二手 ESEC 2005 HR #128622 待售

APLF Soft solder bonder, 6" D2-Pack Die placement accuracy: +/- 25 um With die-collet and scrub Cycle time: 0.5s Cycle speed: 7200 CPH Bond time prebond and postbond: 0 - 3000 ms X-Direction scrub programmable parameters: Amplitude: up to +/- 1 mm Frequency: 0 - 50 Hz Number of cycles: 0 - 100 Offset: +/- 0.25 mm Minimum die size: 0.20 mm x 0.20 mm Maximum die size: 15.0 mm x 15.0 mm (1) Zoom-lens Magnification ratio: 1:6.5 Typical productivity: 3500 to 4500 UPH Foil expansion: Adjustable, up to 30 mm in each direction Alignment time for die size: 90 ms for 0.6 mm 170 ms for 6.0 mm Corner detection: Programmable from: -20% to +5% Windows for all four corners Inkdot recognition: Rectangular window Size, position, and sensitivity programmable Furnace: (8) Digitally controlled heating zones with multiple heating elements Facilities: 220V +10%/-15%, 50/60 Hz, 3.5 kW peak (heat up) Compressed air: 4 - 5 bar (58 - 87 PSI) Nitrogen / Forming gas: 18 - 3 bar (26 - 43 PSI) Vacuum: Minimum -0.7 bar Water (if applicable): 2 - 3 bar (29 - 43 PSI) 1998 vintage.