二手 DISCO DFD 6340 #9229956 待售

Wafer dicing saw, 12" Workpiece size: 12" Maximum blade size: 61 mm Air bearing spindle: 1.0 kW Synchro spindle Facing dual-spindles Graphical user interface: Intuitive operation Process method: Dual cut Step and bevel cut X-Axis: Useable stroke: 310 mm Cut speed: 0.1~600 mm/s Y-Axis: Useable stroke: 310 mm Indexing step: 0.0001 mm Position accuracy (cumulative pitch): Less then 0.003/310 mm Position accuracy (single pitch): Less then 0.002/5 mm Scale resolution: 0.0002 mm Z-Axis: Maximum cutting stroke: 14.7 mm (for φ2" Blade) Minimum step: 0.00005 mm Repeating accuracy: 0.001 mm Maximum blade size: 60 mm Θ-Axis: Rotation angle (max.): 380° Spindle: Output: 1.0 kW Maximum revolution: 60,000 min^-1(rpm) Applicable tape frame: 2-8-1 2-12 Utilities: Power supply: 3 Phase, 200V, 50-60Hz Power consumption: When processing: 2.2 kW During warm-up: 1.8 kW Maximum power: 6.9 kVA Air pressure: .05~0.8 (5.0~8.0) (Mpa(kgf/cm²)) Air flow rate: 378 L/min(ANR) N2 Pressure range: 0.5~0.8 (5.0~8.0) Mpa (kgf/cm²) N2 Maximum consumption: 216 (L/min(ANR)) Water pressure: Cutting water (Cleaning water): 0.2~0.4 (2.0~4.0) Mpa (kgf/cm²) Cooling water: 0.2~0.4 (2.0~4.0) Mpa (kgf/cm²) Water flow rate: Cutting water: 12.0 (L/min) Spinner cleaning water: 1.0 (L/min) Water curtain: 1.0 (L/min) Cooling water: 3.0 (L/min) Duct required suction: 5 (m³/min).