二手 IPEC / WESTECH / SPEEDFAM 372M #155037 待售
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ID: 155037
晶圓大小: 8"
ILD CMP Oxide/Poly Silicon/STI systems, 8"
Specifications:
Model 372 polisher mainframe
Novascan Model 210 thickness measurement system
32 bit Hardware Upgrade (Adtron Thincard system)
SECS I / II Host Computer Interface
Floppy Drive
Printer / Terminal Interface Software
Software-Controlled Process Variables with Hi/Low Limits
Dual Sensor Loadcup
SFI Load Station Sensor RFK
Gaard Arm pad conditioner
7.5 hp Final Platen Drive System
750 lb. Down-Force Polisher Arm
Closed-Loop Load Cell Down-Force Control
High-Pressure Primary Polish Station
TUFRAM-Coated Platen, 60 psi rating
Final Polish Station
TUFRAM-Coated Platen
1000 mL Flow Slurry Pumps (2 Primary - 2 Final)
Wafer Carrier Speeds (10-125 rpm)
Platen Speed (10-175 rpm)
Head Clean Station Quick-Dump Rinse Unit
Clean Station Float Sensor
Capacitance Level Sensor for Polish Tub
Slurry Manifold - BECO Valves
DI Manifold - BECO Valves
PRi compatible environmental hood
Moisture Sensor in Fluids Cabinet and System Base Interfaced
Process Chilled Water Temp Gauges and Flow Meters
Fluids Cabinet Exhaust
AWN Interface - Underneath
Mushroom-style Emergency Machine Off (EMO) Buttons
Electrical Cabinet
Heat-treated wood
Currently barrier bagged and crated.
IPEC/WESTECH/SPEEDFAM 372M是一種晶圓研磨、研磨、拋光設備,設計用於半導體晶圓加工。該機采用變速電機的三軸(x、y、z)級,產生均勻的研磨和拋光效果。它設計用於生產離散和連續晶片,最大晶片尺寸為3.2英寸直徑。磨削、研磨和拋光系統具有許多高級功能,旨在確保精度和生產率。它配備了高度精確的3軸直流電動機驅動級以及步進電動機驅動,以確保精確和一致的研磨。該單元具有微處理器控制的研磨和研磨循環,可選擇半徑研磨、薄片研磨和晶圓研磨。它還配備了一個自動晶片裝載機,並為每次操作選擇了磨盤。除了其研磨、膝蓋和拋光循環外,該工具還具有可激活的自動反向功能,以幫助防止材料粘在研磨介質上。它還具有可選的觸摸感應功能,可監控資產溫度和壓力參數,以確保結果一致。此功能還有助於減少粒子堆積,因為它可以防止高速研磨循環。為了增加安全性,車型配備了多種防護功能。其中包括一個內置的緊急停止設備、一個超壓閥和一個總運行時間功能,允許用戶監控每次研磨操作的總運行次數。該系統還具有重量感應安全觸發器,如果在磨盤上放置了太多的重量,就會關閉機器。此外,它還有一個芯片托盤和一個絕緣的護罩,以防止碎片被釋放到環境中。總之,IPEC 372M是一種堅固的晶圓研磨、研磨和拋光裝置,考慮到精度和安全性。它具有多種特性,旨在提高磨削操作的一致性和可重復性,同時提供額外的保護和精度。
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