二手 DISCO DFL 7161 #9220486 待售
看起來這件物品已經賣了。檢查下面的類似產品或與我們聯系,我們經驗豐富的團隊將為您找到它。
單擊可縮放
已售出
ID: 9220486
優質的: 2011
Fully automatic laser saw
(3) Chucks table, 6"
Field of application: Germanium wafer
Process chamber (Glass)
Coating and spinner (Porous)
Configured for cutting semiconductor substrates
Running hours: 383
Standby hours: 30,640
Laser head hours: 3743
Laser:
COHERENT AVIA 355-28 Power curve
Type-K with BSS4 Optical system
Head hours: 3,743
Nozzle: K-02
Pulse: ~30 ns
28 W of 355 nm at 110 kHz
E-Beam
Perm align solder-bonded optics technology
Aluminum-Free Active Area (AAA) (Diode material)
Field replaceable pump diode modules
Smart power supply with RS-232 interface
Pulse control system
HGX UV Generation technology
ThermEQ For uniform pulse energy across a burst of pulses
PulseEQ For locked pulse energy across a range of pulse repetition rates
PulseTrack For on-the-fly pulse energy control
Wavelength: 354.7 nm
Average output power:
26 W at 90 kHz
28 W at 110 kHz
23 W at 150 kHz
18 W at 180 kHz
Nominal repetition rate: 110 kHz
Beam optimization: 110 kHz
Motorized crystal shifter: 75 Spots/300 hours
Pulse repetition rate single-shot: 300 kHz
Pulse-to-pulse stability (Up to 140 kHz): <5% (1σ rms)
Average power stability (Over 8 hours): <2% (2σ rms)
Polarization ratio²: >100:1 Horizontal
Spatial mode²: TEM00 (M2 <1.3)
Beam divergence full angle²: (mrad): <0.3
Pulse width: <40 ns Up to 110 kHz
Beam pointing drift³: <25°C/μrad
Near-field pointing and rep. rate with posilock: 50 μm
1/e² Beam diameter²: 3.5 ±0.35 mm
Beam circularity: >85%
Warm-up time:
Standby mode: <15 Minutes
Cold: <40 Minutes
Bore-sight accuracy: ±0.5 mm and ±5 mrad
RoHS Compliant
Utility:
Single phase operating voltage: 100 to 240 VAC (Auto ranging)
Line frequency: 50/60 Hz (Auto ranging)
Laser power consumption: 900 W, 1.7 kW Maximum
Missing housing components:
LPAC-022222-1 Cover (R, F)
(2) LPAC-022223-3 Covers (R, B-R)
LPAC-022151-2 Cover (F, L)
2011 vintage.
DISCO DFL 7161是一款為精密晶圓半導體加工而設計的塗抹和切丁設備。它具有雙掃描雙激光技術和每個激光束獨立的橫軸。這使它能夠在高精度公差範圍內創建精確的網格模式,並且適用於各種過程。DISCO DFL7161具有較高的光路設計,允許使用各種晶圓尺寸,並且可以連接到用於化學機械拋光(CMP)的設備以及其他晶圓工藝。它具有集成的設計,無需夾具,有助於提高生產效率,同時其高速處理能力確保它能夠跟上最新的半導體生產過程。DFL 7161有一個特殊的功能,不需要工程師監控對齊過程,允許操作員最小化設置和校準時間。它還可以配備增強的激光控制單元,以減少激光像差,輕松控制多個激光器。這種劃線和切割系統還支持自動補償功能,自動檢測晶圓表面差異並相應補償。激光功率調節裝置能夠根據不同晶片類型調節激光功率,對每個晶片的切削精度進行微調,確保產生最一致的切削。DFL7161是一種經久耐用的機器,可承受長期運行並符合ISO 14001環境規範。它具有出色的可用性和支持,使其易於與其他工具集成。此外,還優化了排放間隔管理,以減少浪費和控制成本。DISCO DFL 7161是精密半導體加工必不可少的塗抹和切碎機。它的雙激光技術、精度公差和自動補償能力使其非常適合創建高生產效率的精確網格模式。此外,它的可靠性和易操作性使得它成為任何一條半導體生產線的巨大投資。
還沒有評論