二手 AMAT / APPLIED MATERIALS Mirra Mesa #9222045 待售
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ID: 9222045
晶圓大小: 8"
優質的: 1997
CMP System, 8"
Technology: CMP STI
Wafer shape: Flat
Application information:
Application: Oxide
System: Dry in / Dry out
Device type: D-RAM
Device geometry: 0.13 Microns
Consumed process materials:
Polish slurry: STI
Platen 1 pad: IC1010
Platen 2 pad: IC1010
Platen 3 pad: IC1010
Pad conditioner: Diaphraghm
Pad conditioner head: DDF3
Pad conditioner holder: Standard
Factory interface options:
Cleaner type: MESA (Converted from reflexion)
Megasonics
Robot type: AMAT
In situ removal rate monitor: Digital
SECS GEM Interface
Cassette tank
Open cassette
Integrated system basic: Fabs 212
Platen and head options:
Polishing head: (4) TITAN I Heads
(4) Retaining rings
Pad wafer loss sensor
Slurry delivery options:
Slurry delivery: (2) Slurries by peristalic pump
Slurry flow rate: STD Flow
Slurry flow monitor
Slurry containment bulkhead
Slurry loop line: No
Slurry dispense arm: Extendad rinse arm
Slurry leak detector: No
DI Water
High pressure rinse
Umbilicals:
Polisher to controller cable: 30 Ft
Controller to monitor cable: 30 Ft
Factory hookup:
Upper exhaust: Standard
Upper exhaust connection: 8"
Drain manifold: 4 Line to Fac
Drain adapter: NPT Fitting
Castors for mirra system: No
Weight distribution plate (Skid pad)
User interface:
Stainless cart
PC Mouse
Hard disk backup: No
Polisher / Fabs light tower:
Tower mounting type: (4) Lights
Tower colors sequence: RYGB
(4) Tower colors
Cleaner option: Mesa cleaner
Maintenance options:
Spray gun: Single
Lapping stone: No
Special options:
Nylon brush: No
E-Chain teflon sheet: Water fall
Low pressure release water: No
Mesa:
Direct checm type:
Megasonic module
Brush 1
Brush 2
Standard:
SRD
Output station
Electrical requirements:
Line voltage: 200~230V
Line frequency: 50/60 Hz
Delta connection
Power lamp: Green
Power connected lamp: No
Circuit breaker: 200A
AC Outlet box: 100V
Configurable I/O: No
Wide type GFI: 50mA
1997 vintage.
AMAT/APPLIED MATERIALS/AKT Mirra Mesa是一種自動化晶片研磨、研磨和拋光設備,用於為先進的薄膜工藝制備半導體晶片。它能夠在單一系統中研磨、研磨和拋光晶片,不需要多件設備。AKT Mirra Mesa是一個最先進、高效的單位。其特點包括全自動研磨、研磨和拋光循環時間,以及晶圓的機器人裝卸,以及全局命令和控制。它提供高吞吐量、高質量的結果,每小時最多可以處理200個晶圓。該機器能夠研磨、研磨和拋光直徑達8英寸的晶片。其拋光工藝可確保表面光滑、無缺陷且具有超低K值,這對於需要額外薄膜的設備至關重要。該工具還利用MultiGrit™技術,將所需的拋光步驟數量降至最低,並確保均勻的表面光潔度。AMAT Mirra Mesa可配置,以滿足每個流程的特定需求。它的模塊化設計允許與現有流程輕松集成,而其高效率的操作使擁有成本降至最低。此外,它還可以與操作員控制臺以及其他計算機連接,以最大限度地提高資產效率。型號也高度可靠;其自我監控和自我校準功能可減少停機時間。還建立了保護人員和晶圓的安全系統。總體而言,應用材料Mirra Mesa是一種高效、先進的晶圓研磨、研磨和拋光設備,能夠產生高度一致的結果。它的可配置性、高吞吐量和低擁有成本使其成為當今要求最苛刻的半導體工藝的理想選擇。
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