二手 AMAT / APPLIED MATERIALS Vantage Radiance #293587172 待售

ID: 293587172
Rapid Thermal Processing (RTP) system, 12" Process: RadOx (2) Chambers Wafer type: SNNF Platform type: Vantage 3.X Position A and B: (V352) RadOx2 Chamber A and B process: Toxic RP OHT WIP Delivery Dual 2-slot active cool down station No remote control system E99 Docked reading capability Load port: SELOP 7 Load port operator interface: Standard (8) lights Configurable colored lights Top air intake system Upper E84 interface enabled OHT Upper E84 PIO sensors and cables E99 Carrier ID: TIRIS With RF Operator access switch 4-Color configurable light towers Interface A option eDiagnostic Out the back connection type: RP Out the back connection H2 (2) Water cooling chambers RP Integration hardware: Chamber A and B Standard RAGB rear light tower Vantage skin: (2) Toxic chambers IPUP Transfer pump Open loop tuner MFC Type: STEC Core anneal and RTO Monitor 1: Flat panel with keyboard on stand, 17" Monitor 2: Flat panel on stand, 17" Monitor 1 and 2 cables: 25 ft with 16 feet effective SEMI F47 Semi S2 compliance RTP Chamber type: Radiance RadOx2, 12" Technology option: Open loop tuner MFC Type: STEC Core anneal and RTO Rotation type: WRLD Toxic Low flow O2: 5 SLM High flow O2: 50 SLM Oxygen analyzer H2: High flow Low flow Side inject No process N2 for flammable MNFLD Gas pallet type: TOXIC RP Common gas pallet No MWBC improvement kit Chamber integration lines: RadOx2 RP Pump cable: 81 Feet Base ring: RadOx2 base ring Line 1 / N2 (N/O), 50 SLM Line 2 / O2, 50 SLM Line 3 / O2, 5 SLM Line 6 / H2, 15 SLM, Side inject high flow Line 7 / H2, 22 SLM, High flow Line 8 / H2, 2 SLM, Low flow Line 10 / N2 (P/P), 30 SLM Restrictor Line 11 / He, 30 SLM Line 12 / N2 (BP), 50 SLM Line 13 / N2 (Maglev), 100 SLM Docking station FST install kit Does not include Hard Disk Drive (HDD) 2016 vintage.
AMAT/APPLIED MATERIALS Vantage Radiance是一種快速熱處理器,旨在在半導體制造過程中快速高效地加熱晶圓。它是市場上最先進的熱處理系統之一,為芯片制造商提供了許多功能和優勢。AMAT Vantage Radiance具有高功率、快速熱處理爐,設計用於傳遞均勻熱量,最高溫度範圍可達1300 °C。這伴隨著每步不到0.1秒的快速斜坡時間,使其能夠快速準確地達到溫度設定點。這有助於縮短晶圓循環時間,使芯片制造商能夠制造更先進的半導體器件。APPLICED MATERIALS Vantage Radiance還配備了Advanced Control Equipment,允許操作員管理和控制熱處理所需的各種過程和條件。這包括多種監測條件的工具,如溫度、壓力、氣流和晶圓表面條件。該系統還允許校準爐子的烹飪參數,以確保每批晶片的最佳性能。此外,Vantage Radiance利用了一個專利的多過程控制單元(MPCS),它可以對多個晶圓同時運行進程。這樣可以快速同時加熱多個晶片,而不會影響熱過程的準確性和控制。MPCS還具有不同工藝步驟的熱配方,可快速生成一致的結果。總而言之,AMAT/APPLIED MATERIALS Vantage Radiance是一款先進的快速熱處理機,旨在提高半導體制造的效率和性能。AMAT Vantage Radiance憑借其高功率爐、高級控制機和多過程控制工具,能夠快速、準確地滿足各種熱處理需求。
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