二手 KENSINGTON CSMT-4 #9078959 待售
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ID: 9078959
晶圓大小: 6"
Station Sorting/Mapping Tool System, 6"
Wafer Handling robot with Dual Paddle for High Throughput
Advanced Cassette Sort Merge/Randomize/Split Capability
Cassette Tilt Scanning/Mapping System with Transmissive Metrology
Measures Actual Wafer Positions in Cassettes
Detects Two-wafers-in-a-slot & Cross slotted wafers
Wafers Handled through slot center for minimal contamination and gentle handling
High Speed, High Resolution Prealigner
Foresight OCR Recognition System
OS/2 Operating System with Touch Screen Color Display: Pentium PC
User Friendly Graphical Interface for all operations and Recipe Generation
Ergonomic Stainless-Steel Frame
Better that Class-1 Clean Room Compatibility
Fail-Safe, Integrated Vacuum/Motion Controllers (Kensington Model 4000)
Automatic Error-Condition Recovery
Smooth, Digitally-controlled DC Servo Actuation of all axes
Direct Motion Metrology of all axes: Fully Distributed Force/Position Feedback Sensing
Automatic Tilt-Back locates Wafers against back of cassette: prevents migration
90° Tilt-Back Cassette Loading/Unloading addresses Carpel Tunnel Syndrome Concerns
Colored Light System Status Beacon
Un-interruptible Power Supply/Back-up Vacuum (UPS/BUV) System. 110VAC AC 50/60 Hz
Automatically Unloads all wafers safely into their cassettes on total loss of power
Keyboard Drawer
Mirror-Bright #8 Electro-polished Laminar Flow Frame Top
X-Windows Software
Installation and on-site support
System Options:
GEMS/SECS-II Interface
Intel Ether Express W/TCPIP or HSMS.
KENSINGTON CSMT-4是一款先進的自動化晶片處理機，專為半導體工業大批量生產300毫米矽片而設計。處理程序能夠攜帶多達四（4）個晶片，並將它們裝入化學氣相沈積（CVD）設備或工藝室。它包括一個機器人手臂，從盒式磁帶中拾取晶片並將其放入處理系統。處理程序還包含一個真空單元,用於處理過程周期中的晶片。CSMT-4晶片處理程序提供了許多功能,使其成為自動化晶片處理的可靠且通用的工具。其先進的機器人手臂允許高定位精度和流暢、精確的運動，使其能夠容納各種各樣的晶圓尺寸。真空機器的設計目的是確保晶片在一個過程周期中保持穩固的位置，從而消除晶片因空氣湍流或振動而破裂的可能性。檢測工具可以自動檢測晶圓的大小，提供實時反饋和準確的位置信息，即使對於大晶圓尺寸也是如此。處理程序還具有易於訪問的蓋，以便更簡單的維護和檢查，而無需工具或拆卸機器人手臂。集成控制資產允許存儲和執行過程程序，而無需指示機器人手臂。還有一個集成的安全防護和聯鎖模型，提供對機器內部部件的完整保護，使其在工業環境中使用安全。KENSINGTON CSMT-4是一款經過驗證、可靠的自動化晶片處理器,旨在滿足半導體生產行業的最高生產和性能要求。它為處理和處理矽片提供了可靠、安全和經濟的解決方案，具有很高的位置精度和最少的人工幹預。該處理程序能夠容納各種各樣的晶圓尺寸和工藝周期，使其成為大批量生產和提高工藝效率的可靠解決方案。
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