二手 AMAT / APPLIED MATERIALS CMP 3600 #9160608 待售
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ID: 9160608
晶圓大小: 12"
優質的: 2002
Reflexion system, 12"
General features:
(4) Titan heads
(3) Platen systems
Operator interface with monitor and keyboard
Windows NT based software control
Integrated electronics control cabinet
Integrated applied materials factory interface on four-wide frame
Integrated mesa cleaner including two brush scrubber modules
Spin rinse dry module
CD ROM
Wafer type: Notch P/N 36-0103
Reflexion polisher type:
Reflexion CMP poly system: P/N 36-0004
Software use license: P/N 36-1001E
CMP System:
Consumed process materials:
Politex pads: P/N 36-1022
(2) IC1000 pads: P/N 36-1020
Metrology:
Digital in situ removal monitor (ISRM) on cach platen
Full scan ISRM on 3 Platens: P/N 36-5153
System regulation compliance: P/N 36-9801
Polisher options:
Platen and head options:
Clear windows on skins for polisher: P/N 36-5732
(4) UPA zones
Profiler UPA: P/N 36-2039
Wafer loss sensor for dark pads: P/N 36-7939
With 50' cable
Neslab S2HCFC-Free HX300: P/N
AMAT Supplied platen temperature control
Facilities options:
System safety equipment
31” cleaner workspace: P/N 36-0115
Electrical requirements
200-230VAC 50/60Hz, input voltage: P/N 36-0119
Factory hookup:
Cleaner drain manifold - 2 lines (1 slurry, 1 reclaim): P/N 36-0121
Operator interface options:
User interface:
4 Color light tower, front of FI: P/N 36-0124
Vertical flush mounted
RYGB
LED lamp
Cleaner for CMP reflexion system
Module 1 (Megasonics):
Megasonics: P/N 36-0502
Pressurized LDM: P/N 36-0503
Supports chemicals:
A: High dilution 29% NH4OH B: 30% Hydrogen peroxide (H202)
A: High dilution 29% NH40H B: 0.5% NCW-601A surfactant
Module 2 & 3 (Brush scrubber modules):
Brush scrubber modules
(2) RIPPEY microclean brush: P/N 36-1679
(2) Direct feed LDM: P/N 36-0514
Supports the following chemicals;
0.05% -0.1% Ammonium hydroxide (NH40H)
0.5%-l% Hydrogen fluoride (HF)
200:1 Electroclean
Pre-mixed SC-1
Pre-mixed proprietary chemical
Module 4 (Spin rinse dry):
Rinse with lamp dry: P/N 36-0519
Factory interface options:
Integrated applied materials factory interface with
25-Wafer FQUP load ports
Upper E84 Sensors and cables
(2) Operator access switch: P/N 36-0260
Boron-free ULPA filter: P/N 36-0270
Four-wide factory interface frame with two load
Ports: P/N 36-0350
Load Ports in positions 1 and 3.
(2) E99 Carrier ID, keyence (BCR FOUP ID reader): P/N 36-0258
Additional options:
System manuals:
CD ROM manual set: P/N 36-0128
Cleanroom reflexion manual set: P/N 36-0130
(English) printed on cleanroom paper
Additional items:
Generic monthly consumables kit: P/N 36-78300
Includes:
(16) O-ring
(2) Filters
(3) DDF3 Diaphragm
Pad conditioner head assembly: P/N 36-7550
Set up / maintenance options:
Polisher to cleaner alignment fixture: P/N 36-8211
Alignment and leveling tool kit (FI – Datum Gauge): P/N 36-0142
Factory interface service lift: P/N 36-0245
One year PM kit: P/N 36-8979
Walking beam alignment tool: P/N 36-2535
Wet robot calibration tool: P/N 36-6141
Spares:
(10) Brush disk: P/N 0020-78263
ECO 10424 - REV1P
Kit, option 3 slurries AB-AB-AC: P/N 0240-15146
Configuration:
Kit, option brush and adapter for pad: P/N 0240-16013
Conditioner, reflexion
Option kit, user interface, flat panel, Wall mounted for TTW reflexion: P/N 0240-06004
(4) 300mm Titan heads: P/N 36-5675
Retaining ring: Grooved PL PPS
Membrane support plate: 0.5 inch, 0mm Edge bump, WAS
Support pad: 0.5 inch Perf holes
Edge control ring: 11.434 inch OD
Upper ASM: A-2-50
Membrane: Neoprene
Dry nova 3030: TEMPNSR-03
300MM Titan head with grooved: TEMPNSR-04
Retaining ring
CE Marked
2002 vintage.
AMAT/APPLIED MATERIALS CMP 3600是一種晶圓研磨、研磨和拋光設備,專為各種晶圓類型和尺寸的內部對準結構的自動化、高精度研磨和精加工而設計。它能夠將晶片表面拋光至納米級精度和高表面質量,確保晶片校正各種工藝條件下的任何幾何對準誤差。AMAT CMP 3600配備15英寸。研磨/拋光板,4英寸。原位計量系統,一個25G力LPU,和一個雙區研磨板組件。LPU的設計目的是通過在磨削和拋光過程中對整個晶片表面施加精確的受控力來防止微裂紋的形成。原位計量單元允許在研磨和拋光過程中實時監測晶圓特性,降低失真風險,確保高質量的最終結果。APPLICED MATERIALS CMP 3600是由堅固的材料製造而成,設計成可以長時間連續運行,不需要任何重大的維護要求。該機還配備了自動晶片檢查和電化學表面清潔能力,以確保一貫的高質量效果。CMP 3600的控制通過高級臺式機PC和基於Windows的GUI進行,從而使操作工具變得簡單高效。它還方便地配備了局域網和MODBUS網絡接口,用於遠程操作或多資產集成。AMAT/APPLIED MATERIALS CMP 3600采用金剛石基研磨和拋光漿料,在各種各樣的晶圓類型和尺寸上生產高質量的表面。該模型包括超精密幻燈片、雙區域研磨板組件和集成過程控制硬件,以提供最大的靈活性和準確性。AMAT CMP 3600是各種晶圓制造工藝的理想選擇,包括蝕刻、剝離和圖案化應用。它能夠制造具有納米級精度的復雜結構,確保嚴格的公差和高的工藝產量。
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