二手 STS / SPTS Multiplex ICP #9277059 待售

ID: 9277059
晶圓大小: 6"
Reactive Ion Etcher (RIE), 6" Process: BOSCH Type: Automatic Multiplex ASE-HR, 6” EBARA A30W Dry pump EBARA AAL10 Dry pump No chiller Chamber: BOSCH Process Gas line: MILLIPORE FC2901 4V Viton 600SF6/300C4F8/100N2/100N2 ENI ACG3B-06 / AS310424 Power supply: 300 W, 13.56 MHz RF Supply / Matching unit: ENI ACG3B-06 / AS310424 Power supply: 300 W, 13.56 MHz ADVANCED ENERGY MN3150011-000N SE / AS306817 Power supply: 500 W, 400 KHz Chamber substrate, 6" TRIPOD Mechanical wafer clamp electrode With He backside cooling Process chamber: ICP V2 Unified ISO250 With 100 adapter LEYBOLD MAG2000CT Turbo pump EBARA A30W Dry pump Chamber externals Includes: EDWARDS D14641000 Gauge SMC ZSE6B Pressure switches MKS E27B17DD5B NW16 Bypass pump line Gas box Lower electrode: ICP WTC TRIPOD Lift Substrate clamping / Platen: ICP WTC TRIPOD, 6" Includes: MKS 750B11T 10T MKS 1179A51CR1BV-S: 50 sccm Upper electrode with aperture mounting Upper electrode source: ICP Balun Upper RF enclosure / MU: Balun, 1 kW Chamber lid: ICP Heated RF Generators: Upper: ENI ACG3B-06 / AS310424 Power supply: 300 W, 13.56 MHz Lower: ADVANCED ENERGY MN3150011-000N SE / AS306817 Power supply: 500 W, 400 KHz TTI / THURLBY THANDAR INSTRUMENTS TGP110 Pulse generator Frequency: 10 MHz Bypass pumping: Automatic NW16 Heated foreline: ICP NW40 Pumping line Gasbox: Minimum (4) lines with PFC1 module EBARA A30W Dry pump Gases / MFC Size (sccm) / Seal type / Gas type C4F8 / 300 sccm / Viton / Clean SF6 / 600 sccm / Viton / Clean N2 / 100 sccm / Viton / Clean N2 / 100 sccm / Viton / Clean Loadlock: Carousel vacuum loadlock Carousel loadlock parts: (2) Substrates, 6" EBARA AAL10 Dry pump Power supply: 208 V, 3 Phase, 60 Hz.
STS/SPTS Multiplex ICP,又稱同步分時並行分時多路復用離子蝕刻Asher,是一種專門的蝕刻器和asher,用於精確蝕刻和灰分微和納米尺度模式。可用於修改小而復雜形狀的微觀結構,並用於MEMS、微流體、3D打印等應用。STS Multiplex ICP具有高功率射頻發生器,產生高頻、高功率離子流。這些離子在材料去除過程中精確蝕刻掉材料,而ICP的車載氣體輸送設備確保氣流在整個過程中均勻分布。此外,ICP高效的計算機控制定時系統使蝕刻和灰化過程保持同步,防止重復過程對設備造成任何中斷或損壞。SPTS Multiplex ICP還提供了對沈積厚度和均勻性的精確控制。離子流可以調整到需要沈積的特定區域,同時還提供了根據需要調整流速、離子密度和流速的靈活性。這為用戶提供了無與倫比的精確度,使他們能夠創建復雜的模式,幾乎不會受到汙染。Multiplex ICP的計算機控制軟件允許用戶根據自己的特定應用需求對流程參數進行編程。這使用戶能夠自定義其蝕刻和灰化過程,以滿足其項目的確切要求。軟件還跟蹤機器性能,並允許用戶管理其流程數據,確保每個項目成功完成。總之,STS/SPTS Multiplex ICP是一種專門的蝕刻和灰化器,它為蝕刻和灰化微量和納米級圖樣提供了卓越的精度和控制。它是研究人員和工程師尋找可靠和先進的蝕刻和灰化解決方案的理想工具。
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