二手 PROVAC PAS200T #9116850 待售

High vacuum sputtering system, 12" Square wafers up to 8" x 8" can be coated with a distribution of < + -5% Automatic loading and unloading Substrates to be processed are picked up from the respective cassettes by robot handling and placed on the coating tables Substrates subsequently evacuated and moved into the process chamber Throughput: ≤ 48 wafers per hour Maximum temperature of panels: 130°C Si-sputtering: Film thickness distribution: < + - 10% Reproducibility: < + - 5% Automatic process control Pump set: High vacuum valves in front of the turbo pumps, one turbo pump each for the process chamber and each load lock Magnetron: 1 x 16" ONYX-cathode with rotary magnet Pulsed DC magnetron power supply Silicon target 16" High vacuum inline Process chamber (2) Load locks Robot handling Basic frame Size of PC rack: integrated within the frame Electric supply: (3) phases, full load capacity N, PE Electrical connection data: Voltage: 3 x 400V / 230V AC / ± 10% Frequency: 50 or 60Hz ± 1% Voltage: 35A Currently warehoused.