二手 AMAT / APPLIED MATERIALS eMax CT+ #293727706 待售
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ID: 293727706
晶圓大小: 12"
優質的: 2008
Etcher, 12"
Wafer cooling method: Wafer backside cooling by He gas
Wafer holding mechanism: Electrostatic adsorption (Ceramic ESC)
Chamber material: 6061-T6 Aluminium alloy
Chamber evacuation: Exhaust with a backing pump
Ultimate pressure: ≤ 1.3 x 10^-3 Pa
Chamber leak amount: ≤ 266 mPa/min
Pressure monitor: 1333 Pa
Pressure measurement range: 0 to atmospheric pressure
Pressure control: Throttle valve
Pressure interlock: half atom switch
Wall / Cathode temperature control: heat exchanger
Chamber wall circulating water flow sensor
Chamber cathode circulating water flow sensor
Process Kit: RAISED Si / Si
KALREZ 8575 Dry Clean Chamber vacuum seal
EDWARDS STP-A1603P 1600L/S 2 Turbo Pump
TOYOTA T100L Pump
EBARA ESR80WN Pump
MKS/ENI GHW12 RF Generator, 13.56 MHz, 1250 W
MKS/ENI B-5002-0SPECTRUM RF Generator, 2 MHz, 5000 W
ADVANCED ENERGY VHF2760 RF Generator, 60 MHz, 2700 W
Endpoint specification: Eye-D / 200-800nm
HV Power supply
Chamber liner: Yttrium liner
Gas panel specification:
AERA PI-980 MFC
Gas line connection: Single Line Drop (SLD) connection
SLD Specification:
TESCOM SLD Regulator
ENTEGRIS SLD Filter
CKD SLD Manual valve
Gas / Size
C4F6 / 100 SCCM
CH2F2 / 100 SCCM
CH3F / 100 SCCM
C4F8 / 100 SCCM
CF4 / 300 SCCM
CHF3 / 300 SCCM
O2 / 2000 SCCM
O2 / 200 SCCM
O2 / 20 SCCM
Ar / 200 SCCM
Ar / 2000 SCCM
N2 / 200 SCCM
(2) Load lock chambers:
Slow pump / fast pump switchable
Equipped with cool down function
Chamber material: 6061-T6 Aluminum alloy
Chamber pressure monitor: Convectron gauge
Chamber vacuum sealing method: Viton O-Ring
VAT Slit valve
Ultimate pressure: ≤ 13.3 Pa (100mTorr)
Chamber leak amount: ≤ 1.33 Pa (10mTorr/min)
Transfer chamber:
Chamber pressure control: Auto Pressure Control (APC)
Chamber material: 6061-T6 Aluminum alloy
Chamber pressure monitor: Convectron gauge
Chamber vacuum sealing method: Viton O-Ring
VAT Slit valve
Wafer transfer robot
Wafer blade: Dual blade
Chamber evacuation
Ultimate pressure: ≤ 13.3 Pa
Chamber leak amount: ≤ 1.33 Pa
Remote signal tower
Factory interface:
YASKAWA LM Track Atmospheric Transfer robot
No Right and left side storage pod
(3) Loadports
25-Wafers FOUP
No ionizer
E84 PIO Sensor
E99 Carrier ID
Wafer mapper
Power supply: 200/208 V, 60 Hz
2008 vintage.
AMAT/APPLIED MATERIALS eMax CT+蝕刻器/asher是一種高性能設備,為多層沈積過程提供高級蝕刻和蝕刻回功能。它是微電子和光子學行業廣泛材料蝕刻和灰化的理想選擇。它通過使用高級傳感器、計算機輔助設計(CAD)和實時激光成像提供精確的過程控制。AMAT EMAX_CT+由設計用於大面積處理的七個工藝室組成。每個腔室都配有一個集成的光刻膠帶狀腔室,允許在一個會話中完成多個過程。晶圓通過自動卡式進紙裝置送至APPLIED MATERIALS E-MAX CT+工藝室。然後將其降低到位,與腔室中央的基板對齊。然後將腔室加熱並排出,以確保一致的灰化過程結果。根據用戶的設計為每個基板和層圖樣定制處理程序。然後將晶片暴露於脈沖紫外線激光器中,該激光器可以蝕刻光致抗蝕劑圖樣,而無需額外的化學物質或氣體。與傳統的濕蝕刻方法相比,這種激光輔助蝕刻工藝減少了時間和成本。EMAX_CT+還具有可選的高效電子束灰化器,能夠實現低總蝕刻停止層厚度和高蝕刻效率。電子束灰光機還利用先進的溫度控制設備,確保在正確的溫度下完成灰光化過程。AMAT/APPLIED MATERIALS EMAX_CT+還配備了先進的實時成像系統,用戶可以在處理晶片時監視其晶片。該單元不僅提供了有關該過程進展的信息,而且還可用於檢測蝕刻過程中可能發生的任何問題或不規則性,然後可以解決這些問題以改進結果。APPLICED MATERIALS eMax CT+蝕刻器/asher是一種先進的機器,它提供精確的過程控制和廣泛的功能,以確保對復雜的基板和層進行高質量的蝕刻和粉刷。其先進的激光成像工具、溫度控制、電子束灰燼,使其成為大型微電子和光子學應用的理想選擇。
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