum source (For clean unit): Vacuum exhaust rate: 50 L/min Ultimate vacuum: -30 kPa Connection size: Quick connect coupling: Tube, 12 mm Nitrogen: 0.2 MPa Maximum 10 L/min Connection size: Quick connect coupling: Tube, 10 mm 2013 vintage.