二手 SHINKAWA UTC-1000 #9383142 待售

Wire bonders, many available Target material Type: IC, LSI, BGA General lead frame: 0.07 mm - 0.3mm Wide Copper frame: 0.07-0.16 mm Thin substrate: 0.3-0.5 mm Thick substrate: 0.5-0.7 mm Carrier for transportation 1.0 -2.0 mm Wire: Gold wire, Φ 15-38 μm (2" both flange spools) Bonding method: Au wire bonding by THERMOSONIC bonding Bond speed: 67 ms / 2mm wire Wire length: 8 mm (Maximum) Wire bend: Within 50 μm / wire length 4.5 mm Bonding accuracy: ± 2.5 μm (3σ) Load time: 3-150 ms (0.1 ms / Step) Bond load: 30-2940 mN (1 mN / Step) Search speed: 1-80 mm / s (0.1 mm / Step) Bonding position setting: Self-teaching method Roader / Unloader section Magazine size: Width 23-90 mm, length 110-265 mm Movement pitch in each direction: 10 μm / step Transport method: Digital clamp feed method Feed pitch: 71 mm (5 μm / Step) Heat block heating range: Room temperature to 300°C Compressed air: 0.5 MPa, 60 L / min Vacuum: -74 kPa Bond area: X: ± 28 mm, Y: ± 33 mm Power supply: Single phase, 100 VAC, 50/60 Hz 2006 vintage.