二手 MARCH FLEXTRAK-2MB #9185980 待售

ID: 9185980
優質的: 2014
Plasma cleaners Multiple inline plasma modules Uniform plasma treatment Dual lane boat handling Ideal for pre-flip-chip underfill (3) Axes symmetrical plasma chamber (2) Boats/plasma cycles Chamber maximum volume: 5.5 liters (338 in³) Plasma processes: Pre-flip chip underfill Pre-die attach Pre-wire bond Pre-mold steps Plasma contamination removal & cleaning: Fluorine & other halogens Metals & metal oxides Organic compounds Electrodes: Variable electrode configurations: Power-ground Ground-power Power-power Working area: 305W x 305D mm (12W x 12D in.) RF Power: Standard wattage: 600 W Frequency: 13.56 MHz Gas control: Flow volumes: 10, 25, 50, 100, 250 or 500 sccm (4) MFCs Control & interface: Software control: EPC with PC-Based touch screen interface Remote interface: SMEMA, SECS/GEM Vacuum pump: Standard dry pump: 16 cfm Optional wet pump: 19.5 cfm Optional purged dry pump: 16 cfm N2 Purged pump flow: (2) slm Process gas fitting size & type: 6.35 mm (0.25 in.) OD SWAGELOK Tube Process gas purity: Lab or electronic grade Process gas pressure: 0.69 bar (10 psig) min. to 1.03 bar (15 psig) max Purge gas fitting size & type: 6.35 mm (0.25 in.) OD SWAGELOK Tube Purge gas purity: Lab or electronic grade N2/CDA Purge gas pressure: 2 bar (30 psig) min to 6.9 bar (100 psig) max Pneumatic valves fitting size & type: 6.35 mm (0.25 in.) OD SWAGELOK Tube Pneumatic gas purity: CDA Oil free Dewpoint: ≤7°C (45°F) Particulate size: <5μm Pneumatic gas pressure: 3.45 bar (50 psig) min to 6.89 bar (100 psig) max Exhaust: 25.4 mm (1 in.) OD Pipe flange SEMI: E10, S2/S8 (EH&S/Ergonomics) Gas generators: Nitrogen, hydrogen (requires additional non-optional hardware) Chiller Scrubber Power supply: 220 VAC, 15A, 50/60 Hz, 1-Phase, 12 AWG, 3-Wire CE Marked 2014 vintage.
MARCH FLEXTRAK-2MB是一種蝕刻器/asher,設計用於半導體行業內的潔凈室生產環境。它能夠以5微米的分辨率將光刻膠圖像再現到半導體晶片或其他基板上。與其他可用的蝕刻解決方案相比,這種最先進的蝕刻器/蝕刻器具有許多獨特的優勢。MARCH FLEXTRAK 2MB具有14英寸的大工作區域,允許廣泛的光刻加工操作。它支持隨機和均勻陣列,包括線形、矩形、圓和橢圓。這樣可以確保圖像的制作具有很高的準確性和精確度。FLEXTRAK-2MB配備了先進的可編程邏輯電路,便於修改其蝕刻參數。這意味著蝕刻過程可以根據給定應用程序的特定要求進行調整。通過調整蝕刻時間、分辨率、功率等參數,可以實現卓越的重復性、均勻性和圖像質量。FLEXTRAK 2MB提供了許多安全功能。為確保操作過程中的最大安全,該裝置配備了緊急停止能力、用於處理晶片的自動編子系統以及用於監視的背光安全玻璃。蝕刻器/asher還具有獨特的冷卻系統,可保護細膩晶片的表面不會過熱。MARCH FLEXTRAK-2MB提供了廣泛的應用程序編程選項,使光刻蝕刻過程易於自動化。用戶可以利用各種專有軟件程序來提高吞吐量和流程質量,同時還可以利用MARCH FLEXTRAK 2MB的高級功能。最後,FLEXTRAK-2MB設計的功耗低,有助於減少對環境的影響。這使得它非常適合研究和生產環境,在這些環境中,能效是優先考慮的。總之,FLEXTRAK 2MB是任何需要高分辨率、精確度和重復性的蝕刻操作的理想選擇。憑借其先進的功能和低功耗,它是潔凈室生產、研究或其他行業應用的理想選擇。
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