二手 CANON MPA 600 FA #9060105 待售

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ID: 9060105
Projection aligner, 6" Slit: 1.6mm Includes: Illumination power check meter, 7” Focus tilt mask, 7” DR Mask Projection system: Projection mirror: Total reflection UM02 Magnification: 1x Image size: Stationary: Arcuate image 150 mm (L) x 1.6 to 2.0 mm (W), with radius of 95 mm Scanning: Φ6 (150 mm) Over entire surface, excluding that under (3) disk claws Magnification: 1x Effective F number: Fe 3.5 Wavelengths used: Printing (UV): 365 nm (i-line), 405 nm (h-line) & 436 nm (g-line) Manual alignment: E-line (546 nm) & orange light Auto alignment: 633 nm (He-Ne Gas laser) Illuminator: Light source: USHIO ELECTRIC USHY-2002MA 2 kW Super-high-pressure mercury lamp Illumination range: Length: 150 mm Width: 1.6 to 2.0 mm Radius: 95 mm Illumination uniformity: Within ±3% Effective light source: σ = 0.7, σ = 0.6, σ = 0.5 Exposure: Scanning speed: Φ5" (Φ125 mm) Setting range: 5.0 - 150.0 sec (for 5" wafer) Setting units: Uniform 0.1 sec increments Scanning mechanism: Feed / Control methods Closed loop method with DC servo motor drive Scanning speed: 5.0 to 150.0 sec (25 mm/sec-0.83 mm/sec) for 5" wafer Carriage position setting: Setting range: -75 mm to 75 mm Increment: 0.01 mm Setting accuracy: ±10 /µm Alignment scope: Objective lens: 10x, NA 0.2 Eyepiece: 10x, 15x Erector lens: 1x, 2x, 3x Low-magnification lens: 0.3x Distance between objective lenses: 30 to 109.6 mm (Traveling simultaneously on both sides of center position) Setting range of objective lens distance: 30.00 to 109.6 mm in 0.02 mm increments Focusing travel (both fields of view): ±2 mm Auto alignment: Laser beam scanning Light source: He-Ne Gas laser (633 nm), polarized type 5 mW Dedicated patterns are used for auto alignment Offset control: Read/write possible in range of 0 to 7.9 /µm Tolerance setting: 0.25 (0.15) /µm, 0.5µm, 1 µm Auto alignment time: Within 7 sec Observation in auto alignment mode possible Auto feeder: Auto/manual switching: Automatic / Manual wafer feed selectable Feed method: Belt & auto hand Wafer size: 4"-6" Applicable carrier: FLUOROWARE Type carrier: Standard Capacity: 25 wafers Pitch: 3/16" Projection system focusing: Focus adjustment: ±1.5 mm Travel amount obtained by one rotation of knob: 10 µm Power supply: MPA-600FA: 200 VAC, 3Φ, 6 kVA, 50/60 Hz Air supply unit: 200 VAC, 3Φ, 8 kVA, 50/60 Hz.
CANON MPA 600 FA是CANON開發的用於晶圓級封裝的高精度掩模對準器。它是一種功能齊全的儀器,具有多種特性和功能,非常適合用於各種設備制造應用程序。佳能MPA600FA利用高分辨率投影對準設備,利用紅外光精確投射和對準面罩圖案到晶圓表面。該系統可進行精細的位置調整,並有助於將掩模圖案精確且可重復地對準晶片表面。MPA-600FA還配備了一個大功率激光退火裝置,允許用戶為各種目的對晶片的選定區域進行熱處理。這臺機器能夠在整個晶片上產生均勻的熱量,確保均勻的表面形成,並防止由於溫度相關的問題而導致設備故障。MPA 600 FA配備了定制設計的金屬面罩支架,使用戶能夠在對準時將金屬面罩精確定位並連接到晶片上。它還具有自動光學步進器,大大提高了對準過程的速度和精度。CANON MPA 600FA還包括一個自動化控制工具,使儀器易於操作和管理。該資產包括一個用戶友好的圖形界面,允許用戶在沒有任何事先培訓的情況下執行各種操作,如選擇參數或控制掩碼。CANON MPA-600 FA還提供了多種安全功能來保護用戶和設備,包括在操作異常時自動關閉模型和內置除塵器,以防止灰塵和碎屑進入儀器。CANON MPA-600FA是需要高精度遮罩對準儀表的半導體器件制造商的絕佳選擇。憑借其強大的功能、精確的對準設備和先進的安全功能,MPA-600 FA是在晶圓級封裝應用中實現最佳效果的理想工具。
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