二手 SEZ / LAM RESEARCH DV-38 #9098878 待售
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ID: 9098878
晶圓大小: 12"
優質的: 2006
Etchers, 12"
Power: 400VAC / 3P+N , 63A, 50 / 60Hz
General data
Equipment platform:
(8) Chambers
Handling: Sankyo frontside
(1) Chemistry
Cassette loading:
Operator: Yes
Overhead transport system (OHT): Yes
Fab layout:
Through the wall: Yes
Front machine section:
Front frame:
(3) Load ports
Front section:
Robot & controller
Robot end effector
Main PC
Front FFU
Buffer station
Rear section:
General data for chemical blend module (CBM)
Material: FM-complaint (Mat.: PVDF)
Door hinges: Left
Position of CCC, UPS for CCC and hand shake box: Left
Position of monitor & keyboard: Left
Position of the CBM Type B: Seperate
CBM Type B connected to system: DV38F
Rear section:
ECO
FFU
Control cabinet
Process section Left:
PSL 1:
Process chamber
Chuck
Spindle unit
Dispenser motors
PSL 2:
Process chamber
chuck
Spindle unit
Dispenser motors
PSL 3:
Process chamber
chuck
Spindle unit
Dispenser motors
PSL 4:
Process chamber
chuck
Spindle unit
Dispenser motors
Gas facility box:
Regulators & MFC's
CDS:
Pump,valves, chemistry lines
General data for chemical blend module (CBM):
Material: FM-complaint(Mat.: PVDF)
Door hinges: Right
Position of CCC, UPS for CCC and hand shake box: Right
Position of monitor & keyboard: Right
Position of the CBM Type B: Seperate
CBM Type B connected to system: DV38F
Process Section Right:
PSR 1:
Process chamber
Chuck
Spindle unit
Dispenser motors
PSR 2:
Process chamber
chuck
Spindle unit
Dispenser motors
PSR 3:
Process chamber
chuck
Spindle unit
Dispenser motors
PSR 4:
Process chamber
chuck
Spindle unit
Dispenser motors
2006-2007 vintages.
SEZ/LAM RESEARCH DV-38是一款耐用且可靠的蝕刻和灰化器,可提供一致的高質量加工結果。該設備有單室或雙室配置,具有自動或手動晶片安裝功能。該系統包括由高速直線電動機驅動的三英寸晶圓卡盤。卡盤能夠進行水平、垂直和雙向移動,並且該單元提供優化的蝕刻/灰化輪廓,晶圓到腔室間隙為0.005「-0.400」。SEZ DV-38集成了數字晶圓定位機(DWPS)和閉環伺服工具,用於精確的晶圓定位。它擁有集成的過程控制和監控資產,其中包括晶圓溫度測量、腔室壓力和配方管理。該型號配備了可選的溫度和流量控制器,允許精確的處理條件和嚴格的過程參數控制。LAM RESEARCH DV-38旨在快速、準確地處理標準晶片和探索性晶片。直觀的操作員界面允許快速設置和操作,設備設計為直接訪問過程參數。該系統還被設計為可擴展的,能夠服務於各種外圍設備,如抵抗帶和平面化系統。提供可選的高壓力和低壓力配置,允許對高速率過程超壓10 torr。DV-38用於半導體晶圓加工,能夠提供高性能的蝕刻和灰化工藝。它為實驗處理和過程開發提供了一個可靠的平臺,能夠以批處理或連續處理模式運行。該設備易於安裝和維護,能夠提供一致且可重復的結果。
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