二手 AMAT / APPLIED MATERIALS P5000 #9164732 待售
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ID: 9164732
晶圓大小: 6"
優質的: 1992
Etcher, 6"
Mainframe configuration:
Mainframe type: Mark II
I/O Wafer sensor: Yes
Software revision level: TBD
Expaneded VME: Yes
Mini-controller: Yes
Phase 3 Robot: Yes
Phase 3 cassette handler: Yes
Storage elevator
(8) Slots
Cassette platform: Standard
Wafer orienter: No
L/L Chamber bolt down lid: No
L/L Particle reduction kit: No
Gas Panel:
MFC manufacturer / model: UFC-1100A
Gas panel type:
Twelve lines main: No
Twenty-eight line onboard: No
Standard gas panel (28 Line capability): Yes
Remote gas panel: No
Chamber A MFC Size Gas Cal Gas
Gas 1 slm O2 N2
Gas 2 slm O3 He
Gas 3 slm C2F6 N2
Gas 3 slm NF3 N2
Gas 200 sccm N2 N2
Gas
Gas
Gas
Chamber B MFC Size Gas Cal gas
Gas 1 slm O2 N2
Gas 2 slm O3 He
Gas 3 slm C2F6 N2
Gas 3 slm NF3 N2
Gas 200 sccm N2 N2
Gas
Gas
Gas
Chamber C MFC Size Gas Cal gas
Gas 300 sccm CF4 N2
Gas 100 sccm Ar N2
Gas 100 sccm O2$ O2
Gas 50 sccm O2 N2
Gas
Gas
Gas
Chamber D MFC Size Gas Cal gas
Gas 300 sccm CF4 N2
Gas 100 sccm Ar N2
Gas 100 sccm O2$ O2
Gas 50 sccm O2 N2
Gas
Gas
Gas
Hot box configuration:
Hot box configuration: Phase IV
Ampoule 1: Yes
Ampoule 2: No
Ampoule 3: No
Ampoule 4: No
Ampoule 5: No
Ampoule 6: No
Ampoule 7: Yes
Process kit configuration:
Process application:
Chamber A: CVD TEOS
Chamber B: CVD TEOS
Chamber C: Etch MxP
Chamber D: Etch MxP
System electronics:
Slot # Description
1 MINI SBC: Yes
2 SBC: Yes
3 SEI: Yes
4 MIZER: No
5 AI: Yes
6 AO: Yes
7 VIDEO: Yes
8 AO: Yes
9 AI: Yes
10 STEPPER: Yes
11 STEPPER: Yes
12 STEPPER: Yes
13 STEPPER: Yes
14 DI/DO: Yes
15 DI/DO: Yes
16 DI/DO: Yes
17 DI/DO: Yes
18 DI/DO: No
19 DI/DO: No
20 DIO: No
Floppy drive: 5 ¼
Chamber position dependent configurations:
Chamber A:
Chamber type: CVD
Lid: STD
Chamber rough line: Yes
Chamber airline: Yes
Chamber interconnect PCB: Yes
Heat exchanger QD Fitting: Yes
Neslab facilities plumbing: Yes
Slit valve assembly: Yes
Reminton hinge slit valve: Yes
Automatic control gate valve: No
Backing pump circuit breaker: Yes
RF Generator power outlet: Yes
RF Generator circuit breaker: Yes
Magnet driver: No
Lamp driver: Yes
RF Match: Yes
Turbo controller: No
Turbo flow meter: No
Gate valve: No
Chuck type: Other susceptor
Chamber B:
Chamber type: CVD
Lid type: STD
Chamber rough line: Yes
Chamber airline: Yes
Chamber interconnect PCB: Yes
Heat exchanger QD fitting: Yes
Neslab facilities plumbing: Yes
Slit valve assembly: Yes
Reminton hinge slit valve: Yes
Automatic control gate valve: No
Backing pump circuit breaker: Yes
