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熱門產品
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
1112
熱門產品
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
183
熱門產品
SHINKAWA
UTC-1000
Wire bonder Bonding method: Ultrasonic thermocompression Machine accuracy: ±2.5 µm (3σ) Bonding spee
160
熱門產品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
727
熱門產品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
629
熱門產品
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
563
熱門產品
SHINKAWA
UTC-1000
Wire bonders, many available Target material Type: IC, LSI, BGA General lead frame: 0.07 mm - 0.3mm
654
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