二手 DISCO DFG 82IF/8 #9374771 待售
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ID: 9374771
晶圓大小: 8"
優質的: 1995
Grinder, 8"
Grinding method: In-feed grinding with wafer rotation
Operating modes: Fully-automatic mode and manual mode
Spindle system:
Air spindle: 2-Axes (Single-spindle version selectable)
Direct drive high-frequency motor: 4.2 kW
1000-7000 RPM
Revolving speed / Electrical current real-time display function incorporated
Vertical stroke: 100 mm
Vertical in-feed speed range: 0.0001 to 5.000 mm / Sec
Vertical rapid feed speed: 600 mm / min
Maximum step of vertical displacement: 0.001 mm
Minimum vertical resolution: 0.05 µm
Angle adjustment: X / Y-Axis direction tilting mechanisms in the spindle housing
Height gauge:
Measurement range: 0-1000 µm
Resolution: 0.5 µm
Accuracy: 1 µm
Turntable:
Diameter: 500 mm
Index angle: 180° Reversible
(2) Tables
Wafer chuck table:
Type: Porous
Chucking method: Vacuum chucking
Revolving speed: 1-500 RPM
Applicable wafer size diameter: 8"
(2) Chuck tables per turntable
Settings for dwell after grind: 0-100 Revolutions
Chuck table cleaning: Back-flushing of water and compressed air is combined
With scrubbing by brush and oilstone
Grinding wheel: Diamond wheel, 8"
Wafer loading / Unloading:
Wafer carrier storage quantity: (2) Carriers parallel (Loader and unloader)
Spinner table: Water cleaning plus drying of both sides
Throughput: 60 Wafers / hr
Wafer size: 6"
Grinding depth: 20 µm
Accuracy:
Parallelism (TTV): 0.003 mm
Thickness variation between wafers: ±0.003 mm
Operating control:
Nonglare monitor: 12"
CRT Illumination color: White
Operation panel:
Composed of function keys
Numeric keys
Auxiliary keys
Cursor keys
Operating controls
Manual keyboard: Used for manual operations in which minute manipulation
(3) Relocated places: Center / Loader / Unloader
(13) Grinding / Cleaning water supply unit (Waste method type):
Tank capacity: 401 L (10.6 gal)
Water flow rate: 30 L/min (7.9 GPM)
Pressure: 3 kgf/cm² (42.6 PSI)
Filter: 5 µm
Water: Deionized water
Vacuum pump unit:
Air exhaust rate: 370/450 e/min (50/60 Hz at 160 Torr)
Pressure: 25 Torr
Motor rating: 1.5 kW
Water consumption rate: 5 L/min (1.32 GPM)
Water quality: City water
Alarm signal tower Colors: Green, orange, red
PC Output interface:
Data transmission mode: Full duplex
ASCII / JIS Codes
Data format: Start-stop system
Data rate: 4800 baud
Data signaling format: EIA RS-232C
Air pressure:
5.0 kgf/cm².G - 8.0 kgf/cm².G
71 psi.G - 113.6 psi.G
Pressure variation range: 0.3 kgf/cm².G (4.26 psi-G) or less
Blade hose: 15x22 mm
Flow rate: 500 N/min
Dew point: -15°C or Lower
Residual oil contents: 0.1 ppm wt/wt
Ground resistance: Class 3, 100Ω or less
Noise: 1000 V or Less at a pulse width of 500 NS (Square wave)
Dual-spindle version: 17 kVA
Power supply: 200 VAC ±10%, 3-Phase, 50/60 Hz.
1995 vintage.
DISCO DFG 82IF/8是一種晶圓研磨、研磨和拋光設備,能夠實現超精確的表面質量和高精度的步進研磨工藝。其直徑可達1000毫米的加工能力允許各種復雜的設備制造和薄膜生產應用。研磨、研磨和拋光工藝可手動編程用於定制設計。DISCO DFG-82IF/8配備了直觀、直觀、集成的用戶界面,可精確、直觀地控制所有應用程序功能。提供專門的夾具、工具和夾具,用於表面研磨操作,厚度不超過1 μ米。DFG 82 IF/8配備了兩個獨立的研磨模塊-一個用於研磨,一個用於研磨操作。每個模塊都配有變速電機,以便在運行過程中實現最優速度控制。這兩個模塊都可以與可選的自動進紙器系統配合使用,以提高效率和準確性。磨削模組配備了一系列可調節的磨料介質,晶圓尺寸可達1000毫米。提供了高質量的金剛石浸漬磨削工具,以實現最高的拋光質量和研磨公差。此外,磨削裝置還采用拋光籃機設計,在加工過程中達到理想的表面接觸。研磨模塊配有兩個單獨的電動平臺,用於+/-方向研磨運動。專門的研磨板配有各種砂粒和尺寸,以實現最高精度的優化結果。為DFG-82IF/8提供了必要的特性,以達到最佳的研磨、研磨和拋光效果,並易於操作。對於各種粒度和尺寸的研磨板,DISCO DFG-82I F/8可以產生超高質量的光學表面。此外,該工具設計緊湊,便於操作和暢通無阻地進入工作區,提供安全舒適的工作環境。
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