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AMAT / APPLIED MATERIALS Centura 200 EPI
ID: 9384326
優質的: 2021
PECVD System, 8" Chambers: Chamber A: ATM Epi Chamber B: ATM Epi Chamber C: ATM Epi Chamber F: Single slot cooldown STD Transfer Wide body loadlock System voltage: 480V Frequency: 60Hz Transformer capacity: 480V to 208V / 300Amps CB1 Current rating: 300 Amps Leak detectors: Gas panel, H2 Mainframe exhaust: H2 Clean room monitor: TFT Stand alone Maintenance room monitor: TFT Stand alone Gas panels: Gas panel type: Configuable FUJIKIN Gas panel exhaust position: CH-A (Only for configurable type) Platter mixer Platter chamber-A Platter chamber-B Platter chamber-C (2) Mixed dopants (1) Silicon source Fujikin FCST Main H2: 100 slm Slit H2: 30 slm Minimum HCl: 1 slm Maximum HCl: 30 slm TCS: 20 slm Dope (INJ): 300 sccm Dope mixer (SRC): 500 sccm Dope mixer (DIL H2): 20 slm Pressure transducer (gauge) range: 0-45 Cabinet exhaust switch type: AMAT Mainframe: EPICREW Blower and heat exchanger Blower voltage: 480 VAC YASKAWA Variable speed blower Mainframe cabinet exhaust: Channel A side AMAT Lamp fuse tray and fuses AMAT Lamp C/B AMAT Lamp contactor AMAT Lamp harness assembly AMAT Gas lines (From gas panel to floor plate) AMAT Chamber tray AMAT Facilities water supply/Return connections Stainless steel water fittings Remote frame: CB1 Current rating: 300 Amp Umbilical cable length: 25 Feet V452 SBC Board AMAT Video card SSD 1 GB Hard Disk Drive (HDD) Chamber interface board: Chamber A, B and C AMAT SCR Driver AMAT SCR C/B AMAT SCR Contactor with fuses AMAT H/A Breaker to contactor Load lock chambers: Universal platform Wide body Wafer mapping Wafer slide detect Fast backfill Cooldown chamber: Type: Non-contact Center finder : On-the-fly N2 Purge restrictor size: 5 slm Transfer chamber: Transfer chamber lid hoist Robot type: HP AMAT Slit valve N2 Purge restrictor size: 5 slm x 3 Chamber A: Wafer sizes: 8" Standard process: ATM Ushio -B3G Lamps Rotation rev.R3.4 Exhaust line cone baffles (ATM) Reflector cones SWAGELOK Isolation valve Chamber B: Wafer size: 8" Standard process (ATM) USHIO B3G Lamps Rotation rev.R3.4 Reflector cones SWAGELOK Isolation valve Chamber C: Wafer size: 8" Standard process (ATM) USHIO B3G Lamps Rotation rev.R3.4 Reflector cones SWAGELOK Isolation valve Pallets for FUJIKIN: Model / Positions / Process gas / MFC Size FCST / 1 / H2 / 20000 FCST / 3 / H2 / 500 FCST / 5 / HC1-Hi / 30000 FCST / 6 / HC1-Lo / 1000 FCST / 7 / H2 / 100000 FCST / 8 / H2 / 30000 2021 vintage.
AMAT/APPLIED MATERIALS Centura 200 EPI(外延工藝集成)設備是一種晶圓級、基於真空的加工反應器,用於在半導體晶圓上提供層的外延沈積。這種晶圓制造反應堆是專門為提高電介質膜、金屬膜和復合半導體材料(如砷化氙、砷化鋁,以及改用氘基化合物)的性能、可靠性和吞吐量而設計的。適用於廣泛的行業,包括微電子、光電、電信、生物電子等。該系統旨在克服維持高增長率同時保持沈積物質均勻分布的困難。該工藝為多晶矽和二氧化矽的多層提供了支持,並為超薄層的生長和多向外延操作提供了能力。它還提供高溫熱處理選項,如退火和通道。AMAT Centura 200 EPI使用射頻(RF)激發源實現高通量增長率。該單元利用單壁圓柱形加熱室,其中多個小型間接等離子體發生器沿該室的方向產生均勻的電場。均勻的電場和高效的射頻耦合使得APPLIED MATERIALS Centura 200 EPI適用於低溫和高溫過程。該機在能耗方面也很高效,能夠實現低成核密度,具有較高的沈積選擇性。利用附帶的軟件控制,可以在非常低的副產品形成下實現層的均勻性和穩定性。此外,Centura 200 EPI可以與其他沈積系統結合使用,采用高密度基板的群集配置。該工具采用模塊化體系結構設計,可實現自動化選項,包括基於機器人的晶圓處理。它采用緊湊、堅固的外殼,適合集成到潔凈室工作流程中。AMAT/APPLIED MATERIALS Centura 200 EPI由強大的真空資產提供動力,可全面控制晶圓溫度和工藝參數。總體而言,AMAT Centura 200 EPI模型提供了一種非常可靠的外延沈積解決方案,適用於廣泛的應用。它高效的能耗和模塊化的體系結構使其成為需要可靠和一致性能的設備制造商的理想選擇。
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