二手 CPA 9900-1 #9173304 待售
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ID: 9173304
Horizontal in-line sputtering system
Process parameter control ranges:
Sputtering pressure: 5 microns to 30 microns
Conveyor speed: 0.1 to 80 cm.min
D.C. Deposition power level: 100 to 9000 watts
R.F. Deposition power level: 50 to 3000 watts
R.F. Sputter clean power level: 15 to 1000 watts
Substrate heating: Inline heating is variable from ambient to 350°C
Uniformity performance:
(Across 12” sputter zone)
Etch: ±10%
Deposition:
R.F. Magnetron ±10%
D.C. Magnetron ±5%
Vacuum performance:
Ultimate pressure (total system):
2X 10(-7) in 16 hours clean, dry and empty
5 x 10(-7) in 30 minutes
Rate of rise:
More than 6 minutes to 1 x 10(-4) torr clean, dry and empty
Vacuum tight: Less than 5 x 10(-10) standard atmosphere cc helium/second
Optional features:
Multiple cathodes
Multiple power supplies
DC and RF in any mix
With / Without sputter etch
With / Without substrate heating
Turbo pump Hi-Vac
Cryo pump Hi-Vac
Sputter up / Sputter down
With / Without load lock
Various numbers of process gases
Rail bias
Installed RGA
With / Without window shutters
Unequipped chamber for future expansion
Target assembly sizes: 15”, 22”, 35”, and 50”
Utility requirements:
Power:
208 V
100 Amps
3 Phase
50 / 60 Hz
4 Wire delta
5 Wire wye
Water temperature: 50° - 75° F (10-24°C)
Air: 70 to 100 PSIG (6 to 8 ATU) filtered 1 CFM
Sputtering gas: Typically 5 PSIG (1.3 ATU) Argon.
CPA 9900-1濺射設備是適用於各種塗層和PVD(物理氣相沈積)應用的通用耐用解決方案。該濺射系統利用大功率平面磁控管濺射源將目標材料薄膜沈積到基板上,既具有高均勻性,又具有優良的目標材料利用率。9900-1也是市場上最快的濺射系統之一,每分鐘沈積速率可高達300 nm。該單元的濺射源可以針對各種基板的操作量身定制,包括陶瓷、玻璃、矽和金屬等多種材料。CPA 9900-1利用渦輪分子真空泵和創新的冷卻機來實現1x10-7 Torr的高真空壓力。該工具還具有尺寸為10.7x7.2英寸的大工作區,使其能夠加工更大的基板。此外,9900-1還包括一些自動化功能,如自動沈積厚度監測儀,能夠實時測量沈積厚度,並相應調整參數以提高均勻性。此外,資產還具有若幹安全功能,包括緊急停止按鈕和在操作過程中出現問題時的保護室。總之,CPA 9900-1為各種曲面和PVD應用程序提供了可靠且始終強大的濺射解決方案。它能夠處理大型基板,並可以使用其高功率的平面磁控管濺射源以高達每分鐘300 nm的速度沈積目標材料。9900-1具有眾多的自動化和安全功能,是尋找功能強大且用途廣泛的濺射模型的用戶的理想選擇。
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