二手 AMAT / APPLIED MATERIALS Vantage Radiance #293587174 待售
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ID: 293587174
Rapid Thermal Processing (RTP) system, 12"
Process: RadOx
(2) Chambers
Wafer type: SNNF
Platform type: Vantage 3.X
Position A and B: (V352) RadOx2
Chamber A and B process: Toxic RP
OHT WIP Delivery
Dual 2-slot active cool down station
No remote control system
E99 Docked reading capability
Load port: SELOP 7
Load port operator interface: Standard (8) lights
Configurable colored lights
Top air intake system
Upper E84 interface enabled OHT
Upper E84 PIO sensors and cables
E99 Carrier ID: TIRIS With RF
Operator access switch
4-Color configurable light towers
Interface A option
eDiagnostic
Out the back connection type: RP
Out the back connection H2
(2) Water cooling chambers
RP Integration hardware: Chamber A and B
Standard RAGB rear light tower
Vantage skin: (2) Toxic chambers
IPUP Transfer pump
Open loop tuner
MFC Type: STEC
Core anneal and RTO
Monitor 1: Flat panel with keyboard on stand, 17"
Monitor 2: Flat panel on stand, 17"
Monitor 1 and 2 cables: 25 ft with 16 feet effective
SEMI F47
Semi S2 compliance
RTP Chamber type: Radiance RadOx2, 12"
Technology option: Open loop tuner
MFC Type: STEC
Core anneal and RTO
Rotation type: WRLD Toxic
Low flow O2: 5 SLM
High flow O2: 50 SLM
Oxygen analyzer
H2:
High flow
Low flow
Side inject
No process N2 for flammable MNFLD
Gas pallet type: TOXIC RP Common gas pallet
No MWBC improvement kit
Chamber integration lines: RadOx2
RP Pump cable: 81 Feet
Base ring: RadOx2 base ring
Line 1 / N2 (N/O), 50 SLM
Line 2 / O2, 50 SLM
Line 3 / O2, 5 SLM
Line 6 / H2, 15 SLM, Side inject high flow
Line 7 / H2, 22 SLM, High flow
Line 8 / H2, 2 SLM, Low flow
Line 10 / N2 (P/P), 30 SLM Restrictor
Line 11 / He, 30 SLM
Line 12 / N2 (BP), 50 SLM
Line 13 / N2 (Maglev), 100 SLM
Docking station FST install kit
Does not include Hard Disk Drive (HDD)
2016 vintage.
AMAT/APPLIED MATERIALS Vantage Radiance是一種快速熱處理器,旨在創建可靠且可重復的晶圓溫度曲線,以促進高精度半導體制造過程。這是一個緊湊的,精確的熱處理單元,有一個兩區處理室能夠達到120˚C。「輻射」提供高達600˚C的動態溫度範圍,精度為+/-5˚C。這允許非常精確和可重復的熱退火過程。The Radiance配備了一個超清潔的工藝室和一個靜電卡盤,以幫助維護一個清潔和無靜電的環境。Radiance還具有內置導熱系數和均勻性測量工具。這樣可以確保準確和可重復的結果,從而提高晶片的產量和質量。The Radiance還包括一個最先進的高速電源控制器(HSPC)。HSPC由多級脈沖寬度調制(PWM)系統和智能控制器組成,可實現復雜的電源管理。HSPC能夠管理多達30個STPV(步長過程變量)以實現最佳的熱退火條件。Radiance的設計旨在實現靈活和高速的熱處理。它具有快速的加熱和冷卻速率、準確和可重復的熱剖面以及較短的循環時間,從而能夠制造細線光刻和復雜的蝕刻剖面。此外,還可配備高分辨率高溫計,實時監控工藝狀況,確保最佳性能。Radiance作為現成的系統出售,經過全面測試和可配置。該系統旨在實現流程自動化,同時保持高度的準確性和可重復性。Radiance可作為可配置的獨立單元使用,也可作為一整套工具的一部分使用。Radiance結合了自動化、精確度、可重復性和靈活性,是半導體制造的有力選擇。
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