二手 AMAT / APPLIED MATERIALS Endura II #9195497 待售

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ID: 9195497
PVD System (4) Chambers Process type: HT DSTTN Chamber position: 1,2 Shutter option Chamber body: SST Chamber body part number: 0040-98657 Slit valve seal: Bonded Slit valve door part number: 0040-84391 Target vendor: NIKKO Target number: TAG72 DC Power supply (AE-MDX): ENI APPLIED MATERIALS Part number master: 0190-22931 OEM Part number master: DCG200Z Generator size: 20 kW Total DC (12 kWh,24 kWh): 20 kW Magnet rotation speed: 95 RPM Magnet shim thickness: No data Magnet type: TI / TIN Magnet part number: 0010-03487 Magnet spacing: 1.0 mm Adapter part number: 0040-69768 Upper shield part number: 0021-21234 Treatment: Bead blast Lower shield part number: 0020-29706 Treatment: Bead blast Dep ring part number: 0200-01080 Cover ring part number: 0021-22177 Treatment: Bead blast Shutter: 0021-25014 Treatment: Bead blast Pedestal type: HT ECHUCK Pedestal part number: 0010-27430 Heater spacing: 55 mm Heater spacing: -51000 Steps Minimum heater spacing: 32 mm Minimum heater spacing: -69000 Steps Maximum heater spacing: 55 mm Maximum heater spacing: -51000 Steps CRYO Gate valve: (3) Positions MFC 1 Gas: N2 Process MFC 1 Size: 200 MFC 1 Type: N2 MFC 1 Part number: 0015-02992 MFC 2 Gas: None MFC 3 Gas: Ar process MFC 3 Size: 150 MFC 3 Type: Ar MFC 3 Part number: 0015-02992 MFC 4 Gas: ArH MFC 4 Size: 20 MFC 4 Type: Ar Chamber base pressure (T): 3-E8 Chamber rate-of-rise: 650 nTorr / Min Process Ar supply pressure: 34.7 Process N2 supply pressure: 33.9 Vent Ar pressure: 47.7 CDA: 95.7 Slit valve CDA: 85 Cooling water flow: 11.2 GPM Process type: RT DSTTN Chamber position: 3,4 Shutter option Chamber body: SST Chamber body part number: 0040-98657 Slit valve seal: Bonded Slit valve door part number: 0040-84391 Target vendor: NIKKO / TOSOH Target number: TAG 72 Bake out / Idle power: 0.4 % DC Power supply (AE-MDX): ENI APPLIED MATERIALS Part number master: 0190-22931 OEM Part number master: DCG200Z Generator size : 20 kW Total DC (12 kWh,24kWh): 20 kW Magnet rotation speed: 95 RPM Magnet shim thickness: No data Magnet type: TI / TIN Magnet part number: 0010-03487 Magnet spacing: 1.1 mm Adapter part number: 0040-69768 Upper shield part number: 0021-21234 Treatment: Bead blast Lower shield part number: 0021-22065 Dep ring part number: 0040-07291 Cover ring part number: 0021-22064 Shutter: 0021-26609 Pedestal type: Advanced A101 Pedestal part number: 0010-27432 Heater spacing: 55 mm Heater spacing: -51000 Steps Minimum heater spacing: 32 mm Minimum heater spacing: -69000 Steps Maximum heater spacing: 55 mm Maximum heater spacing: -51000 Steps CRYO Gate valve: (3) Positions MFC 1 Gas: N2 Process MFC 1 Size: 200 MFC 1 Type: N2 MFC 1 Part number: 0015-02992 MFC 2 Gas: None MFC 3 Gas: Ar process MFC 3 Size: 150 MFC 3 Type: Ar MFC 3 Part number: 0015-02992 Chamber base pressure: 3-E8 T Chamber rate-of-rise: 650 nTorr / Min Process Ar supply pressure: 34.7 Process N2 supply pressure: 33.9 Vent Ar pressure: 47.7 CDA: 95.7 Silt valve CDA: 85 Cooling water flow: 11.2 GPM.
AMAT/APPLIED MATERIALS/AKT Endura II是一種雙室氧化/蝕刻/CVD/ALD反應堆設備,用於先進的半導體應用和器件制造。它旨在提供高吞吐量和提高生產率。該系統采用兩室設計,能夠在不同的過程室中同時運行,從而實現更高的吞吐量和更好的均勻性。腔室具有獨立的溫度控制功能,最高工作溫度為1020 °C。AKT Endura II具有高密度等離子體(HDP)處理能力,在精密蝕刻、濺射沈積、化學氣相沈積(CVD)和原子層沈積(ALD)等領域提供優勢。其先進的HDP控制功能可實現更精確的蝕刻和濺射,以實現更精細的線條分辨率和納米特征更精細的沈積。此外,該單元支持多種等離子體來源,使廣泛的材料得以使用。AMAT Endura II還包括實時監控,以實現可靠的過程控制和更高的產量。用戶友好的圖形用戶界面(GUI)允許過程自動化,可根據需要在不同配方集之間快速切換。使用GUI可以調整先進薄膜結構和沈積工藝的配方,並能夠查看底物級參數,如溫度、壓力和晶圓均勻性。該機器還具有高級自動校正模塊(ACM),它提供了一種優化過程結果的方法,用戶幹預較少。此模塊允許用戶即時監視和調整參數,以最小的停機時間確保改進的流程一致性和可重復性。此外,多種配方優化、智能晶圓處理和精確的過程控制等智能技術功能可提高產量和質量。由於其先進的特性和功能,APPLIED MATERIALS Endura II是先進半導體加工的理想選擇,允許用戶實現高生產吞吐量和提高設備質量。該工具提供卓越的性能、可靠性和靈活性,以提高產量和工藝一致性。
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