RF Generator power outlet: Yes
RF Generator circuit breaker: Yes
Magnet driver: No
Lamp driver: Yes
RF match: Yes
Turbo controller: No
Turbo flow meter: No
Gate valve: No
Chamber vent valve: Yes
Chuck type: Other susceptor
Chamber C:
Chamber type: MxP
Lid type: STD
Chamber rough line: Yes
Chamber airline: Yes
Chamber interconnect PCB: Yes
Heat exchanger QD fitting: Yes
Neslab facilities plumbing: Yes
Slit valve assembly: Yes
Reminton hinge slit valve: Yes
Automatic control gate valve: Yes
Backing pump circuit breaker: Yes
RF Generator power outlet: Yes
RF Generator circuit breaker: Yes
Magnet driver: No
Lamp driver: Yes
RF match: Yes
Turbo controller: Yes
Turbo flow meter: No
Turbo pump / controller type: Leybold
Gate valve: No
Chamber vent valve: Yes
Chamber D:
Chamber type: MxP
Lid type: STD
Chamber rough line: Yes
Chamber airline: Yes
Chamber interconnect PCB: Yes
Heat exchanger QD fitting: Yes
Neslab facilities plumbing: Yes
Slit valve assembly: Yes
Reminton hinge slit valve: Yes
Automatic control gate valve: Yes
Backing pump circuit breaker: Yes
RF Generator power outlet: Yes
RF Generator circuit breaker: Yes
Magnet driver: Yes
Lamp driver: No
RF match: Yes
Turbo controller: Yes
Turbo flow meter: No
Turbo pump / controller type: Leybold
Gate valve: No
Chamber vent valve: Yes
Remote frame:
Primary pump frame: No
Secondary pump frame: No
Stacked remote frame: yes
Stacked remote frame contents:
Heat exchanger
Ozone generator
(4) RF generators
Number of heat exchanger: 1
Water hoses: No
Hose fittings: QDC
Backing Pumps:
LL Chamber: No
Chamber A: No
Chamber B: No
Chamber C: No
Chamber D: No
RF Generators:
Chamber A: ENI 12A
Chamber B: ENI 12A
Chamber C: ENI 12A
Chamber D: ENI 12A
1992 vintage.
AMAT/APPLIED MATERIALS P5000氣相沈積反應器是一種尖端工具,可實現復雜、可重現、高效和經濟高效的薄膜沈積。AMAT P-5000具有龐大、集成和自動化的處理空間,可提供更大的周轉時間和更多的基板傳輸選項。APPLICED MATERIALS P 5000還利用AMAT行業領先的Aur等離子體源提供了改進的工藝能力、更高的吞吐量和更好地滿足不斷變化的行業需求。P-5000的設計目的是減少工藝時間和提高吞吐量,同時在廣泛的工藝流程中提供最佳的薄膜沈積。該系統采用CIVAX過程控制器,從一個緊湊、用戶直觀的平臺為用戶提供對整個沈積過程的控制。它可用於設置、監視和調整最多四個腔室的參數,以及存儲供以後訪問的配方。AMAT P5000還包括Auralens增強型沈積頭,為一系列薄膜提供有利的均勻沈積和保形覆蓋。AMAT P 5000創造了高精度的薄膜,具有極好的均勻性。它為所有薄膜應用提供了可重現、可靠的性能,最終滿足了高性能薄膜的要求。該系統擴大基板尺寸範圍,可以容納矩形和圓形基板,從小晶片到8英寸和100毫米光盤。APPLIED MATERIALS P-5000具有擴展的源靈活性,允許用戶自定義沈積過程。應用材料氣相沈積源使薄膜能夠利用無機薄膜和稀有化學前體化合物進行化學氣相沈積(CVD)。該系統還提供了AMAT/APPLIED MATERIALS PlanarMax等離子體源,這是一種平面等離子體源,旨在最大程度地減少相鄰井上的不良沈積。AMAT/APPLICED MATERIALS P 5000氣相沈積反應器是一種自動化工具,它提供了改進的工藝能力、更高的吞吐量和更好的滿足不斷變化的行業需求,同時還在廣泛的工藝過程中提供了最佳的薄膜沈積。它具有擴展的源靈活性和增加的基板尺寸功能,允許用戶在所有薄膜應用中實現具有出色均勻性、可重現和可靠性能的高精度薄膜。
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