二手 LEICA / VISTEC LDS 3300M #9059146 待售

Automated macro-defect inspection system Includes: Macro inspection Auto-alignment: Die-based, wafer-based Defect library Pixel detection Alignment control Color shift and histogram deviation Global color detection ROI Editor Loader module: (2) Cassette system in SMIF or open cassette version Wafer existence sensor Cross slot detection Contact-free pre-alignment Macro module: High precision integrated X/Y Stage Brightfield/Darkfield/Advanced darkfield illumination system Illumination high speed strobe Inspection area of dies, including partial dies Macro ADC Optical components BF and DF imaging LDS System operation Image capturing Specifications: Throughput, 12": Full die, full wafer, 130 wph Recipe creation and maintenance: Fast and easy recipe creation and maintenance (<20 min) Worldwide fab application experience Edge/bevel inspection Backside inspection with color imaging Chip-free area/partial die inspection and review Process Control: High resolution spotcheck (Reticle ID check, fuse inspection, overlay check) Litho alignment mark verification (lower contrast layer inspection capability) EBR width and shift measurement Parallel inspection and review Defocus detection (3) Load ports options to maximize tool utilization Parallel process job execution Full wafer color imaging Merged trench defect inspection for DRAM Advanced algorithms: Tunable sensitivity from wafer center to wafer edge (low false count) Color defect detection algorithm (low false count) Global wafer detect detection Currently installed 2007 vintage.