二手 EVG / EV GROUP 6200 #9238655 待售

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ID: 9238655
晶圓大小: 4"-8"
優質的: 2017
Semi automated double side mask aligner, 4"-8" Manual handling High resolution top and bottom side split field microscopes Constant power and intensity dose mode Wafer thickness: 0.1 - 10 mm (For top side configuration only) Semi automatic loading with mechanical pre-alignment on chuck Quick change of mask and chuck Storage rack for up to (5) aligner tools PC Controlled operating environment Graphical User Interface (GUI) for visualization User interface including keyboard and monitor Lamp: 1000 W Hg Objective: 10x Standard exposure modes: Vacuum contact Proximity Hard Soft 500 W-1000 W Light source: Lamp house for 500 W / 1000 W Hg or HgXe lamps Supports various optical sets Including light integrator for accurate lamp control Light uniformity better than ±3% for 6" wafer and ±4% for 8"wafer Adjustment plate for UV probes with diameter 44.5 mm and maximum height 16 mm Optical set for wave length range: 350 - 450 nm Field lens, 8" Dielectric mirror Fly's eye lens Alignment stage: Fully motorized X, Y theta and Z alignment stage via three axis joystick With DC motor controllers for cursor key fine alignment Automatic wedge compensation system designed for optimized print gap control Adjustable WEC and exposure contact force Automatic alignment for top and / or bottom side includes COGNEX patmax: Vector based image recognition Storage of trained mask and substrate patterns on hard disk Comply with user definable alignment marks for top and bottom side alignment Key identification feature for multi layer alignment key design For scaled (Over / under etched) alignment keys Easy operation with menu assisted training of mask and wafer alignment marks Alignment results are dependent upon process conditions and material properties Nano align technology package: Increases EVG aligner microscope resolution by factor ~2 (for improvement of alignment results or extended depth of focus) Improved image quality due to 100 % digital signal processing Enhanced digital zoom capabilities Supports cross hair and overlay mode for standard backside alignment processes Mask holder for 9 x 9" masks with loading frame: According to EVG standard design: Round opening for exposure of wafers Hard coated and lapped surface finish for mask contact area Bottom loading system with automated vacuum transfer Vacuum contact wafer chuck 8": According to EVG standard design: For manual wafer loading with pre-alignment aid Hard coated and lapped surface finish for wafer contact area With Windows for bottom side alignment Supports proximity soft hard and vacuum contact exposure Seal for vacuum contact Supports vacuum contact with substrates up to 1.5 mm thickness Mask holder for 7 x 7" masks with loading frame: According to EVG standard design Round opening for exposure of wafers Hard coated and lapped surface finish for mask contact area Bottom loading system with automated vacuum transfer Mask holder for 5 x 5" masks with loading frame: According to EVG standard design Round opening for exposure of wafers Hard coated and lapped surface finish for mask contact area Bottom loading system with automated vacuum transfer Vacuum contact wafer chuck 4"-6": For manual wafer loading with pre-alignment aid Hard coated and lapped surface finish for wafer contact area With Windows for bottom side alignment Supports proximity soft hard and vacuum contact exposure Seal for vacuum contact Supports vacuum contact with substrates up to 1.5 mm thickness Exposure uniformity: Wafer: Up to < ±3% across, 6" Up to < ±4% across, 8" Top side microscope: Motorized split field microscopes for alignment in visible light With high resolution CCD cameras for top and bottom side Travel range of top side microscope: X: 30 (optional 8) - 200 mm Y: ± 75 mm Bottom side microscope: Motorized split field microscopes for alignment in visible light With high resolution CCD cameras Travel range of bottom side microscope: X: 30 (8) mm - 154 mm Y: ± 12 mm Spare parts: Qty Description (3) Tension springs (4) Tension springs d1, 4/De15, 4/Lo49/R0,6 (5) O-Rings 3x2 (5) O-Rings 2x1 (1) Lip seal, 6" (2) Lip seals, 8" (1) Lip seal, 4" (2) Micro switches SPDT 1p (1) Temperature switch (2) Rotary switches CA4 A722-600-FS4 (5) G-fuse 7000135 T4A 250V 5x20 (5) G-fuse 7000135 T2.5A 250V 5x20 (1) Pneumatic cylinder (2) Micro switches SPDT 1p (1) Ellipsoid mirror 8'' EOF 390-4-AF (1) Motor MGK 1616E012S /900:1 16/5 M16/5 09 (1) Cutting insert (1) Power supply (3) Pneumatic cylinders (2) Pneumatic cylinders DSNU-16-40-P-A (1) Power supply 100W, 12 VDC TXL-12S (1) MGK 1524E012SR +15/8-485: 1 +IE2-512 (2) Light barriers (1) Trackball 816TC712 11 0 USB (2) Couplings WAC 10-3-3 (1) MGK 2342S024CR+23/1-14:1+IE2-16 (1) Linear measurement system DIT30.73 0.5 um (4) Pressure sensors (2) Light barriers (1) Power supply 24 VDC, 230 W (2) Light barriers (2) Proximity switches (2) Proximity switches (1) Adjustment unit 9POI Sub-D mate l=15 cm (1) Suction cup unit WEC (2) Thermo couple units TKI 05/25 Type K (1) Timing belt 6 T2, 5-200 (4) Operation manuals 2017 vintage.
EVG/EV GROUP 6200是一種蒙版對準器,是一種先進的設備,設計用於光刻行業中使用的標線或蒙版的對準、曝光和開發。此計算機是通用的,配置為滿足用戶的特定需求。它是制造電路、元件和零件等用於先進半導體應用的微加工工藝的理想工具。EVG 6200具有高分辨率的圖樣投影儀,可以準確地將圖樣投射到掩模最陡峭的側面。這種投影是由於電子面罩對齊器而實現的,它使用戶能夠準確地將面罩對齊基板,確保它能夠精確、精確地配合。高分辨率投影也保證了高畫質。EV GROUP 6200提供了許多其他功能,以確保制造質量和安全性能。例如,該系統采用獨特的「集成成像技術」,它結合了許多光學、機械、電氣和軟件組件。它還包括一個自動對準器,它不斷校準投影和光學元件,確保最大精度。6200配備了高級操作模塊,用戶可以控制口罩的位置、方向和傾斜。它還配備了機械臂,用於面罩和基板的精確和連續對準。這樣可以精確地暴露口罩,並確保結果與印刷電路板完全一致。此外,EVG/EV GROUP 6200還具有多種安全功能,如潔凈室空氣單元、自動卡紙檢測、自動防止過度暴露以及其他提高機器準確性和安全性的保護機制。為支持其前沿性能,掩碼對齊器具有基於Windows的人機界面、靈活的極性反演範圍和全面的故障報告工具。綜上所述,EVG 6200是一款高級且精密的掩碼對齊器,使用戶能夠以最高的精度和精確度對齊掩碼。此資產提供卓越的準確性和精確度、精確控制、安全功能以及易於使用的用戶界面。對於需要精密微加工的人來說,它是一個很好的工具。
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