二手 STEAG / MATTSON / AST 2800 #9159583 待售
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ID: 9159583
Single chamber RTP system, 8"
Dual load lock
Facilities / General configuration:
30L N2 High:
50psi @ Facilities, 2bar @ tool, dynamic (full N2 flow)
60psi @ Facilities, 2.8bar @ tool, static (no N2 flow)
10L O2 High:
40psi @ Facilities, 2bar @ tool, dynamic (full O2 flow)
42psi @ Facilities, 2.5bar @ tool, static (no O2 flow)
O2 Low: 40psi @ Facilities, 2bar @ tool, dynamic (full O2 flow)
42psi @ Facilities, 2.5bar @ tool, static (no O2 flow)
10L Ar:
40psi @ Facilities, 2bar @ tool, dynamic (full Ar flow)
43psi @ Facilities, 2.5bar @ tool, static (no Ar flow)
CDA:
Facilities: 90psi
Tool: 5.5 Bar
Chamber high cool:
Bottom: 17/18 m3/h
Top: 26/27 m3/h
Chamber H20 cooling:
Facilities: 6.8LPM
TC Amplifier test with omega meter:
Setpoint Feedback
1000C 1001.5
800 800.5
600 599.6
400 398.8
O2 Sensor final testing:
30L N2 flow in chamber @ 30 second: 3ppm O2
5L N2 flow in chamber @ 60 seconds: 4-5ppm O2
Robot station names:
A: Primary sender
I: Secondary receiver
F: Furnace
D: Cooling station 0
No cooling station 1
C: Dummy wafer station
Pyrometer calibration:
Un-calibrated pyrometer check: Pyro 878C output at 1080TC with emis1300
Calibration recipe: TOMCAL.2
Calibration file: TRCAL0923
Network setup:
Serial GemSecs
Expansion board: COM8
GEMBOX.INI Host: localhost
SHSCFG.INI Gembox host: localhost
RTP:
No physical dummy wafer station
MFC:
TYLAN Gas panel
TYLAN O2 Sensor
EQUIPE 307 robot
No swivel cassette stations
Gasbox above rear of tool: (supplies MFCs):
N2, N2, O2, H2Mix, Ar
Facilities connections at bottom rear of tool:
CDA: SWAGELOK 90-120PSI, 1/4"
PCWS: SWAGELOK 8slpm, 1/2"
PCWR: SWAGELOK 60-120PSI, 1/2"
PCWS: SWAGELOK, 1/2"
PCWR: SWAGELOK, 1/2"
HiFlow N2: SWAGELOK >90PSI, 1/2"
Cooling N2: SWAGELOK 10-30SLPM, 1/4"
Vent1 / Vent2 (Acid exhaust): SWAGELOK, 3/8"
11/2 Inch exhaust: 11/2 Inch tube Acid exhaust
Middle bottom of tool:
Blower output (Heat exhaust): 4" Tube
Front of tool:
House vacuum: SWAGELOK 600 mbar, 1/4"
Electrical requirements:
Power consumption: 43 kVA
Voltage: 208 VAC, 3 Phase
Current per phase: 125 A
125 Max fusable
Missing parts:
(1) Endeffector universal, 47900058
(1) Tube AST furnanec 8in, 58700001
(2) Quarts tray elbow, MATTSON Technology, 58800003
(1) Tray quarts wafer, MATTSON Technology, 58900085
(1) Plate top liner plates, LTD Materials, Inc., 11823-000
(2) Fiber optic cable IPC-ILC, 19200195
(1) Plate hotliner 8 IN, MATTSON Technology, 47800189
(1) Pyrometer AST 2800, MATTSON Technology, 17000164
(1) Controller AST Pre-Aligner, ESC-201
(1) Harddrive AST SEAGATE 160GIG, ST3160318AS
(1) ILC, PCU 2.4g SEIMENS, ILC-3
(1) Robot, ATM-307, PRI, ATM-307
(1) Pre-Aligner, 8 inch, PRI, PRE-201B
(1) Temp controller PCB
(6) IGBT
(2) Outer door panels.
STEAG/MATTSON/AST 2800快速熱處理器是一種半導體處理工具，用於電子行業的先進應用。它專為生產當今先進的半導體芯片以及未來最苛刻的封裝而設計。AST 2800由兩個主要組件組成：熱控制系統和應用室。熱控制系統具有較高的溫度均勻性和溫度穩定性以及較低的熱梯度和快速、可重復的上升和下降時間。STEAG AST2800具有-160°C至700°C的精確、靈活的溫度範圍,即使是最精細的晶片和組件也能處理。它還具有精確的時間和溫度控制功能,可為各種流程提供精確的設置。針對中高功率剖面和快速熱循環時間對熱控制系統進行了優化,從而提高了吞吐量。應用室有四個獨立可控的區域，即底部、頂部、惰性和氮氣，還包括用於引入用於環境控制的氣體的工藝端口。該腔室可隨時確保壓力穩定性,並為各種工藝提供靈活性。它還為加載、卸載和處理晶片和組件提供了廣泛的選項。2800 Rapid Thermal Processor非常適合先進的高級封裝應用,例如Cu支柱和無芯翻轉芯片附件,也非常適合大批量生產需要。憑借其高分辨率的溫度控制能力和堅固的腔室設計，AST2800是最苛刻的芯片生產的完美工具。
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