二手 KENSINGTON CSMT-3 #9078956 待售
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ID: 9078956
晶圓大小: 6"
Station Sorting/Mapping Tool System, 6"
Wafer Handling robot with Dual Paddle for High Throughput
Advanced Cassette Sort Merge/Randomize/Split Capability
Cassette Tilt Scanning/Mapping System with Transmissive Metrology
Measures Actual Wafer Positions in Cassettes
Detects Two-wafers-in-a-slot & Cross slotted wafers
Wafers Handled through slot center for minimal contamination and gentle handling
High Speed, High Resolution Prealigner
Foresight OCR Recognition System
OS/2 Operating System with Touch Screen Color Display: Pentium PC
User Friendly Graphical Interface for all operations and Recipe Generation
Ergonomic Stainless-Steel Frame
Better that Class-1 Clean Room Compatibility
Fail-Safe, Integrated Vacuum/Motion Controllers (Kensington Model 4000)
Automatic Error-Condition Recovery
Smooth, Digitally-controlled DC Servo Actuation of all axes
Direct Motion Metrology of all axes: Fully Distributed Force/Position Feedback Sensing
Automatic Tilt-Back locates Wafers against back of cassette: prevents migration
90° Tilt-Back Cassette Loading/Unloading addresses Carpel Tunnel Syndrome Concerns
Colored Light System Status Beacon
Un-interruptible Power Supply/Back-up Vacuum (UPS/BUV) System. 110VAC AC 50/60 Hz
Automatically Unloads all wafers safely into their cassettes on total loss of power
Keyboard Drawer
Mirror-Bright #8 Electro-polished Laminar Flow Frame Top
X-Windows Software
Installation and on-site support
System Options:
GEMS/SECS-II Interface
Intel Ether Express W/TCPIP or HSMS.
KENSINGTON CSMT-3是一種晶片處理程序,旨在為半導體行業中的一系列模具連接和封裝過程提供直觀的晶片負載。它是最先進的全自動晶片加載程序和處理程序,可確保速度、準確性和一致的性能。它設計用於處理3英寸和4英寸晶片,用於模具連接和封裝的行業標準工藝。CSMT-3是一種多功能的晶圓處理機。它支持紫外線粘合劑分配和環氧樹脂模具連接工藝.該設備小巧,易於集成到小型和標準尺寸的設備區域,但通過提供廣泛的控制設置和可定制的參數來保持準確性。該系統確保晶片向各種模具連接和封裝工藝的一致流動,並考慮晶片處理和安裝工藝。KENSINGTON CSMT-3采用用戶友好、符合人體工程學的設計,配備7英寸觸摸屏顯示屏,可輕松設置和監控設備。該平臺提供自動對齊設置,使操作員能夠在有限的安裝時間內快速設置模具連接或封裝過程。晶片處理程序為晶片加載提供了最大的靈活性,可互換對齊基座,並且一次最多可處理四個晶片。CSMT-3還配備了多種安全功能,包括蓋升降機互鎖、緊急停車和晶片邊緣檢測傳感器。這些安全功能提高了操作員的安全性並確保了一致的結果。KENSINGTON CSMT-3是自動晶圓處理的理想解決方案。它為半導體生產提供了從加載到模具連接/封裝過程的快速協調,具有所有必要的特性和安全特性。控制機用途廣泛、速度快、使用方便,是模具連接和封裝應用的理想選擇。
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