二手 LAM RESEARCH / ONTRAK 2300 Exelan Flex #9119643 待售
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ID: 9119643
晶圓大小: 12"
優質的: 2008
Dielectric etcher, 12"
Process: OX
Software Revision: 1.7.2 SP2 HF4 CST2
Factory Automation: OHT PIO Sensor
AMHS: AMHS - OHT
Carrier: FOUP
Interface: 3 carrier stage
Online Connection: GEM / CIM JGJ
Hardware Interface : Ethernet 100Base-Tx
Utility Box: Air/AR2500(SMC), N2/SQ-420E
He/SQMICRO(VERIFLO)
Utility Box: Manual Valve : OGD20V-6RM-K / OGD10V-4RM-K (CKD)
Utility Box: Pressure Gauge : Bourdon Gauge
Platform Type: Version 2
UPS on system: Yes
Earth Leakage Breaker
Gas Box: Transport Module, GIB for 16 lines IGS GBX
Signal Tower: Red/Orange/Green/Blue
EMO: (2) Front, (6) Rear
Foreline: Not Heated
Sub-panel: Dual Drop Sub-panel
Interconnect Cables: TM to sub-panel, 50 ft
Pump to TCU: 50 ft
TCU to PM: 50 ft
PM to Pump Interconnect: 50 ft
Inter Lock: Gas Box Door
Inter Lock: External
Support Remote Units
Chiller Lower: ATS DEX 20A
Coolant: FC3283
Chiller Hose: 5/8 ID Braided Stainless Flex
RF Generator 2 MHz: Including RF Cable Tru-8743-07
RF Generator 27 MHz: Including RF Cable Tru-8743-07
RF Matcher, 2-27 MHz, DFC: RF Matcher, 2-27 MHz, DFC
Wafer ID Reader: WIDS Bottom Read
Carrier ID Reader: Asyst RF Advantag
EIM Server: EIM Server-One EIM server per 8 frames
Hardware Configuration
Process Ch.1,2,3,&4: 2300 Exelan Flex
Wafer Input Buffer Station: KIT,JIT<OPT<25 STATION BUFFER,300MM
Endpoint type: Optical Emission Spectroscopy
ESC type: Dual Zone/Flex Bipolar
Focus ring: Hot Edge, Si
High-conductance Wap Ring: 4 Ring
Gap: 2.34 cm
TMP: ALCATEL ATH,1600M
Dry Pump: IH600
Transfer Module Backing Pump: EPX with N2 Gas Module
Pressure Monitor: C/M ( Process Monitor ) 628B01TDE1B (MKS ) 1 Torr
Pressure Monitor: C/M ( Service Monitor ) 625A-14059 10 Torr
Pressure Monitor: C/M ( Foreline Monitor ) 625A-14059 10 Torr
Pressure Monitor: Absolute Pressure switch 75 Torr Lam P/N 768-093959-001
Pressure Monitor: Differential Pressure switch Activation 7mm Hg Vac Precision Sensors
P/N D48W-14
Upper Electrode: Heated Constant Temperature Control
Coolant Temp Monitor Kit: Coolant Temp Monitoring Kit for Top Plate & Lower Electrode
O-Rings: FluoroSilicone
Chamber Isolation Valve: Barrier Seal Door
Wafer Lift Mechanism: Direct Drive
Gas Position
Gas line 1-C4F8 50 sccm- AERA FC-D780CU
Gas line 2-O2 50 sccm- AERA FC-D780CU
Gas line 3-CHF3 100 sccm-AERA FC-D780CU
Gas line 4-CF4 200 sccm-AERA FC-D780CU
Gas line 5-30% O2/HE 100 sccm-AERA FC-D780CU
Gas line 6-C4F6 50 sccm- AERA FC-D780CU
Gas line 7-CH2F2 50 sccm-AERA FC-D780CU
Gas line 8-CF4 1000 sccm- AERA FC-D780CU
Gas line 9-H2 1500 sccm- AERA FC-D780CU
Gas line 10-AR 1000 sccm- AERA FC-D780CU
Gas line 11-N2 1000 sccm- AERA FC-D780CU
Gas line 12-O2 3000 sccm- AERA FC-D780CU
Tuning Gas: 30% O2/HE 50 sccm-AERA FC-D780CU
Gas Box Configuration
Purge: N2 (Process Grade N2)
Filter: Final gas : Mykrolis
Gas Box Inlet Option: Regulated Inlet Gas Panel
Non-standard PM/GB Feature: Enhanced gas box with 12 gas lines.
