二手 AMAT / APPLIED MATERIALS Vantage Radiance #293587176 待售
網址複製成功!
單擊可縮放
ID: 293587176
Rapid Thermal Processing (RTP) system, 12"
Process: RadOx
(2) Chambers
Wafer type: SNNF
Platform type: Vantage 3.X
Position A and B: (V352) RadOx2
Chamber A and B process: Toxic RP
OHT WIP Delivery
Dual 2-slot active cool down station
No remote control system
E99 Docked reading capability
Load port: SELOP 7
Load port operator interface: Standard (8) lights
Configurable colored lights
Top air intake system
Upper E84 interface enabled OHT
Upper E84 PIO sensors and cables
E99 Carrier ID: TIRIS With RF
Operator access switch
4-Color configurable light towers
Interface A option
eDiagnostic
Out the back connection type: RP
Out the back connection H2
(2) Water cooling chambers
RP Integration hardware: Chamber A and B
Standard RAGB rear light tower
Vantage skin: (2) Toxic chambers
IPUP Transfer pump
Open loop tuner
MFC Type: STEC
Core anneal and RTO
Monitor 1: Flat panel with keyboard on stand, 17"
Monitor 2: Flat panel on stand, 17"
Monitor 1 and 2 cables: 25 ft with 16 feet effective
SEMI F47
Semi S2 compliance
RTP Chamber type: Radiance RadOx2, 12"
Technology option: Open loop tuner
MFC Type: STEC
Core anneal and RTO
Rotation type: WRLD Toxic
Low flow O2: 5 SLM
High flow O2: 50 SLM
Oxygen analyzer
H2:
High flow
Low flow
Side inject
No process N2 for flammable MNFLD
Gas pallet type: TOXIC RP Common gas pallet
No MWBC improvement kit
Chamber integration lines: RadOx2
RP Pump cable: 81 Feet
Base ring: RadOx2 base ring
Line 1 / N2 (N/O), 50 SLM
Line 2 / O2, 50 SLM
Line 3 / O2, 5 SLM
Line 6 / H2, 15 SLM, Side inject high flow
Line 7 / H2, 22 SLM, High flow
Line 8 / H2, 2 SLM, Low flow
Line 10 / N2 (P/P), 30 SLM Restrictor
Line 11 / He, 30 SLM
Line 12 / N2 (BP), 50 SLM
Line 13 / N2 (Maglev), 100 SLM
Docking station FST install kit
Does not include Hard Disk Drive (HDD)
2017 vintage.
AMAT/APPLIED MATERIALS Vantage Radiance是一款專為先進半導體器件制造應用而設計的快速熱處理器。它是一個單晶片、批處理型快速熱處理器(RTP),具有專利的固定石英壁加熱器設計,具有高效的直接輸送平板設計,可實現最大吞吐量。站壁由石英等不易燃材料組成,確保在快速熱處理過程中腔室保持涼爽。AMAT Vantage Radiance Rapid Thermal Processor采用多個級別的熱控制,以確保該批晶片得到統一處理。溫度由先進的熱控制器程序控制,該程序利用主機促進反饋和基於高精度熱電偶陣列和高速率PID控制的多級控制器。這種設備允許設備在廣泛的溫度和壓力範圍內操作,允許用戶根據需要微調處理參數。裝置的加熱速率也可以通過可調的坡道上升速率來調節,允許使用者調整加熱時間。APPLICED MATERIALS Vantage Radiance Rapid Thermal Processor的設計采用多區域全晶圓覆蓋均勻性(MZ-FWCU)系統,在整個晶圓表面提供均勻加熱。設備的加熱區分為三個偽等溫加工區(包括一個冷卻前和冷卻後的區域),可以在可接受的範圍內將晶片從室溫加熱到最高設定點溫度。MZ-FWCU確保晶片均勻加熱,沒有任何熱點或冷點。Vantage Radiance的腔室被設計成在加工時保持極其清潔。該裝置采用了獲得專利的等離子體發生器,它提供了穩定和一致的清潔環境,有效地消除了任何顆粒間碎片,並允許對表面和材料造成最小的損害。此外,該裝置還配備了腐蝕和減粒功能,一個表面提升抓地力機構,以及可調節的加熱器高度,以便快速和易於維護。總而言之,AMAT/APPLIED MATERIALS Vantage Radiance Rapid Thermal Processor是一款先進高效的單片加工機,旨在優化設備產量並最大限度地縮短吞吐量時間。其功能和特點,包括先進的熱控制器程序、均勻性工具和等離子體發生器,使其成為先進半導體器件制造應用的理想選擇。
還沒有評論