二手 AMAT / APPLIED MATERIALS P5000 #9133091 待售
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ID: 9133091
Metal etch, 8"
System Features:
1. Top-Mounted electronics: NO
2. Meets CE Mark Requirements: NO
3. System monitors: YES
4. Robot Handler Rev: Phase III(Overhaul Complete)
5. Cassette Handler Rev: Phase III
6. Factor Automation: NO
7. Storage Elevator Position Sensor: NO
8. Storage Elevator Wafer Orienter: NO
9. Elevator Brakes: YES
10. Storage Elevator Slots: 8
11. Load Lock Purge: NO
12. Load Lock Chamber Bolt Down Lid: YES
13. Load Lock Lid Lift: NO
14. Wafer Position Sensor: YES
15. I/O Wafer Sensor: YES
16. Slow Pump Hardware Installed: NO
17. Foreline Fittings for TC and N2 Purge: VCR Type
18. Load Lock Pump Type: NO Pump
19. Load Lock Pump Brand: N/A
Mainframe
1. Load Lock Degasser: N/A
2. Wafer Orienter Chamber: N/A
3. Endpoint System: Extrenal Emmision
4. Neslab Water Plumbing on Facilities Panel: YES
5. Heat Exchanger Plumbing on Facilities Panel: YES
6. Endpoint System: NONE
7. Robot Type: Phase III
8. Robot Condition: Good condition
9. Lower Circuit Breaker Panel: Present
10. Buuffer Chamber Condition: Good condition
Electronics:
1. Boss PROM: Unable to check. System not powered up.
2. Single Board Computer Type: Synergy
3. Software Revision: Unable to verify, System not powered up.
4. Minicontroller: Present
5. Light Pens: NONE
6. Chamber Interconnect PCB: Present
7. Mini SBC PCB: Present
8. System Electronics Interface PCB: Present
9. Video PCB: Present
10. Analog Output PCB: Present
11. Analog Input PCB: Present
12. Stepper PCB's: Present
13. Digiral I/O PCB's: Present
14. TC Gauge PCB: Present
15. Chopper Drivers: One card none
16. DC Power Cards: +12v card none
17. Buffer I/O PCB: Present
18. AI / MUX PCB: Present
19. Magnet Drivers: 2 Drivers present for Etch Chambers
Chamber Information:
1. Chamber A: Metal Etch MxP+
2. Chamber B: Metal Etch MxP+
3. Chamber C: ASP(strip)
4. Wafer Size: 200mm
5. Foreline Hardware: All Present
6. Capacitance manometers: Present
7. Wafer Lift Hardware: Present, needs servicing and clean-up.
8. Roughing Valves: Present, will need PM serviced and cleaned.
9. Throttle Valve Assemblies: All chambers present. Will need PM Seriviced.
10. RF Matches: Type 4 Matches. Etch Chambers present.
Gas Box Information:
1. MFC Type: No MFC's in Gas Box at time of audit.
2. BCL3 MFC's:
3. CL2 MFC's:
4. CF4 MFC's:
5. N2 MFC's:
Remote Information:
1. Heat Exchanger: AMAT 1X 1
2. Chiller: HX-150
3. RF Generators:OEM-12A & AX-2115
4. Remote Frame: Stand Alone-Delta
1996 vintage.
AMAT/APPLIED MATERIALS P5000是一種180毫米幹蝕刻反應器，設計用於高性能蝕刻工藝。該設備能夠為各種材料提供高度精確的蝕刻深度、高均勻性和出色的蝕刻選擇性。AMAT P-5000配備了先進的硬件和軟件,以確保在平面和3D結構方面均取得優異的效果。硬件包括射頻發生器和射頻匹配單元，以最大限度地提高蝕刻均勻性和效率。該系統還包括反應性氣體輸送單元、確定性運動控制和閉環射頻輸送機。此外,APPLIED MATERIALS P 5000還具有高級控制軟件,如EtchVision,它是一種控制圖形用戶界面（GUI）,可輕松控制和定制蝕刻配方。此外，P-5000還建立了一個介電蝕刻室，以盡量減少等離子體室內的射頻反射，減少敏感區域射頻偽影的可能性。APPLICED MATERIALS P5000的設計是蝕刻最困難的材料，例如銨、鎢和上午。它還能夠在多層電介質中蝕刻而不會過度蝕刻。AMAT P5000還具有極好的氧化物蝕刻特性,具有最小的加熱、冷卻和不受控制的離子影響.該工具可用於深層蝕刻，適用於基板清潔和表面清潔步驟。AMAT P 5000是一個強大的蝕刻工具，可以為各種材料提供統一、精確、高性能的結果。它結合了高級硬件和軟件,使用戶能夠以最小的努力實現他們所期望的流程目標。該資產非常適合在微電子、半導體和光電工業中應用，用於蝕刻敏感和具有挑戰性的結構。
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