顯示第
1-30
of
39
發現的結果
過濾器
全部清除
過濾器
39 結果
優質的
-
(1)
-
(3)
-
(3)
-
(7)
-
(7)
-
(1)
-
(15)
找不到你要找的？
熱門產品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
271
熱門產品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
190
熱門產品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
205
熱門產品
SHINKAWA
UTC-1000
Wire bonders, many available Target material Type: IC, LSI, BGA General lead frame: 0.07 mm - 0.3mm
228
熱門產品
SHINKAWA
UTC-1000
Wire bonders Bonding method: Ultrasonic thermo compression Bonding speed: 67 ms / 2 mm wire (With lo
297
找不到你要找的？
