二手 DISCO DFG 82IF/8 #9374771 待售

看起來這件物品已經賣了。檢查下面的類似產品或與我們聯系,我們經驗豐富的團隊將為您找到它。

ID: 9374771
晶圓大小: 8"
優質的: 1995
Grinder, 8" Grinding method: In-feed grinding with wafer rotation Operating modes: Fully-automatic mode and manual mode Spindle system: Air spindle: 2-Axes (Single-spindle version selectable) Direct drive high-frequency motor: 4.2 kW 1000-7000 RPM Revolving speed / Electrical current real-time display function incorporated Vertical stroke: 100 mm Vertical in-feed speed range: 0.0001 to 5.000 mm / Sec Vertical rapid feed speed: 600 mm / min Maximum step of vertical displacement: 0.001 mm Minimum vertical resolution: 0.05 µm Angle adjustment: X / Y-Axis direction tilting mechanisms in the spindle housing Height gauge: Measurement range: 0-1000 µm Resolution: 0.5 µm Accuracy: 1 µm Turntable: Diameter: 500 mm Index angle: 180° Reversible (2) Tables Wafer chuck table: Type: Porous Chucking method: Vacuum chucking Revolving speed: 1-500 RPM Applicable wafer size diameter: 8" (2) Chuck tables per turntable Settings for dwell after grind: 0-100 Revolutions Chuck table cleaning: Back-flushing of water and compressed air is combined With scrubbing by brush and oilstone Grinding wheel: Diamond wheel, 8" Wafer loading / Unloading: Wafer carrier storage quantity: (2) Carriers parallel (Loader and unloader) Spinner table: Water cleaning plus drying of both sides Throughput: 60 Wafers / hr Wafer size: 6" Grinding depth: 20 µm Accuracy: Parallelism (TTV): 0.003 mm Thickness variation between wafers: ±0.003 mm Operating control: Nonglare monitor: 12" CRT Illumination color: White Operation panel: Composed of function keys Numeric keys Auxiliary keys Cursor keys Operating controls Manual keyboard: Used for manual operations in which minute manipulation (3) Relocated places: Center / Loader / Unloader (13) Grinding / Cleaning water supply unit (Waste method type): Tank capacity: 401 L (10.6 gal) Water flow rate: 30 L/min (7.9 GPM) Pressure: 3 kgf/cm² (42.6 PSI) Filter: 5 µm Water: Deionized water Vacuum pump unit: Air exhaust rate: 370/450 e/min (50/60 Hz at 160 Torr) Pressure: 25 Torr Motor rating: 1.5 kW Water consumption rate: 5 L/min (1.32 GPM) Water quality: City water Alarm signal tower Colors: Green, orange, red PC Output interface: Data transmission mode: Full duplex ASCII / JIS Codes Data format: Start-stop system Data rate: 4800 baud Data signaling format: EIA RS-232C Air pressure: 5.0 kgf/cm².G - 8.0 kgf/cm².G 71 psi.G - 113.6 psi.G Pressure variation range: 0.3 kgf/cm².G (4.26 psi-G) or less Blade hose: 15x22 mm Flow rate: 500 N/min Dew point: -15°C or Lower Residual oil contents: 0.1 ppm wt/wt Ground resistance: Class 3, 100Ω or less Noise: 1000 V or Less at a pulse width of 500 NS (Square wave) Dual-spindle version: 17 kVA Power supply: 200 VAC ±10%, 3-Phase, 50/60 Hz. 1995 vintage.
DISCO DFG 82IF/8是一種晶圓研磨、研磨和拋光設備,能夠實現超精確的表面質量和高精度的步進研磨工藝。其直徑可達1000毫米的加工能力允許各種復雜的設備制造和薄膜生產應用。研磨、研磨和拋光工藝可手動編程用於定制設計。DISCO DFG-82IF/8配備了直觀、直觀、集成的用戶界面,可精確、直觀地控制所有應用程序功能。提供專門的夾具、工具和夾具,用於表面研磨操作,厚度不超過1 μ米。DFG 82 IF/8配備了兩個獨立的研磨模塊-一個用於研磨,一個用於研磨操作。每個模塊都配有變速電機,以便在運行過程中實現最優速度控制。這兩個模塊都可以與可選的自動進紙器系統配合使用,以提高效率和準確性。磨削模組配備了一系列可調節的磨料介質,晶圓尺寸可達1000毫米。提供了高質量的金剛石浸漬磨削工具,以實現最高的拋光質量和研磨公差。此外,磨削裝置還采用拋光籃機設計,在加工過程中達到理想的表面接觸。研磨模塊配有兩個單獨的電動平臺,用於+/-方向研磨運動。專門的研磨板配有各種砂粒和尺寸,以實現最高精度的優化結果。為DFG-82IF/8提供了必要的特性,以達到最佳的研磨、研磨和拋光效果,並易於操作。對於各種粒度和尺寸的研磨板,DISCO DFG-82I F/8可以產生超高質量的光學表面。此外,該工具設計緊湊,便於操作和暢通無阻地進入工作區,提供安全舒適的工作環境。
還沒有評論