二手 AMAT / APPLIED MATERIALS Endura 5500 #9219406 待售
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ID: 9219406
晶圓大小: 8"
優質的: 2001
System, 8"
Wafer shape: SNNF
MF Facilities: Bottom
Chamber 1: STD WC Body
Process 1: ESC AL
Chamber 2: Wide body
Process 2: TTN
Chamber 3: Wide body
Process 3: TTN
Chamber 4: Wide body
Process 4: Ti
Chamber A: Pass through
Chamber B: Cooldown
Chamber C/D: PCII
Process C/D: Oxide etch
Chamber F: O/D With temp
Heat exchanger 1: NESLAB I
Loadlock pump type: iL600
Transfer robot type: HP+
Transfer robot blade: Metal
Buffer robot type: HP+
Buffer robot blade: Metal
Wafer sensor: Mini beam
Loadlock type: Narrow BD without tilt out
System umbilical: 50 ft
EMOs: Turn to release
Hard drive: SCSI
(2) CRTs
GEM: No
OTF: No
No Facility power (UPS)
No loadlock pump
Loadlock slit valve O-rings: Viton (Black)
Heat exchanger 1: NESLAB
Heat exchanger 2: M-Pack
Main AC box: 480 V, Wide type
Chamber A:
Chamber type: Pass through
Chamber lid: STD Lid
Lift hoop & finger
Pedestal type: Standard
Chamber B:
Chamber type: Cooldown
Gas valves: Fujakin
Heater / Cathode cooling: PCW
Chamber lid: STD Lid
Pedestal type: Standard without TC option
Chamber C:
Chamber type: PCII
Manometer config: Single
Manometer 1: 100mTorr
No shutter option
Chamber process: Oxide etch
Lid type: RF Resonator
RF Gen / DC supply 1: COMDEL CPS-1001S
RF Gen / DC supply 2: RFPP LF10A
RF Match: 13.56 MHz
No endpoint system
Process kit type: PIK-I
Chamber pump: EDWARD iL70
Turbo pump: LEYBOLD
No heated valve stack
Gas MFC Size MFC Type MFC Number Gas stick
N2 20 SCCM STEC 4400 MFC9 (2) Manifolds
N2 300 SCCM MC-3102E-NC MFC10 (2) Manifolds
Chamber D:
Chamber type: PCII
Manometer config: Single
Manometer 1: 100mTorr
No shutter option
Chamber process: Oxide etch
Lid type: RF Resonator
RF Gen / DC supply 1: COMDEL CPS-1001S
RF Gen / DC supply 2: RFPP LF10A
RF Match: 13.56 MHz
No endpoint system
Process kit type: PIK-I
Chamber pump: EDWARD iL70
No heated valve stack
Gas MFC Size MFC Type MFC Number Gas stick
N2 20 SCCM STEC 4400 MFC12 (2) Manifolds
N2 300 SCCM MC-3102E-NC MFC13 (2) Manifolds
Chamber 1:
Chamber type: STD WC Body
Manometer config: Single
Manometer 1: 100mTorr
No shutter option
Chamber process: ESC AL
Lid type: 12.9"
RF Gen / DC Supply 1/2: AE MDX-L12M
Susceptor / Pedestal: MCA ESC
Heater / Cathode cooling: NESELAB I
No endpoint system
Gate valve position: 3 POS
Process kit type: ESC AL
Chamber pump: Cryo pump (OB8F-3 Phase)
