二手 EVG / EV GROUP 620NT #9191006 待售

ID: 9191006
晶圓大小: 6"
優質的: 2011
Automated double side lithography system, 6" Exposure modes: Hard Soft Vacuum contact Proximity Separation distance: 0-300 μm adjustable Wafer thickness: 0.1-10 mm (For top side configuration only) Semi automatic loading Mechanical pre-alignment on chuck Quick change of mask and chuck Flat screen for operator interface and alignment functions, 17" PC Controlled operating environment Granite base frame construction Active vibration isolation Password protected access levels: Operator Engineer Maintenance Back side alignment of wafers: Mounted carrier Deep etched back side alignment marks Supports measuring of structures Cross hair distance Resolution with 10x objectives: 1.1 μm Light source NUV: 500 W-1000 W Lamp house: 350 W / 500 W Hg lamp Optical sets in NUV range: 280-450 nm Optimized parallel light: ±2%, 4" ±3%, 6" UV Probes: Diameter: 44.5 mm Height: 16 mm Optical set for wave length: 350 nm-450 nm Light sources: NUV / DUV Field lens, 6" Dielectric mirror Fly's eye lens Alignment stage fully motorized Fully motorized X, Y, Theta & Z alignment stage With DC motor controllers Automatic wedge compensation system Optimized print gap control WEC Contact force: 0.5-40 N adjustable Top side microscope: Motorized split field microscopes in visible light With high resolution CCD cameras for top and bottom side Travel range: X: 30 (8)-150 mm Y: -70 / +70 mm Storage of objective positions Digital zoom: 2x / 4x Image magnification for fine alignment (2) Objectives: 10x (3.6x - 20x) Bottom side microscope: Motorized split field microscopes in visible light With high resolution CCD cameras Bottom side alignment Travel range: X: 68 (48) mm-150 mm Y: ± 12 mm Digital zoom: 2x / 4x Image magnification fine alignment with objectives (2) Objectives: 10x (3.6x - 20x) Rack unit EVG 620 mask aligner systems: Integrates EVG 620 desktop alignment system Vibration isolated Robotic auto load system Robot module for auto load cassette to cassette: Size: 4"-6" With non contact optical prealigner for wafers With flat and notch Standard: With vacuum from bottom side Robot control fully integrated to EVG 620 Graphical User Interface (GUI) Cassette station: Send Receive Standby (5) Cassette stations: Cassette present sensor Cassette empty sensor Semi standard wafer cassette sizes IR Light source: Bottom side objectives IR-Transparent substrates Bottom side microscope: IR Light source manipulation IR Alignment of wafer to mask using top side microscope IR Lamp position with recipe Active cooled IR light source Manual and automatic alignment processes Usage of special IR objectives on topside microscope Reduces bottom side microscope travel range Pick and place handling option: Programmable send / receive / standby cassette configurations Up to 75 wafer processing on handling modules: (3) Cassette stations No operator intervention 125 wafer processing on handling modules: With (5) cassette stations No operator intervention Hard UV-Nano imprinting: UV-NIL Processes with hard stamps (Quartz glass) Top chuck, 1" stamps (in diameter) Bottom chuck: Microscope slides: 10 x 10 mm 15 x 15 mm 25 x 75 mm Diameter: 2"-4" Soft UV-NIL and μ-CP: PDMS Stamp to be mounted on glass back plane (5" square) Bottom chuck, 4" Loading frame, 1" Stamp Contact free wedge compensation with spacers Adjustable contact force for vacuum printing process Top chuck with quartz windows for UV curing of resist Optical alignment of stamp and substrate in two steps: Separation of stamp and substrate: Rough alignment Soft contact of stamp: Fine alignment Vacuum contact: 100 - 850 mbar Mask holder for 5" x 5" masks with loading frame Bottom loading system with automated vacuum transfer Hard coated & lapped surface finish for mask contact area Mask holder for 7" x 7" masks with loading frame Bottom loading system with automated vacuum transfer Hard coated & lapped surface finish for mask contact area Universal wafer chuck, 4" With spacers For automated handling Hard coated & lapped surface finish for wafer contact area Universal wafer chuck, 6" With spacers For automated handling Hard coated & lapped surface finish for wafer contact area Manual filter changing unit without filter / carrier Includes: Bond alignment Signal tower Does not include cassette load 2011 vintage.
EVG/EV GROUP 620NT是一種掩模對齊器,旨在支持半導體制造等行業的先進電離輻射(電子束)和光學光刻要求。其對齊器提供精確的光掩模圖樣與晶圓表面對齊,確保了設備特征的精確復制和性能的均勻性。EVG 620NT具有先進的雙梁設備,能夠定位和定位各種模式,並具有亞像素精度和巖石-固體穩定性。它的廣角光學提供了無與倫比的視場,並且可以一口氣對齊大面積的圖案。此外,該系統還提供了一個高效的工作環境,具有現代化的GUI和幾種易於操作的工具,包括用於處理掩碼和晶圓的機器人技術。EVG EV GROUP 620NT的性能因其高分辨率成像單元而進一步提升,該單元采用12k x 12k像素CCD區域掃描相機,使用納米級分辨率捕捉圖像。一個集成的微米級自動級能夠提供嚴密的配準精度和可重復性,因此模式可以定位在一個個位數的納米精度在整個視野。620NT使用可擴展的模塊化組件構建,用戶可以在需要時輕松升級或修改設備。創新的體系結構和專用的數據通信線路提供極快的成像速度,掃描速度高達每秒1000萬像素。為了跟上設備制造的快速變化,可以使用可升級的硬件平臺進一步改進成像機。EVG/EV GROUP 620NT對於那些參與創建和復制高級半導體特性這一艱巨任務的人來說是一個強大而可靠的工具。它結合了尖端光學、高精度成像、堅巖平臺和可升級硬件,確保了高效的工作體驗和設備的統一、無缺陷的性能。
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