二手 AMAT / APPLIED MATERIALS Producer III #9223648 待售

ID: 9223648
晶圓大小: 8"
優質的: 2004
Shrink system, 8" Process: SILCU CIM (3) Twin chambers Hardware configuration: SMIF: (4) ASSYST Indexers Handler system: SMIF Front end robot VHP Buffer robot (3) Process chambers Heat exchanger: Steelhead High RF generator: (4) RFG 2000-2V DPA RF Generator: ENI DPG-10 Platform type: Producer shrink Chamber A & B & C: Chamber body effective volume (Syscon): Chamber A: 12980 Chamber B: 13275 Chamber C: 13300 SiH4_H: 1 SLM SiH4-L: 300 Sccm NH3 HI: 1 SLM N2O HI: 3 SLM N2O LO: 500 Sccm N2: 10 SLM NH3: 500 Sccm Ar: 5 SLM He: 10 SLM Number of gas lines / Name: 10 RF1 & RF2 Generator (Max Power / Brand): 2000 W Foreline pump (EBARA AAS 100WN): 10000 L/Min Baratron off-set 626 MKS: 10 T Lift pin type: Free drop Lift pin speed (Timing of movement): 3580 Load lock: A & B Configuration: Pump capacity (EDWARDS BOC): IPX 100A Difuser: ENTEGRIS 60 PSIG Venting N2 flow rate: 10 SLM Venting time: 57 Sec Pump time: 65 Sec Baratron Range / Brand / Off-Set: 325 Moducell MKS Pressure set point for LL pumping switching: 45 Sec Time delay for LL door open: 10 Sec Transfer chamber: Type of robot / Robot blade: Super blade Robot speed with wafer / Runrate / Slope: 300000 / 210000 230000 / 120000 Robot speed without wafer (Ext/Rot): 200000 / 325000 230000 / 325000 MFC N2 Flow setting: 10 SLM Chamber base pressure ( Actual / Alarm): 208 mTorr Wafer transfer - chamber: 300 mTorr Buffer pressure transfer chamber - wafer: 320 mTorr Other periphere: SiH4 HI: 29.6, 30, 36 NH3 HI 27.6, 27.8, 29 CDA Pressure: 85 HX Temperature / Flow rate: 75 N2 (P): 27 SiH4 LO NH3 LO N2O: 30 NF3 2004 vintage.
AMAT/APPLIED MATERIALS Producer III是制造半導體晶片的先進等離子體反應器。AMAT Producer III利用電子回旋共振(ECR)源創建了一個均勻、高密度的等離子體,這對於芯片生產中沈積多晶矽柵極電介質和銅互連等薄而精確的材料層至關重要。APPLIED MATERIALS Producer III設計允許對現有系統進行最佳的過程控制。其專利晶片密閉體積和低噪聲技術在晶片的每個區域保持極均勻的沈積。生產者III也極具能源效率,功耗降低,附帶熱量開發最小。所有這些組合使得AMAT/APPLIED MATERIALS Producer III能夠改善半導體制造商的芯片生產實踐。AMAT Producer III以以前的AMAT Producers I和II為基礎,增加了幾個關鍵功能。它提供了兩個獨立的射頻電源,可以從晶圓的底部和頂部獨立控制沈積,允許超過200層的生長。它還配備了專有的UHP(Ultra High Pressure)系統,保持超均勻氣體流過晶圓,更精確地調節工藝條件。應用材料生產商III也允許高度的靈活性沈積.它可以將統一的薄膜應用於整個晶片或根據應用程序選擇區域。每個區域都有可編程的參數,可以針對各個沈積過程進行調整,允許用戶自定義設計過程。它還具有高級診斷和數據日誌記錄功能,可以對進程進行脫機分析。生產者III是一種高度先進的等離子體反應器,旨在提供最精確和可重復的沈積結果。隨著工藝控制、靈活性和能效的提高,AMAT/APPLIED MATERIALS Producer III為芯片制造工藝提供了無與倫比的支持。
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