二手 AMAT / APPLIED MATERIALS Mirra 3400 #9411057 待售
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ID: 9411057
優質的: 2001
CMP System
Wet robot
Wet queue tank: Q-Tank with lift
System skins: Clear skins
Load cup: Full contact HCLU
Performance enhancement:
Pad conditioner head 1-3 with screw type DDF3
Factory interface:
Platen 1 ISRM: Legacy
Platen 2 ISRM: Legacy
Platen 3 ISRM: Legacy
SECS GEM Interface
Polisher:
No polishing head 1-4
Upper Pneumatics Assembly (UPA): Profiler
No UPA relocation
Pad wafer loss sensor: Dual sensor
No platen temperature control and cable
No upper platen coating
Grease platen gear assembly
Slurry delivery: Peristaltic pump
Standard slurry flow rate
Slurry dispense arm:
4-Line slurry arm
High pressure rinse
DI Water
Slurry tube
Facilities operations:
EMO guard ring
No EMO IO
System user and labels: English
No LOTO Box
Smoke detector
Polisher slurry leak sensor
Electrical requirements:
Line frequency: 50 HZ
Line voltage: 200/208 VAC
Power lamp: Green lamp
No power connected lamp
Circuit breaker: 200 A
Controller top panel: Holes punched out for AC Power cables entry
No configurable IO
GFI Type: 30 mA
No isolation transformer
Umbilical's:
CAT Track style: Cascading
Polisher to controller cable
Controller to monitor cable: 50 feet
Factory hookup:
Upper exhaust
Upper exhaust material: Stainless steel
Lower exhaust
Process exhaust: Vent interlock sensor
No flange upper exhaust connection
Drain manifold: 1 Line
Operator interface:
No Hard Disk Drive (HDD)
Memory: 128M
PIII CPU
Operating system: Windows NT
Polisher light tower:
Pole mounted type
Polisher tower: (3) Colors
Lamp type: Incandescent
Colors sequence: RYG
Controller light tower:
Pole mounted type
(3) Colors
Lamp type: Incandescent
Color sequence: RYG
2001 vintage.
AMAT/APPLIED MATERIALS Mirra 3400是晶圓研磨、研磨和拋光設備,專門設計用於半導體制造業。系統采用多級拋光單元,包括旋轉水平晶片架和金剛石磨輪。該機能夠生產出極高質量的表面飾面,表面光滑,微粗糙度值低。AMAT Mirra 3400的主要部件是主機、傳輸單元和集成過程控制工具。大型機配備了10 HP的電動機,可調速高達2000 rpm。轉移單元包括兩個伺服電動機,允許晶圓及其相關基板的材料自動處理。這樣可以確保晶片在研磨或拋光時的精度和精確度。集成過程控制資產能夠控制磨削、研磨和拋光過程,以及存儲各類晶片的參數和配方。APPLIED MATERIALS Mirra 3400可以容納各種晶圓尺寸和厚度,從1英寸到8英寸。該型號還具有內置的安全特性,以保護晶片的完整性。晶片經過分階段研磨/研磨,從粗到細取決於晶片的表面光潔度要求。研磨完成後,再用拋光溶液拋光晶片,再用細研磨或拋光化合物完成。該設備能夠實現非常緊密的公差和表面粗糙度值,在1-2 µm的範圍內,使其適合生產高質量的晶片。該系統還利用自動真空技術幫助減少汙染,從而提高產量。總體而言,Mirra 3400是一個可靠的設備,它提供數據記錄和後處理功能,以確保成品的質量。該機器能夠產生非常平滑的結果,具有緊密的公差,使其成為半導體工業的理想選擇。
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