二手 TPT HICKMANN HB 100 #293749279 待售

Wire bonder One bond head: Wedge, ball, ribbon, bump Touch screen interface, 21" Joystick: X-Y-Z Axis control Bond wire: 17-75 µm Dual camera system Crash prevention system Heater stage Top plate Pattern recognition option Speed: 1 Wire in 3 seconds Gold wire diameter: 17-75 µm Aluminium wire diameter: 17-75 µm Ribbon size: 25 x 250 µm Ultrasonic system: Transducer PLL Control, 63 kHz (110 kHz Option) Ultrasonic power: 0-10 W Bond time: 0-5 Sec Bond force: 10-200 cN Wire spool, 2" Clamp wire: 90° Depth: 14 mm Clamp movement: Up / down Temperature controller: 200°C Operation system: Windows PC 2021 vintage.