二手 AMAT / APPLIED MATERIALS Vantage Radiance #293587176 待售

ID: 293587176
Rapid Thermal Processing (RTP) system, 12" Process: RadOx (2) Chambers Wafer type: SNNF Platform type: Vantage 3.X Position A and B: (V352) RadOx2 Chamber A and B process: Toxic RP OHT WIP Delivery Dual 2-slot active cool down station No remote control system E99 Docked reading capability Load port: SELOP 7 Load port operator interface: Standard (8) lights Configurable colored lights Top air intake system Upper E84 interface enabled OHT Upper E84 PIO sensors and cables E99 Carrier ID: TIRIS With RF Operator access switch 4-Color configurable light towers Interface A option eDiagnostic Out the back connection type: RP Out the back connection H2 (2) Water cooling chambers RP Integration hardware: Chamber A and B Standard RAGB rear light tower Vantage skin: (2) Toxic chambers IPUP Transfer pump Open loop tuner MFC Type: STEC Core anneal and RTO Monitor 1: Flat panel with keyboard on stand, 17" Monitor 2: Flat panel on stand, 17" Monitor 1 and 2 cables: 25 ft with 16 feet effective SEMI F47 Semi S2 compliance RTP Chamber type: Radiance RadOx2, 12" Technology option: Open loop tuner MFC Type: STEC Core anneal and RTO Rotation type: WRLD Toxic Low flow O2: 5 SLM High flow O2: 50 SLM Oxygen analyzer H2: High flow Low flow Side inject No process N2 for flammable MNFLD Gas pallet type: TOXIC RP Common gas pallet No MWBC improvement kit Chamber integration lines: RadOx2 RP Pump cable: 81 Feet Base ring: RadOx2 base ring Line 1 / N2 (N/O), 50 SLM Line 2 / O2, 50 SLM Line 3 / O2, 5 SLM Line 6 / H2, 15 SLM, Side inject high flow Line 7 / H2, 22 SLM, High flow Line 8 / H2, 2 SLM, Low flow Line 10 / N2 (P/P), 30 SLM Restrictor Line 11 / He, 30 SLM Line 12 / N2 (BP), 50 SLM Line 13 / N2 (Maglev), 100 SLM Docking station FST install kit Does not include Hard Disk Drive (HDD) 2017 vintage.
AMAT/APPLIED MATERIALS Vantage Radiance是一款專為先進半導體器件制造應用而設計的快速熱處理器。它是一個單晶片、批處理型快速熱處理器(RTP),具有專利的固定石英壁加熱器設計,具有高效的直接輸送平板設計,可實現最大吞吐量。站壁由石英等不易燃材料組成,確保在快速熱處理過程中腔室保持涼爽。AMAT Vantage Radiance Rapid Thermal Processor采用多個級別的熱控制,以確保該批晶片得到統一處理。溫度由先進的熱控制器程序控制,該程序利用主機促進反饋和基於高精度熱電偶陣列和高速率PID控制的多級控制器。這種設備允許設備在廣泛的溫度和壓力範圍內操作,允許用戶根據需要微調處理參數。裝置的加熱速率也可以通過可調的坡道上升速率來調節,允許使用者調整加熱時間。APPLICED MATERIALS Vantage Radiance Rapid Thermal Processor的設計采用多區域全晶圓覆蓋均勻性(MZ-FWCU)系統,在整個晶圓表面提供均勻加熱。設備的加熱區分為三個偽等溫加工區(包括一個冷卻前和冷卻後的區域),可以在可接受的範圍內將晶片從室溫加熱到最高設定點溫度。MZ-FWCU確保晶片均勻加熱,沒有任何熱點或冷點。Vantage Radiance的腔室被設計成在加工時保持極其清潔。該裝置采用了獲得專利的等離子體發生器,它提供了穩定和一致的清潔環境,有效地消除了任何顆粒間碎片,並允許對表面和材料造成最小的損害。此外,該裝置還配備了腐蝕和減粒功能,一個表面提升抓地力機構,以及可調節的加熱器高度,以便快速和易於維護。總而言之,AMAT/APPLIED MATERIALS Vantage Radiance Rapid Thermal Processor是一款先進高效的單片加工機,旨在優化設備產量並最大限度地縮短吞吐量時間。其功能和特點,包括先進的熱控制器程序、均勻性工具和等離子體發生器,使其成為先進半導體器件制造應用的理想選擇。
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