No heated valve stack
Gas MFC Size MFC Type MFC Number Gas stick
N2 100 SCCM STEC 4400 MFC18 (2) Manifolds
N2 20 SCCM STEC 4400 MFC9 (2) Manifolds
Chamber 2:
Chamber type: Wide body
Manometer config: Single
Manometer 1: 100mTorr
No shutter option
Chamber process: TTN
Lid type: 12.9"
RF Gen / DC Supply 1: AE MDX-L12M
Susceptor / Pedestal: 101
No endpoint system
Gate valve position: 3 Pos
Process kit type: (2) Ti/TiN
Chamber pump: Cryo pump (OB8F-3 Phase)
No heated valve stack
Gas MFC Size MFC Type MFC Number Gas stick
N2 300 SCCM STEC 7440 MFC9 (2) Manifolds
N2 100 SCCM STEC 4400 MFC10 (2) Manifolds
Chamber 3:
Chamber type: Wide body
Manometer config: Single
Manometer 1: 100mTorr
No shutter option
Chamber process: TTN
Lid type: 12.9"
RF Gen / DC Supply 1: AE MDX-L12M
Susceptor / Pedestal: 101
No endpoint system
Gate valve position: 3 Pos
Process kit type: (2) Ti/TiN
Chamber pump: Cryo pump (OB8F-3 Phase)
No heated valve stack
Gas MFC Size MFC Type MFC Number Gas stick
N2 100 SCCM STEC 4400 MFC2 (2) Manifolds
N2 300 SCCM STEC 4400 MFC3 (2) Manifolds
Chamber 4:
Chamber type: Wide body
Manometer config: Single
Manometer 1: 100mTorr
No shutter option
Chamber process: TTN
Lid type: 12.9"
RF Gen / DC Supply 1: AE MDX-L12M
Susceptor / Pedestal: MCA ESC
Heater / Cathode cooling: NESELAB I
No endpoint system
Gate valve position: 3 Pos
Process kit type: ESCAL
Chamber pump: Cryo pump (OB8F-3 Phase)
No heated valve stack
Gas MFC Size MFC Type MFC Number Gas stick
N2 20 SCCM STEC 4400 MFC4 Single
N2 100 SCCM STEC 4400 MFC5 (2) Manifolds
N2 200 SCCM STEC 4400 MFC6 (2) Manifolds
Missing ES chuck
System power: 200 VAC, 60 Hz, 3 phase, 343 A,150 kVA
2001 vintage.
AKT (AMAT) AMAT/APPLICED MATERIALS/AKT Endura 5500是為生產先進半導體而設計的高性能、獨立式反應堆。AKT Endura 5500能夠實現多種基材和材料的高吞吐量和低缺陷率。該設備采用可擴展的模塊化體系結構,支持最先進的半導體工藝和制造技術。AMAT ENDURA 5500配備了多種獨特的功能,可確保最佳的生產效率。它有一個高性能的晶圓處理系統,可以讓晶圓快速輕松地加載。APPLICED MATERIALS Endura 5500還具有自動晶圓映射單元,可確保晶圓加工的均勻性。此外,該機器還具有一個高級工藝控制工具,可連續監控工藝溫度和其他關鍵參數。AMAT Endura 5500旨在為大批量生產提供卓越的生產可靠性。它具有先進的冷卻資產,可確保高效運行並最大程度地減少停機時間。此外,Endura 5500還采用了空氣排氣過濾、真空控制和溫度調節等環保措施。這確保了在生產環境和實驗室環境中的安全運行。在美學方面,ENDURA 5500具有誘人、圓滑的設計。該模型設計為自成一體,具有易於學習和使用的直觀用戶界面。該設備還具有一系列可選功能,例如用於分析晶片的高級掃描儀,可以添加這些功能以進一步提高其性能。除了令人印象深刻的性能和美觀外,APPLIED MATERIALS ENDURA 5500還提供一系列提高生產力的功能。它專為高吞吐量和低缺陷率而設計,可滿足各種光學、晶圓和工藝要求。此外,系統的高級控制單元提供了有關流程參數的詳細數據,使用戶能夠根據需要調整流程。AKT ENDURA 5500是一種極可靠的反應堆,為用戶提供了高度的工藝靈活性。它是大容量半導體生產應用的理想解決方案,非常適合實驗室和生產環境。
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