二手 EVG / EV GROUP IQ #9138247 待售

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ID: 9138247
Nano imprint lithography system, 8" Top-side alignment only Manual load Wiring removal Basic unit 200mm: Flat screen:17" Self Diagnostics during machine startup Automatic initialization:All motors,encoders,limit switches,sensors and pneumatic Remote diagnostics Quick change:Stamp holders and imprint chucks EC declaration of conformity PC controlled operating environment Solid state drive and hard drive Earthquake protection device Software: MS-windows Process software ,processing and diagnostics Automated recording Storage of files in hard disk or network Password protected Internal wedge compensation unit: Automatic wedge compensation Motorized alignment stage: X,Y,T alignment High resolution alignment (3) axis joystick Reinforced stage drives Top side microscope: Fully motorized split field microscope Travel range X: 90-200mm* Travel range Y: -10-100mm* (3) axis joystick control Display and storage of microscope position (2) Objective 5x Automatic alignment for top and / or bottom side: Vision system Storage of stamp and patterns on hard disk Top and bottom side alignment Stamp and wafer alignment marks Large gap alignment capability: Alignment at substrate separations >50um Alignment during UV molding Alignment during UV bonding Manual wafer loading capability: Motorized swivel arm software integrated (2kg) Manual substrate loading/unloading Wafer loading trays Wafer loading frame for 200mm wafers/stamps: Manual wafer loading on chuck process integrated substrate vacuum fixing Notch or flat with pins External wafer thickness measurement station: (3) Point wafer thickness detection Contact less imprinting (3) Sensors adjustable range :150-200mm Designed Warped substrate :1mm Manual Operation Sensors range: up to 10mm manual system only 500W-1000W Light source NUV: Lamp house :500w or 1000w NUV range:280-450nm Optimized parallel Light:+/-3% on 150mm and +/-4% on 200mm Adjustable plate: diameter 44.5mm and max.height 16mm Optical set for wave length range 350-450nm: NUV and DUV light sources Field lens:200mm Dielectric mirror Fly's eye lens Stamp holder for 200mm UV hybrid lens molding: UV molding automated de-embossing function Hard coat surface finish Quartz backplane Imprint chuck for 200mm wafers/stamps: Bottom chuck: 200mm wafer Top side alignment Hard coat surface finish Manual and automated loading Software for UV hybrid lens molding: UV molding process flow Designed for puddle dispense Recipe parameters and user guidance Software to compensate with specified tolerance Force control capability up to 400N: Load cells implemented Maximum controllable imprint: 400N Force control during imprint Force control during UV exposure UV molding software Tooling for 200mm UV bonding,stamp fabrication and MLM: Top substrate holder Special quartz backplane with edge vacuum groove Mechanical clamping Vacuum supply to backplane via tube Software for master and sub-master replication: UV molding process flow Tooling for polymer stamp fabrication Software to compensate product within specified tolerance Software for UV monolithic lens molding: UV molding process flow UV molding tools for puddle dispense Recipe parameters and user guidance Software to compensate with specified tolerance Diffuser plate for tooling for stamp fabrication + MLM: Tooling for stamp fabrication + MLM Diffuser plate onto backplane prior to UV exposure step Diffuser plate for hybrid lens molding tooling: Hybrid lens molding tooling Diffuser plate onto backplane prior to UV exposure step Recipe controlled microscope illumination spectrum: Contrast improving illumination system Increased pattern visibility Improved alignment reliability (3) Adjustable LED light sources per microscope Autom.Arm for puddle dispense and de-ionization: Motorized swivel arm Software integrated Programmable dispense arm/nozzle Puddle dispense of imprint material: up to 4 lines Right-hand side alignment Host ionization system Ionization system: Ionization nozzle with power supply De-ionizing of stamp and substrate Syringe dispense system: Syringes :up to 3 (2) Dispense lines Universal resists applications Resist with short shelf life time Programmable dispense rate Adjustable suck back Different resist and polymer viscosity Chemistry cabinet: Housing with front door access Encapsulating of syringe dispense systems / arm Exhaust port Prepared for later pump upgrade Pre-installed weight cell 2011 vintage.
EVG/EV GROUP IQ Mask Aligner是一款高精度、高通量的晶圓級光刻設備,用於半導體行業對芯片、晶體管等電路元件等小型器件進行陣列設計。這種先進的工具提供超高分辨率的高線邊緣粗糙度(LER)和覆蓋精度,以提高設備性能和產量。利用先進的晶片級、激光幹涉儀進行精確的晶片對準和運動控制,采用同步的步進重復方法,以快速、可重復的方式將所需圖像投影到晶片上。EVG IQ Mask Aligner使用分束透鏡將激光引導到矩形鏡面上,該鏡面將其反射到蒙版和光刻塗層晶片上,同時曝光,允許創建高級多層圖樣。光束分裂透鏡也提供了一個光源到面罩和晶圓,使每一個暴露在光刻系統的光源光束的全強度。EV GROUP IQ Mask Aligner能夠在標準對齊器上打印低於50 nm的特性,或者使用專用設備打印低於30 nm的特性,非常適合制造先進的IC和MEM設備。為了達到這樣的小特性,該單元利用強大、高保真的數字步進電機來驅動鏡頭和曲柄機構,以精確地移動晶片,使晶片與晶片對齊,並進行拍打。這樣就可以實現高度準確和可重復的打印過程。晶片由真空卡盤保持在適當位置,同時使用對準激光器調節晶片的位置,並確保它與掩模精確對準。這允許從打印到打印的真實叠加測量。最後,使用額外的紫外可見激光器掃描廣泛的掩模和晶圓特征,減少打印之間的時間,使晶圓能夠快速高效的處理。IQ Mask Aligner提供了卓越的模式精度,包括± 5nm的線寬控制和小於1nm的LER。該機也具有很高的可靠性,使用壽命超過20年。憑借快速的吞吐量能力和先進的平版印刷控制,該工具能夠快速地制作出準確、復雜的圖樣。因此,它是尋求高精度、高通量晶圓級光刻解決方案的半導體領域的一個寶貴工具。
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