二手 AMAT / APPLIED MATERIALS eMax CT+ #293727706 待售

ID: 293727706
晶圓大小: 12"
優質的: 2008
Etcher, 12" Wafer cooling method: Wafer backside cooling by He gas Wafer holding mechanism: Electrostatic adsorption (Ceramic ESC) Chamber material: 6061-T6 Aluminium alloy Chamber evacuation: Exhaust with a backing pump Ultimate pressure: ≤ 1.3 x 10^-3 Pa Chamber leak amount: ≤ 266 mPa/min Pressure monitor: 1333 Pa Pressure measurement range: 0 to atmospheric pressure Pressure control: Throttle valve Pressure interlock: half atom switch Wall / Cathode temperature control: heat exchanger Chamber wall circulating water flow sensor Chamber cathode circulating water flow sensor Process Kit: RAISED Si / Si KALREZ 8575 Dry Clean Chamber vacuum seal EDWARDS STP-A1603P 1600L/S 2 Turbo Pump TOYOTA T100L Pump EBARA ESR80WN Pump MKS/ENI GHW12 RF Generator, 13.56 MHz, 1250 W MKS/ENI B-5002-0SPECTRUM RF Generator, 2 MHz, 5000 W ADVANCED ENERGY VHF2760 RF Generator, 60 MHz, 2700 W Endpoint specification: Eye-D / 200-800nm HV Power supply Chamber liner: Yttrium liner Gas panel specification: AERA PI-980 MFC Gas line connection: Single Line Drop (SLD) connection SLD Specification: TESCOM SLD Regulator ENTEGRIS SLD Filter CKD SLD Manual valve Gas / Size C4F6 / 100 SCCM CH2F2 / 100 SCCM CH3F / 100 SCCM C4F8 / 100 SCCM CF4 / 300 SCCM CHF3 / 300 SCCM O2 / 2000 SCCM O2 / 200 SCCM O2 / 20 SCCM Ar / 200 SCCM Ar / 2000 SCCM N2 / 200 SCCM (2) Load lock chambers: Slow pump / fast pump switchable Equipped with cool down function Chamber material: 6061-T6 Aluminum alloy Chamber pressure monitor: Convectron gauge Chamber vacuum sealing method: Viton O-Ring VAT Slit valve Ultimate pressure: ≤ 13.3 Pa (100mTorr) Chamber leak amount: ≤ 1.33 Pa (10mTorr/min) Transfer chamber: Chamber pressure control: Auto Pressure Control (APC) Chamber material: 6061-T6 Aluminum alloy Chamber pressure monitor: Convectron gauge Chamber vacuum sealing method: Viton O-Ring VAT Slit valve Wafer transfer robot Wafer blade: Dual blade Chamber evacuation Ultimate pressure: ≤ 13.3 Pa Chamber leak amount: ≤ 1.33 Pa Remote signal tower Factory interface: YASKAWA LM Track Atmospheric Transfer robot No Right and left side storage pod (3) Loadports 25-Wafers FOUP No ionizer E84 PIO Sensor E99 Carrier ID Wafer mapper Power supply: 200/208 V, 60 Hz 2008 vintage.
AMAT/APPLIED MATERIALS eMax CT+蝕刻器/asher是一種高性能設備,為多層沈積過程提供高級蝕刻和蝕刻回功能。它是微電子和光子學行業廣泛材料蝕刻和灰化的理想選擇。它通過使用高級傳感器、計算機輔助設計(CAD)和實時激光成像提供精確的過程控制。AMAT EMAX_CT+由設計用於大面積處理的七個工藝室組成。每個腔室都配有一個集成的光刻膠帶狀腔室,允許在一個會話中完成多個過程。晶圓通過自動卡式進紙裝置送至APPLIED MATERIALS E-MAX CT+工藝室。然後將其降低到位,與腔室中央的基板對齊。然後將腔室加熱並排出,以確保一致的灰化過程結果。根據用戶的設計為每個基板和層圖樣定制處理程序。然後將晶片暴露於脈沖紫外線激光器中,該激光器可以蝕刻光致抗蝕劑圖樣,而無需額外的化學物質或氣體。與傳統的濕蝕刻方法相比,這種激光輔助蝕刻工藝減少了時間和成本。EMAX_CT+還具有可選的高效電子束灰化器,能夠實現低總蝕刻停止層厚度和高蝕刻效率。電子束灰光機還利用先進的溫度控制設備,確保在正確的溫度下完成灰光化過程。AMAT/APPLIED MATERIALS EMAX_CT+還配備了先進的實時成像系統,用戶可以在處理晶片時監視其晶片。該單元不僅提供了有關該過程進展的信息,而且還可用於檢測蝕刻過程中可能發生的任何問題或不規則性,然後可以解決這些問題以改進結果。APPLICED MATERIALS eMax CT+蝕刻器/asher是一種先進的機器,它提供精確的過程控制和廣泛的功能,以確保對復雜的基板和層進行高質量的蝕刻和粉刷。其先進的激光成像工具、溫度控制、電子束灰燼,使其成為大型微電子和光子學應用的理想選擇。
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