二手 SSC BPE-2708-SP #9080483 待售

Gold plating machines, 8" Plating mechanism: Fountain, face-down Manual wafer load and unload Solution: Non-cyanide, Au solution Solution capacity: (14) Cups Temperature control: Direct heating Mechanism: PID Control Temperature control range: Room temperature to ~70°C Flow rate: Auto control by flow sensor, cup / Pump control mechanism Plating tank: Laminate Upper lid: PVC Cup holder: HT-PVC and PPS, 8" Upper lid arms: SUS Coated with PTFE Upper lid open / Close: Air cylinder Fountain pump: Polypropylene Valve: PTFE AV valve, HT-PVC, PVC and PFA Piping of Au solution: HT-PVC, Polypropylene and PFA Piping of DIW and drain: HT-PVC, PVC, and PFA Piping of exhaust: PVC Plating unit: PVC Cup location: (7) Lines x (2) cups Fountain pumps: (14) MD-100FYK with inverter control: 8~50 L/min With cup / Pump flow rate Circulation pumps: (2) MD-100FYK with inverter control With (2) circulation piping lines Fountain filtration: (14) Sets of PP (Housing and cartridge) Circulation filtration: (2) sets of PP (Housing and cartridge) Solution level control: N2 level sensor for each solution tank With (2) upper, lower, fixed, additive Sensors: Temperature, leakage, flow rate, area (4) Heaters, 3 kW Power supply: Cabinet (Caster and adjuster) Fixed electrical current 2-Channel switch: (2) 8~3000 mA (8 ~300 mA) Precision: ±0.5 % by 300 mA Control: Sequence control Touch panel and PLC Data recorded PC (30) Programmable numbers (90) Recipes per programmed number Count current mod (mA / Hour) Bump height uniformity: ≤ 5 % (10-15) points / Wafer Bump height uniformity: ≤ 2 um - ≤3 um, 8" (80-120 points) Flow rate: 35 L/min Edge contact area / Cathode No plating cup 2006 vintage.