二手 ADVANCED ENGINEERING AWC-650 #147891 待售

Automatic wafer cleaner, 8" Features: Micro processor controlled operation: Digitally controlled by on-board PLC controller Cleaning process recipes stored and readily recalled from PLC memory Substrate handling: Accepts wafers up to 8" on dicing frames Dicing frame positioned on system chuck using (2) location pins and spring-loaded hold-down mechanism At end of process, wafer released from vacuum hold-down by puff of nitrogen Standard atomizer cleaning head High-pressure DI water nozzle (optional) Built-in vacuum generator with auto-drain water trap Dicing frame safety lock chuck Built-in exhaust blower (optional) System options: Megasonic cleaning jet: uses megasonic-energized DI water CO2 bubbler to prevent ESD on substrate Custom chucks Specifications: DI water pressure (input): 5 to 7 bar DI water capacity (maximum usage): 1.8L/min DI water capacity (minimum): > 3 L/min Nitrogen (maximum consumption): 70 NL/min Air (CDA) (maximum pressure): 0.5 to 0.7 Mpa (5 to 7 kg/cm^2) Air (CDA) (maximum consumption): 250 NL/min Electrical: 115/230VAC, 50/60Hz Power (maximum): 1.8kVA.