二手 ISIS SENTRONICS SemDex A32-34 #9407579 待售

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ID: 9407579
晶圓大小: 8"-12"
優質的: 2011
Wafer testing and metrology system, 8"-12" Automatic loading (2) Load ports (12" FOUB and 8" Open cassette via 12" Mechanical adaptor) Measurement part: Automated measurement: Substrate / Layer / Total thickness Bow / Warp Mini-bumps / Vias (Micro 3D metrology) and nm roughness Integrated sensor heads: Layer thickness / Bow: StraDex f2 - 80 (Top), StraDex f24 - 300 (Bottom) 3D micro-topography: StraDex a3 (Top, off-center by about 90 mm) Camera function (Top sensor) Autofocus: StraDex a3 (Precision mechanical bearing) StraDex f2 - 80 StraDex f24 - 300 (Air bearing) Anti-vibration plate below chuck Optical wavelengths: Top sensor: 830 nm (Minimum Silicon thickness 2.5 μm) Bottom sensor: 1300 nm (Minimum Silicon thickness 7 μm) Top sensor (Off-center): ~ 500 nm Integrated calibration samples: Thickness sample silicon: 123 μm (Roughness in the several nm level) Thickness sample silicon: 750 μm (Roughness in the several nm level) Step profiles for 3D Micro topography Cross hair for top and bottom thickness sensor alignment Sensor system with (3) StraDex sensor heads (Triple sensor setup): StraDex f2 - 80 (Top): Spot size: 8 μm Autofocus range: 2 - 22 mm Maximum warp: 3 mm Acquisition rate: < 4 kHz Thickness (Undoped silicon): Fast mode: 2.5 - 80 μm Slow mode: 2.5 - 80 μm Thickness (Glass, polymer): Fast mode: 5 - 200 μm Slow mode: 5 - 200 μm StraDex f24 - 300 (Bottom): Spot size: 24 μm Autofocus range: 24 - 44 mm Maximum warp: 2 mm Acquisition rate: < 4 kHz Thickness (Silicon): Fast mode: 8 - 350 μm Slow mode: 8 - 800 μm Thickness (Glass, polymer): Fast mode: 14 - 300 μm Slow mode: 14 - 1000 μm StraDex a3 (Top): Field-of-view: (0.35 mm)² Lateral pixel size: 0.3 μm Working distance: 3.5 mm Autofocus range: 4 mm Maximum Z-height: 60 μm (High-res.) / 120 μm (Low-res.) Repeatability: 0.5 nm (High-res.) Total acquisition time: 2 - 3 sec. Maximum focusing speed: 200 μm/s Surface roughness: Rz < 0.1 μm Confidence range: 2 Sigma Single sensor mode: Absolute accuracy: < ± 0.5 μm Repeatability (Fast mode): < ± 0.1 μm Repeatability (Slow mode): < ± 0.5 μm Twin sensor (Layer thickness) mode: Absolute accuracy: < ± 1 μm Repeatability (Fast and slow mode): < ± 0.5 μm Stage: Maximum X/Y travel range: 300 x 300 mm² Maximum velocity: 30 mm/s Lateral accuracy: 4 μm Maximum height variation repeatable: 2 μm Free positioning via keypads Anti-vibration table Air suspension Perforated vacuum chuck for double side measurements of 6", 8" and 12" unframed and framed wafers 10 mm Holes at 20 mm inter-center spacing Vacuum for wafer suction 3 Lift pins to elevate the wafer (≥ 200 mm in diameter) by 9.5 mm Wafer handling: Up to 60 wafers / hour Single ATM robot with vacuum gripper Pre-aligner OCR reader (Standard: Top scribe readout) General: Industrial computer (2 GHz) with screen Data interface: LAN Fan filter unit, ISO class 10 Temperature: 10°C - 35°C Power supply voltage: 100 V - 240 V, 50-60 Hz Maximum power consumption: 5 kW Sensor missing 2011 vintage.
ISIS SENTRONICS SemDex A32-34是一種晶圓測試和計量設備,設計用於元件分析、表面計量和電氣評估。它能夠測試和測量各種晶片基板,包括薄膜和厚膜、單片和嵌入式電路以及多晶矽。SemDex A32-34集成了全自動測試和計量系統,可實現精確和可重復的結果。它使用X-Y-Z掃描級進行精確的晶圓定位和移動,在晶圓位置之間提供精確的對準和可重復性。此級可由基於PC的控制器(PCBC)控制,並且能夠掃描晶圓的100個單獨區域。ISIS SENTRONICS SemDex A32-34包括一個高性能的電光檢測包,包括一個高分辨率的CMOS相機和光場顯微鏡,使它能夠探測和分析單個晶圓的大面積。這個封裝還包括一個電壓模式表征單元,允許精確測量晶圓參數。該機還配備了先進的基於算法的軟件包,為用戶提供了以表面計量計算、故障檢測、統計過程控制等多種方式分析其掃描數據的能力。此外,該工具還提供了掃描數據的實時可視化,允許用戶快速查看結果。SemDex A32-34的其他關鍵特性包括能夠提供廣泛的測試和測量能力,如4點探針測量和電流映射,以及用於檢測超小型缺陷和汙染物的尖端成像算法。總之,ISIS SENTRONICS SemDex A32-34是一種綜合性晶圓測試和計量資產,設計用於精確和可重復的結果。它結合了多種用於測試各種晶片基板的高級功能,如全自動X-Y-Z掃描階段、高分辨率成像模型和基於算法的軟件包,讓用戶快速準確地分析自己的掃描數據。
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