Gas Line Pressure Transducer: Actual pressure transducer WITHOUT digital readout
Regulator: SQMICRO (VERIFLO)
Piping: Single Contained Hasteloy Piping (Gas box to Final valve & Exhaust through Gas
box)
Final Pressure Switch: Absolute Pressure switch 400 torr Lam P/N 796-002833-003
Process Kit Config
Upper Outer Electrode: ASSY,ELCTD,OUTER,.18 STEP,300M
Upper Inner Electrode: ASSY,ELCTD,INNER,TC,300MM
Quartz WAP Ring: RING,WAP,Twist Lock,17IN,300MM
Quartz Generic Ring: RING,WAP,QTZ
Gas Feed Ring: Ring, Ptn, Gas Feed, Dual Zone
Dual Zone ESC: ESCASSY,DZ CLG,2 FNSH,300MM
ESC Bolts: ESC Bolts - 10-32 x1.125 lng, vented
Edge Ring Cover (In): COV,H/E RING,QTZ
Focus Cover Ring: B,FOCUS R CVR,DFC 300MM
Hot Edge Ring: RING,HOT EDGE,.195 HGT,SI,DUAL ZONE ESC
Edge Ring Cover (Out): RING,COVER,OUTER,GND
Fixed Coupling Ring: RING,TOP,ADJ,CPLG,2300,300MM,D
Ground Shield: SHLD,GND,300MM,2300
Liner: LINER/SPCR,EXT GND RING,2.0CM GAP
4-ringer Hangers: HANGER,4R,.025,.08-.08-.12-.12,.010FW
Retainer Spring: ASSY RETAINER SPRING
1/4-20 Peek Nut: NUT,1/4-20,VIRGIN PEEK
Peek Clocking Washer: WSHR,FL,PEEK,.263IDX.682ODX.06THK
Peek Sleeve: SLV,ADPTR,SLIP-ON,SELFCNTR,V PEEK
0.010" Peek Pad: PAD,R,CONF,.010THK.300MM
2008 vintage.
LAM RESEARCHY/ONTRAK 2300 Exelan Flex 蝕刻器/asher是一種靈活、低成本的解決方案,適用於各種蝕刻/灰分工藝。專為經濟高效、高性能、深蝕刻而設計;並且被設計為跨多個樣本的良好均勻性。Exelan Flex是一款多合一設備,由氣體輸送系統、兩個自動轉儲、一個控制器和一臺計算機控制的50 kHz射頻發電機組成。這種蝕刻器/asher具有獨特的一系列樹脂珠噴嘴設計,提供大面積覆蓋,甚至蝕刻大樣品。Exelan Flex在各類基材的蝕刻方面提供了出色的性能,深度蝕刻速率為1.5微米/分鐘,總蝕刻深度為50微米。此蝕刻器/asher配有一個控制單元,能夠為多種蝕刻類型提供可靠且可重復的蝕刻配置文件和配方執行。控制器為用戶提供了一系列的工藝優化參數,如工藝時間、功率、氣體壓力、自動電平等。用戶可以控制從脈沖模式的蝕刻配置文件(該模式提供低功率到高功率的蝕刻窗口)到恒定功率蝕刻配置文件。Exelan Flex還配備了氮基回填機,允許電子的平均自由程減少,並允許蝕刻所需的功率更少。回填工具還具有水平檢測探頭,以保持一致的氣體回填壓力。此外,還提供了一個低壓蝕刻速率監視器,用於指示實時蝕刻速率,並確保用戶能夠密切監視蝕刻過程的進度。Exelan Flex附有RF發電機、三腳架、autodrimpots和控制器,便於設置和使用。此資產還包含一個高級控制器模型,允許用戶編程和存儲多達64個蝕刻配方,以實現最大的靈活性。此外,該控制器還為用戶提供直觀的計算機界面和功能齊全的7英寸觸摸屏彩色顯示器,便於控制和監控。總體而言,ONTRAK 2300 Exelan Flex是一款經濟可靠的蝕刻器/asher,可為用戶提供靈活蝕刻過程的各種選項。該設備提供卓越的性能、可重復的蝕刻配置文件以及對一系列蝕刻應用程序的精密控制。
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