二手 MRC / TEL / TOKYO ELECTRON Eclipse Mark IV #9288402 待售

看起來這件物品已經賣了。檢查下面的類似產品或與我們聯系,我們經驗豐富的團隊將為您找到它。

ID: 9288402
晶圓大小: 4"-6"
PVD System, 4"-6" Controller upgraded Power supply: 10 kW (3) PVD chambers (1) Etch chamber Ultra high vacuum system Atmospheric wafer handler Electronics and control system Wafer standard: SEMI Wafer handling: Standard wafer handling of fragile wafers Chamber 1: ICP Power supply: RF Generator Ar Entry: Door injection Shield type: (2) Shields Shield treatment: Stainless steel Backplane: Non-contact single zone Chamber 2: Titanium Nitride (Ti/TiN) Process kit type: TiN (RMX-10) Target type: Solder Bnd Cathode type: RMX-10 Power supply: 10 kW Tap setting: 3 T/S Spacing, 2.5" Ar Entry: Door injection Regas type: N2/1000 sccm Shield type: (2) Shields Shield treatment: SS Plasma spray Darkspace: 0.062" Backplane: Non-contact single zone Chamber 3: Aluminium (AlCu) Process kit type: Al (SPA-10) Target type: Single piece Cathode type: SPA-10 Power supply: 20 kW Tap setting: 2 T/S Spacing, 2.0" Ar Entry: Door injection Shield type: (2) Shields Shield treatment: Stainless steel Darkspace: 0.062" Backplane: Non-contact single zone Chamber 4: Molybdenum (Mo) Process kit type: Mo (RMX-10) Target type: Solder bond Cathode type: RMX-10 Power supply: 10 kW Tap setting: 2 T/S Spacing, 2.5" Ar Entry: Door injection Shield type: (2) Shield s Shield treatment: SS Plasma spray Darkspace: 0.062" Backplane: Non-contact single zone Standard chamber configuration: 8F Cryo pump MKS Mass flow controllers RGA Valve set: V4 Conflat (3) Position gate valves Non-contact backplane heaters Frontplane: S/F Vent Pod shields Mainframe options: Wafer holders with ceramic latches Edge exclusion: 1.5 mm Laminar blowers Filters SECS/GEM Communication Wafer mapping control Clamp rings: Full face Stainless steel Facilities options: Line frequency: 208 V Line voltage: 60 Hz Power rack cable length: 30 ft Cryo compressor lines: 30 ft Bottom feed utility lines Other options: Manuals OEM Controller Alignment tools System shields: ICP, Ti, AICu, Mo (5) Clamp ring wafer holder assemblies Bell jar assemble.
MRC/TEL/TOKYO ELECTRON Eclipse Mark IV是一種用於材料科學的全自動濺射設備。設計用於薄膜沈積、表面改性和納米結構制造等原位應用。該系統配備了先進的濺射槍,可以精確控制薄膜的沈積速率、輪廓和厚度。它還能夠有多個加工截面,允許不同材料在基板的不同區域平行沈積。MRC Eclipse Mark IV利用大功率RF/DC電源,頻率範圍為0至13.56 MHz。該裝置的可用功率範圍為1至1,500 W。多個濺射區允許沈積在基板的不同部分,每個區域的通量不同。濺射槍利用圓柱形磁控管源,並配有防撞罩,防止離子在源周圍堆積。負載鎖定單元用於基板傳輸,可快速處理大型基板。該機采用精密可編程邏輯控制器(PLC)進行編程,以控制濺射槍的運動和操作。PLC可以編程為優化過程控制,為用戶提供了一個快速獲取所需薄膜特性的高效平臺。此外,該工具還具有一個帶粗加工的真空室和一個渦輪分子泵,可實現超高真空和易於操作。TEL Eclipse Mark IV也擁有先進的硬件和先進的監控系統。這些系統能夠實時監測沈積過程的壓力、溫度和功率。這允許精確控制沈積參數,以提供可重復的過程和可靠的薄膜。該資產還具有觸摸屏用戶界面,可直觀操作和控制模型。總體而言,Eclipse Mark IV是一種最先進的濺射設備,專為各種薄膜沈積應用而設計。它擁有高度精確的運動控制系統、先進的監控系統和人性化的界面,非常適合薄膜材料的研發。
還沒有評論