二手 EVG / EV GROUP IQ #9138247 待售
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ID: 9138247
Nano imprint lithography system, 8"
Top-side alignment only
Manual load
Wiring removal
Basic unit 200mm:
Flat screen:17"
Self Diagnostics during machine startup
Automatic initialization:All motors,encoders,limit switches,sensors and pneumatic
Remote diagnostics
Quick change:Stamp holders and imprint chucks
EC declaration of conformity
PC controlled operating environment
Solid state drive and hard drive
Earthquake protection device
Software:
MS-windows
Process software ,processing and diagnostics
Automated recording
Storage of files in hard disk or network
Password protected
Internal wedge compensation unit:
Automatic wedge compensation
Motorized alignment stage:
X,Y,T alignment
High resolution alignment
(3) axis joystick
Reinforced stage drives
Top side microscope:
Fully motorized split field microscope
Travel range X: 90-200mm*
Travel range Y: -10-100mm*
(3) axis joystick control
Display and storage of microscope position
(2) Objective 5x
Automatic alignment for top and / or bottom side:
Vision system
Storage of stamp and patterns on hard disk
Top and bottom side alignment
Stamp and wafer alignment marks
Large gap alignment capability:
Alignment at substrate separations >50um
Alignment during UV molding
Alignment during UV bonding
Manual wafer loading capability:
Motorized swivel arm
software integrated
(2kg) Manual substrate loading/unloading
Wafer loading trays
Wafer loading frame for 200mm wafers/stamps:
Manual wafer loading on chuck
process integrated substrate vacuum fixing
Notch or flat with pins
External wafer thickness measurement station:
(3) Point wafer thickness detection
Contact less imprinting
(3) Sensors adjustable range :150-200mm
Designed Warped substrate :1mm
Manual Operation
Sensors range: up to 10mm
manual system only
500W-1000W Light source NUV:
Lamp house :500w or 1000w
NUV range:280-450nm
Optimized parallel Light:+/-3% on 150mm and +/-4% on 200mm
Adjustable plate: diameter 44.5mm and max.height 16mm
Optical set for wave length range 350-450nm:
NUV and DUV light sources
Field lens:200mm
Dielectric mirror
Fly's eye lens
Stamp holder for 200mm UV hybrid lens molding:
UV molding automated de-embossing function
Hard coat surface finish
Quartz backplane
Imprint chuck for 200mm wafers/stamps:
Bottom chuck: 200mm wafer
Top side alignment
Hard coat surface finish
Manual and automated loading
Software for UV hybrid lens molding:
UV molding process flow
Designed for puddle dispense
Recipe parameters and user guidance
Software to compensate with specified tolerance
Force control capability up to 400N:
Load cells implemented
Maximum controllable imprint: 400N
Force control during imprint
Force control during UV exposure
UV molding software
Tooling for 200mm UV bonding,stamp fabrication and MLM:
Top substrate holder
Special quartz backplane with edge vacuum groove
Mechanical clamping
Vacuum supply to backplane via tube
Software for master and sub-master replication:
UV molding process flow
Tooling for polymer stamp fabrication
Software to compensate product within specified tolerance
Software for UV monolithic lens molding:
UV molding process flow
UV molding tools for puddle dispense
Recipe parameters and user guidance
Software to compensate with specified tolerance
Diffuser plate for tooling for stamp fabrication + MLM:
Tooling for stamp fabrication + MLM
Diffuser plate onto backplane prior to UV exposure step
Diffuser plate for hybrid lens molding tooling:
Hybrid lens molding tooling
Diffuser plate onto backplane prior to UV exposure step
Recipe controlled microscope illumination spectrum:
Contrast improving illumination system
Increased pattern visibility
Improved alignment reliability
(3) Adjustable LED light sources per microscope
Autom.Arm for puddle dispense and de-ionization:
Motorized swivel arm
Software integrated
Programmable dispense arm/nozzle
Puddle dispense of imprint material: up to 4 lines
Right-hand side alignment
Host ionization system
Ionization system:
Ionization nozzle with power supply
De-ionizing of stamp and substrate
Syringe dispense system:
Syringes :up to 3
(2) Dispense lines
Universal resists applications
Resist with short shelf life time
Programmable dispense rate
Adjustable suck back
Different resist and polymer viscosity
Chemistry cabinet:
Housing with front door access
Encapsulating of syringe dispense systems / arm
Exhaust port
Prepared for later pump upgrade
Pre-installed weight cell
2011 vintage.
EVG/EV GROUP IQ Mask Aligner是一款高精度、高通量的晶圓級光刻設備,用於半導體行業對芯片、晶體管等電路元件等小型器件進行陣列設計。這種先進的工具提供超高分辨率的高線邊緣粗糙度(LER)和覆蓋精度,以提高設備性能和產量。利用先進的晶片級、激光幹涉儀進行精確的晶片對準和運動控制,采用同步的步進重復方法,以快速、可重復的方式將所需圖像投影到晶片上。EVG IQ Mask Aligner使用分束透鏡將激光引導到矩形鏡面上,該鏡面將其反射到蒙版和光刻塗層晶片上,同時曝光,允許創建高級多層圖樣。光束分裂透鏡也提供了一個光源到面罩和晶圓,使每一個暴露在光刻系統的光源光束的全強度。EV GROUP IQ Mask Aligner能夠在標準對齊器上打印低於50 nm的特性,或者使用專用設備打印低於30 nm的特性,非常適合制造先進的IC和MEM設備。為了達到這樣的小特性,該單元利用強大、高保真的數字步進電機來驅動鏡頭和曲柄機構,以精確地移動晶片,使晶片與晶片對齊,並進行拍打。這樣就可以實現高度準確和可重復的打印過程。晶片由真空卡盤保持在適當位置,同時使用對準激光器調節晶片的位置,並確保它與掩模精確對準。這允許從打印到打印的真實叠加測量。最後,使用額外的紫外可見激光器掃描廣泛的掩模和晶圓特征,減少打印之間的時間,使晶圓能夠快速高效的處理。IQ Mask Aligner提供了卓越的模式精度,包括± 5nm的線寬控制和小於1nm的LER。該機也具有很高的可靠性,使用壽命超過20年。憑借快速的吞吐量能力和先進的平版印刷控制,該工具能夠快速地制作出準確、復雜的圖樣。因此,它是尋求高精度、高通量晶圓級光刻解決方案的半導體領域的一個寶貴工具。
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