二手 AMAT / APPLIED MATERIALS Reflexion LK #9005426 待售
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ID: 9005426
晶圓大小: 12"
優質的: 2010
Copper CMP system, 12"
Base System:
Reflexion LK 4 head, 3 platen polishing system, Dry in
Polisher Skins: Dark P1, P2, P3, and P4: 4910 compliant
Gap Wash: 120 degree nozzles
Load Cup Wafer Exchanger: Enhanced counter balance springs
Nova 3090 Ready: None
Monitor 1 Location Cart
Monitor 2 Location Ergo Arm type
Base System Light Tower: Factory Interface and Polisher Sides
Software:
LK Software Main system lp3B4.5_29
Factory Interface Front End fb4.9_14 Beta
ISRM / RTPC Endpoint system isB3.0_10
RTPC with within wafer uniformity control capability B3.0_11
Interface "A" High speed FDC data transfer: N/A
Nova 3090 Insitu Metrology System Software: No use
Wafer to Wafer iAPC: no use
Within Wafer iAPC: no use
Factory interface:
WIP Delivery Type OHT or manual delivery
FOUP Entegris F300
OHT Light Curtain LIGHT CURTAIN
E84 PI O Sensors and Cables: UPPER E84 SENSORS & CABLES
E99 Carrier ID TIRIS WITH RF
Docked E99 Reading Capability YES
Docking Flange Shield YES
Frame Configuration 4 WIDE
Load Ports Semi Compliant MENV and FIMS Assemblies
Load Port Operator Interface STANDARD
Load Port Types ENHANCED 25 WAFER FOUP
Operator Access Switch YES
Platen 1:
Platen Type: HIGH SPEED (<= 350 RPM)
Endpoint Full Scan Optical ISRM RTPC
Endpoint Motor Torque N/A
High Pressure Rinse Flow Meter 1350-00195 (4.6 l/min) FLOW METER ASSY 1/2OD 1.6-20LPM PFA
Rinse Arms High Pressure/Flow
Flow Meter 50-500 ml/min
Temperature Control Platen Cooling Water
Platen 2:
Platen Type: HIGH SPEED (<= 350 RPM)
Endpoint Full Scan Optical ISRM
Endpoint Motor Torque N/A
High Pressure Rinse Flow Meter: 1350-00195(4.6 l/min) FLOW METER ASSY 1/2OD 1.6-20LPM PFA
Rinse Arms High Pressure/Flow
Flow Meter 50-500 ml/min
Temperature Control Platen Cooling Water
Platen 3:
Platen Type: HIGH SPEED (<= 350 RPM)
Endpoint Full Scan Optical ISRM
Endpoint Motor Torque N/A
High Pressure Rinse Flow Meter: 1350-00195(4.6 l/min) FLOW METER ASSY 1/2OD 1.6-20LPM PFA
Rinse Arms High Pressure/Flow
Flow Meter 50-500 ml/min
Temperature Control Platen Cooling Water
Polisher:
Polisher Technology SLURRY AND PAD
Polishing Head CONTOUR GEN III (0.5 TO 5.0 PSI)
Cross Break Pheumatic Box with Reverse Brake Logic
Pad Wafer Loss Sensor DARK PAD SENSOR
InterPlaten Clean Auxillary clean capability: No
ISRM Laser Key Switch Yes
Slurry Delivery System 5 x 10 CLC SDS
Head 1 Power Cable: 0150-16277 CABLE ASSY, HR1, DRIVER-MOTOR POWER, REF
Head 2 Power Cable: 0150-16278 CABLE ASSY, HR2, DRIVER-MOTOR POWER, REF
Head 3 Power Cable: 0150-16279 CABLE ASSY, HR3, DRIVER-MOTOR POWER, REF
Head 4 Power Cable: 0150-16280 CABLE ASSY, HR4, DRIVER-MOTOR POWER, REF
Head 1 Encoder Cable: 0150-16281 CABLE ASSY, 300MM, HR1, DRIVERRESOLVER
Head 2 Encoder Cable: 0150-16282 CABLE ASSY, 300MM, HR2, DRIVERRESOLVER
Head 3 Encoder Cable: 0150-16283 CABLE ASSY, 300MM, HR3, DRIVERRESOLVER
Head 4 Encoder Cable: 0150-16284 CABLE ASSY, 300MM, HR4, DRIVERRESOLVER
G4+ UPA Water rated valves: SMC UPA
G4+ UPA UPA Firmware: SMC UPA
Cleaner Meg:
MEGASONICS Delivery with onboard Mix
Transducer MEGASONICS Transducer
Chemical 1 CLC 1-250 ml/min
Chemical 2 CLC 1-250 ml/min
Brush box 1:
Brush LDM Type: TwoChemInLineMixed
Chemical 1: CLC 0~1250 ml/min
Chemical 2: CLC 0~1250 ml/min
Brush Box Level Spacer: 6mm Spacer for HH alarm reduction
Brush Box Shaft Enhanced tolerance shaft
Toe In Bracket design to allow for Toe In adjustment
Slow drain Plumb to main drain line
Brush box 2:
Brush LDM Type: TwoChemInLineMixed
Chemical 1: CLC 0~1250 ml/min
Chemical 2: CLC 0~1250 ml/min
Brush Box Level Spacer: 6mm Spacer for HH alarm reduction
Brush Box Shaft Enhanced tolerance shaft
Toe In Bracket design to allow for Toe In adjustment
Slow drain Plumb to main drain line
Dryer module:
Dryer Type VAPOR DRYER
Recovery Module CHEM DELIVERY TANK W/5 WAFER BRACKET
Output Station Dampner: Cap is Viton
2010 vintage.
AMAT/APPLIED MATERIALS Reflexion LK是一種高性能晶圓研磨、研磨和拋光設備,提供無與倫比的性能和可靠性。它設計用於處理包括矽、藍寶石和其他材料在內的多種基板。該系統由先進的多軸級組件組成,可實現晶圓以及超高通量大基板的精確索引、研磨、研磨和拋光。AMAT Reflexion LK的設計為基板工藝步驟提供了最大的靈活性和用戶控制,並實現了廣泛的應用,如晶圓變薄、背面拋光和表面制備。APPLICED MATERIALS Reflexion LK使用戶能夠調整研磨、研磨和拋光參數,以滿足運行和基板到基板的要求。這允許進行微調,以幫助根據用戶要求優化工藝結果,以達到一流的特征大小和曲面質量。此外,Reflexion LK還具有快速高效的基板方向變更功能,無需任何手動幹預即可從一個步驟過渡到另一個步驟。AMAT/APPLIED MATERIALS Reflexion LK包含廣泛的功能,旨在提高流程一致性、魯棒性和吞吐量。其中包括集成視覺單元、彈簧的主動調整以及高動態跨控制跟蹤(HDFA),它為關鍵流程應用程序提供了更高的拍攝均勻性。此外,AMAT Reflexion LK利用集成的校準實用程序,可減少長期漂移並提高性能隨時間推移的穩定性。APPLICED MATERIALS Reflexion LK的高性能環境提供了多種工藝和產品保護功能,以確保最優質的基板光潔度和可靠的循環後性能。這些特性包括噪聲最小化環境、主動儀器校準以及先進的冷卻機等,可將熱量從基板上散開以確保最小的熱應力。最後,Reflexion LK是一種用於晶圓研磨、研磨和拋光的功能強大的工具,可提供一致、可重復和可靠的結果。它提供最大的靈活性,以滿足各種基板和應用的獨特制造需求,同時提供各種工藝和產品保護功能,以確保最高質量的工藝結果和長期可靠性。
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