二手 EBARA Frex 300 #9017351 待售
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ID: 9017351
晶圓大小: 12"
優質的: 2004
Poly / STI CMP system, 12"
Factory Interface (FI):
Frame config: metro ready
Load-port type: (4) Asyst ISO
Pre-aligner
Wafer handling robot: track type with dual end effecter
Polisher (L/R):
Process (L/R): STI
Polishing heads: 300 mm AL head, gen. II
Endpoint: TCM and friction
Platen type (speed): ceramic (SIC), 10-150 rpm
Pad type: IC1000
Platen pad conditioner: scan dresser 4” disc (3M 5122-AB), sweep driven
Slurry delivery: closed loop (CLC) delivery
Slurry flow range: 25-250 mL/min (low flow rate)
Slurry line 1: HS-8800
Slurry line 2: none
Slurry line 3: none
Wafer slip-out sensor: yes
Wafer loss camera: no
Platen cooling flow monitor: Tokyo KEISO
Platen cooling temp monitor: user configurable alarm settings
Dresser DIW flow meter: flow range 1.0-1.5 L/min
Atomizer: yes
Endpoint (L/R):
Table current monitor (TCM): yes
Multi-process monitor ME20 for EPD: yes
Metrology option: none
Cleaner (L/R):
Cleaner 1 type: roller brush
¬ Note: no megasonic
¬ Chem. delivery type: (1) chem CLC 0.0-1.0 L/min (alarm capability)
¬ Chemical 1 upper flow meter: 0.0-1.0 L/min
¬ Chemical 1 lower flow meter: 0.0-1.0 L/min
¬ Chemical line 1: HF
¬ Chemical line 2: n/a
¬ Bevel edge cleaning: yes
Spin rinse dryer: pencil brush
¬ Chem delivery type: (1) chem CLC 0.0-1.0 L/min (alarm capability)
Options:
Robot D: Yaskawa
Robot R: Yaskawa
Robot L: Yaskawa
Status lamp (RYGB, front/rear)
Monitor 1: front
Monitor 2: L-side
Monitor 3: R-side
EPD monitor: R-side
Software:
Main SW ver: 7.5.02
CPU-1 (OS/9) ver: 7.5.02
CPU-2 (OS/9) ver: 7.5.00
Touch panel control ver: 7.5.00
Touch panel drawing ver: 7.5.00
Online ver: 7.5.00
ME10/ME20 ver: 2.4.30.0
Communication:
Controller (logic): VME
Controller (process database): touch panel
Heat exchanger / chiller:
(1) Advanced Thermal Sciences SX-21
Facility:
Seismic support: bracket locations to be provided
Chemical connections: bottom
Exhaust connections: top
Gas connections: bottom
Drain connections: bottom
Power requirements: 208 VAC (3.4 kW) , 200 A, 3 phase, 3 wire+ground, 60 Hz
2004 vintage.
EBARA Frex 300是一種晶圓研磨、研磨和拋光設備,能夠在高生產率下取得優異的效果。這種自動化系統的設計目的是使晶片的直徑達到300毫米,高效可靠地產生優越的結果,精確度不超過1微米。該單元利用材料去除技術來達到最高水平的表面光潔度。它可以同時加工多種基材,並具有各種晶片的內置工藝參數。機器由圖形用戶界面(GUI)控制,便於操作和調整。當EBARA FREX-300與ELID(電解過程中敷料)磨削配合使用時,能夠在許多類型的基材上實現較高的去除率。這一過程利用固定的金剛石砂輪來去除材料,然後使用不旋轉的磨料墊來平整和完成工件。與傳統的研磨方法相比,這提高了表面平整度。F-REX300配備了自動主軸更換器,允許在不同晶片和不同工藝之間快速過渡。該工具使用了廣泛的研磨主軸和工具,以滿足各種生產需求。主軸更換器是可編程的,能夠快速準確地從一個操作移動到下一個操作。資產具有用於檢查任何錯誤的自我診斷模型,以及用於幫助快速識別任何問題的可視警報。內置的安全措施旨在保護設備免受損壞,並確保晶片不會受到損壞。FREX-300還被設計為節能,能夠通過使用高效的電機和先進的控制系統實現顯著的節能。總體而言,EBARA F-REX300是一種先進的晶圓研磨、研磨和拋光系統,能夠產生優異的精度和可重復性。此單元是大容量應用程序的理想選擇,可為用戶提供高效、可靠且經濟高效的生產需求解決方案。
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