二手 SEZ / LAM RESEARCH DV-38 #9098878 待售

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ID: 9098878
晶圓大小: 12"
優質的: 2006
Etchers, 12" Power: 400VAC / 3P+N , 63A, 50 / 60Hz General data Equipment platform: (8) Chambers Handling: Sankyo frontside (1) Chemistry Cassette loading: Operator: Yes Overhead transport system (OHT): Yes Fab layout: Through the wall: Yes Front machine section: Front frame: (3) Load ports Front section: Robot & controller Robot end effector Main PC Front FFU Buffer station Rear section: General data for chemical blend module (CBM) Material: FM-complaint (Mat.: PVDF) Door hinges: Left Position of CCC, UPS for CCC and hand shake box: Left Position of monitor & keyboard: Left Position of the CBM Type B: Seperate CBM Type B connected to system: DV38F Rear section: ECO FFU Control cabinet Process section Left: PSL 1: Process chamber Chuck Spindle unit Dispenser motors PSL 2: Process chamber chuck Spindle unit Dispenser motors PSL 3: Process chamber chuck Spindle unit Dispenser motors PSL 4: Process chamber chuck Spindle unit Dispenser motors Gas facility box: Regulators & MFC's CDS: Pump,valves, chemistry lines General data for chemical blend module (CBM): Material: FM-complaint(Mat.: PVDF) Door hinges: Right Position of CCC, UPS for CCC and hand shake box: Right Position of monitor & keyboard: Right Position of the CBM Type B: Seperate CBM Type B connected to system: DV38F Process Section Right: PSR 1: Process chamber Chuck Spindle unit Dispenser motors PSR 2: Process chamber chuck Spindle unit Dispenser motors PSR 3: Process chamber chuck Spindle unit Dispenser motors PSR 4: Process chamber chuck Spindle unit Dispenser motors 2006-2007 vintages.
SEZ/LAM RESEARCH DV-38是一款耐用且可靠的蝕刻和灰化器,可提供一致的高質量加工結果。該設備有單室或雙室配置,具有自動或手動晶片安裝功能。該系統包括由高速直線電動機驅動的三英寸晶圓卡盤。卡盤能夠進行水平、垂直和雙向移動,並且該單元提供優化的蝕刻/灰化輪廓,晶圓到腔室間隙為0.005「-0.400」。SEZ DV-38集成了數字晶圓定位機(DWPS)和閉環伺服工具,用於精確的晶圓定位。它擁有集成的過程控制和監控資產,其中包括晶圓溫度測量、腔室壓力和配方管理。該型號配備了可選的溫度和流量控制器,允許精確的處理條件和嚴格的過程參數控制。LAM RESEARCH DV-38旨在快速、準確地處理標準晶片和探索性晶片。直觀的操作員界面允許快速設置和操作,設備設計為直接訪問過程參數。該系統還被設計為可擴展的,能夠服務於各種外圍設備,如抵抗帶和平面化系統。提供可選的高壓力和低壓力配置,允許對高速率過程超壓10 torr。DV-38用於半導體晶圓加工,能夠提供高性能的蝕刻和灰化工藝。它為實驗處理和過程開發提供了一個可靠的平臺,能夠以批處理或連續處理模式運行。該設備易於安裝和維護,能夠提供一致且可重復的結果。
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