二手 AMAT / APPLIED MATERIALS Centura AP Ultima X #9162819 待售
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ID: 9162819
晶圓大小: 12"
優質的: 2005
HDP-CVD System, 12"
System SW Rev.: 3.7_31
Factory interface (FI)
(2) 12" FOUP Load-ports
Enhanced 25-slot FOUP support
8-Slot wafer Pass-Thru / Storage
Hermos with RF E99 carrier ID
Upper E84 sensors & cables
Overhead transport WIP delivery system (OHT)
Wafer handling robots: (2) Kawasaki with Edge Grip
Pre-Aligner (Single axis)
Status lamp (DeviceNet, Color configurable, Left-Side pole mounted)
Light curtain
Front facing intake plenum
Mini-Environment with automatic pressure control
12" Centura AP M/F:
Robot: VHP (Std Reach ver)
Robot blade type: Conductive alumina
Clear Lid
Process chamber isolation: Dual pressure VAT Bellows
336 Al slit valve inserts
Umbilicals:
Heat exchanger: 65ft
Heat exchanger hoses: 50ft
Pump: 65ft
Facility connections: AP Front, Thru-the-floor
System safety: M/F AC Dist. Box with LOTO CBs
Std INTLK system
EMO Push turn to release
User interface:
UI-1: Roll-Around stand, Flat panel / Keyboard
UI-2: Thru-the-Wall, Flat panel
Chambers:
LLKA: SWLL (Cool down only)
LLKB: SWLL (Cool down only)
A: Ultima X HDP-CVD (Z7)
B: Ultima X HDP-CVD (Z7)
D: Ultima X HDP-CVD (Z7)
Load locks:
Type: SWLL (AP ver)
Cool-Down enabled
Door type: AP Std
Lid type: Std viewport Lid
VAT Bellows
336 Al slit valve inserts
Process chambers:
Ch-A / B / D: Ultima X HDP-CVD (Z7)
IR Diagnostic
(01) Oxide ¡V USG STI with He / H2
Astron RPS
MKS (ENI) Spectrum power supplies
Turbo pump: Shimadzu H3603L
Turbo CNTRL: Shimadzu
Gas box config:
Gas panel feed: Bottom
Exhaust: Bottom
MFCs: Unit 8565C
Valve type: Veriflo
Filter type: Millipore
Controller type: DeviceNet
Gas lines (Ch-A/B/D):
#1: N2 (pure), #2: O2 (pure), #3: H2 (pure), #4: SiH4, #5: He (pure), #6: He (pure)
#7: Ar (pure), #8: SiH4, #9: O2 (pure), #10: NF3, #11: NF3, #12: N2 (pure)
Heat exchanger / Chiller:
(2) SMC Heat exchanger
Pumps:
Txfr: (1) Alcatel A100L iPUP
Alcatel pump interface box
(2) Equipment racks (Ultima version)
(1) AC Rack
Facilities UPS Interface
Power requirements: 200/208VAC, 3-Phase, 400A, 4-Wire, Freq 60Hz
Primary 400A Drop for 1-2 Process chamber support
Options:
Hynix specific configured FI status lamp
Power vaccine (1s power off time delay)
CE-Marked
2005 vintage.
AMAT/APPLIED MATERIALS Centura AP Ultima X是一種高性能沈積工具，設計用於半導體和微電子制造中金屬和介電膜的快速精確沈積。該設備為一系列先進工藝技術（包括介電沈積和金屬沈積）提供卓越的「一流」性能,以滿足具有挑戰性的設備要求。AMAT Centura AP Ultima X配備了最新的功能，包括全自動晶圓傳輸系統、先進的軟件控制功能、高精度壓力控制技術以及自動化的清潔和維護能力。該裝置由先進的高容量等離子體源提供動力，能夠為最具挑戰性的沈積過程提供較短的沈積周期和一致的結果。Ultima X的精密運動系統使機器能夠精確定位晶片以獲得更大的吞吐量和可重復性,而其自動輪廓晶片和邊緣偏置保證（CBEA）功能確保薄膜正確、均勻地粘附在基板上。其先進的抽水系統確保工藝氣體保持穩定，並在所需濃度範圍內。Ultima X的精密氣體輸送工具也有助於減少汙染。在沈積均勻性方面，APPLIED MATERIALS Centura AP Ultima X提供優於+/-5%的均勻性性能。用Ultima X取得的均勻性結果已經被幾個獨立的第三方研究所證實。而且，Ultima X的優越腔室設計降低了由於側壁濺射和空氣中粒子汙染而對晶片造成損壞的可能性。這使得Centura AP Ultima X成為需要高精度和高精度沈積過程的理想選擇。此外，資產先進的原位清洗能力有助於保持具有一致晶片對晶片均勻性的高質量沈積。該模型還提供了用於基板和晶片處理的自動化,包括從主控制臺調整和設置壓力和溫度剖面的能力。Ultima X還具有一個直觀的用戶界面,它提供了進程參數和診斷的清晰視圖。總體而言,AMAT/APPLICED MATERIALS Centura AP Ultima X是一款先進、用戶友好的沈積設備,具有卓越的均勻性、吞吐量和穩定性。該系統為一系列先進的工藝要求提供了經濟高效的解決方案，從高性能的介電和金屬沈積到高精度和可重復的工藝。該設備的功能使其成為半導體、微電子制造以及其他需要高質量、可靠沈積工藝的行業的理想選擇。
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