二手 SVG 86-3 #117950 待售

SVG 86-3
製造商
SVG
模型
86-3
ID: 117950
晶圓大小: 3"
single cabinet developer system, 3" Configuration: Wafers: 3" round Silicon wafers, convertible up to 6" with kit option Process flow: left to right Track 1: send, HMDS vapor prime, chill, coat, bake, chill, receive Track 2: send, bake, chill, MD develop, bake, chill, with flood expose, receive System specifications: Frame: Internal frame: standard powder coated black External panels: stainless steel System: Emergency stop access in front of system Rear system bulkhead fittings and facility connections: Process chemicals: EBR solvents, developer, DI water Process gasses: clean dry air, Nitrogen Process exhaust Cooling water System transport: O-ring belt transfer Polyurethane Silicone Viton Serial processing Indexer module: Platform designed for SEMI standard 3" wafer cassettes Hard anodized aluminum Standard 3" SEMI standard cassette pitch indexing Capable of handling up to 6" SEMI standard wafer cassettes Photoresist coat module: Arc centering configured for 3" round silicon wafers Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM Programmable pivoting moving dispense arm: (1) Photoresist nozzle (3) Topside EBR TEFLON catch cup with built-in backside EBR Pre-dispense cup with programmable pre-dispense Digital vacuum switch Interlocked safety cover to stop process when removed Center collection 1 gallon polyethylene drain container, high level sensor 5-gallon SS canister with low level sensing for EBR solvent dispense Positive resist moving dispense developer module (aqueous) Arc centering configured for 3" round silicon wafers Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM Programmable pivoting moving dispense arm: (1) 1/4” O.D. developer nozzle (1) 1/4” O.D. DI water rinse nozzle (1) SS11001 developer spray nozzle (1) SS11001 DI water rinse nozzle Polyethylene catch cup with built-in arm home positioning off wafer Digital vacuum switch Interlocked safety cover to stop process when removed 2" Polyethylene drain to rear of system for facility connection 5-gallon SS canister with low level sensing for aqueous developer Chill plate module: Hard anodized aluminum surface Internal water channels for high efficiency heat transfer 3/8" Swagelok tubing input and output connections Hotplate oven module: Hard anodized Aluminum 3-pin HPO block assembly 3-pin stepper motor programmable wafer lift handling Enhanced heating element (Std. 120V, 450W) Optional enhanced heating element (High Temp. 120V, 750W) WATLOW temperature controller Auto tuning +/- 0.1% calibration accuracy Temperature range: 50ºC to 250ºC (Standard) Temperature range: 80ºC to 350ºC (High Temp.) Temperature uniformity: +/- 0.5ºC (at 100 ºC) Digital LED display Temperature readout to 0.1ºC RTD temperature probe Digital vacuum switch NetTRACK system manager: NetTRACK CPU board Industrial PC Multitasking Windowsxp application software HCIU card cage connection port NetTRACK system management software Recipe management Unlimited recipe writing Easy editing and copying Component exercise Real-time display of process set points Real-time processing data logging Four access security levels with password control Seamless integration with production server Configurable for all process steps SECS-GEM compliant ports print out in MS Excel format 15” ELO color touch-screen, 1024 x 768 resolution at 75 Hz Ergotron monitor arm, (angles and height adjustable, SEMI compliant) Emergency stop button front Main breaker on power distribution box Barcode reader Flood exposure: Configured for 3" wafers (4" shutter opening) Lamp: 350W Wavelength: 365 nm Intensity range: 18mW to 24mW Module mounted on developer chill plate Exposure interface board to system software control Facilities requirements: Power (system): 208V, 3-phase, 60Hz, 5-wire, 35A Power (chiller): 120V, 1-phase, 60Hz, 3-wire, 15A Vacuum: 5 SCFM at 28" Hg, 3/8" OD tube Gas (CDA): 70 to 100 psig, 10 SCFM per system, 1/4" OD tube Gas (N2): 80 to 100 psig, 10 SCFM per system, 3/8" OD tube Process exhaust (coater/developer): 35 SCFM at 1.5" H2O/module, 4" duct Process exhaust (HPO): 10 SCFM at 1.5" H2O/module, 4" OD duct Cabinet exhaust (optional): 150 SCFM at 1.5" H2O, 4" OD duct Facilities connections: back of system System transport and installation: Transport: 4 wheels Securing: screw type mounting feet with pads Dimensions (W x D x H): 96 x 40 x 48" Options available for an additional cost: (Qty 4) IntelliGen Mini Photoresist dispense systems: 2-Stage Steppor motor technology and diaphragm design Filter Mounting bracked Interface cables (Qty 2) IntelliGen HV Photoresist dispense systems: 2-Stage Steppor motor technology and diaphragm design Filter Mounting bracked Interface cables (Qty 4) 451-15-1-S IDS 1/4 x 1/4 units with suckback valves: Bushings and compression nuts for input and output connections (1) output 0 to 15 PSI pressure For resist (0-80cp), Barli, and ARC (0-80cp) Power supply Interface cables Software (Qty 2) CYBOR 7500 precision chemical dispense pumps: Mid-range viscosity: 300 cp to 3000 cp 3/8" Flare-type connections KALREX O-rings Variable rate dispense High-torque stepper motor control Dispense volume: maximum 16ml Programmable suckback Multiple recipe select On-board single-pump controls RS232, RS485, LON communications Power supply Interface cables Software Chill plate closed loop temperature control unit: Connection tubing Can be shared with more than one chill plate Developer temperature control unit: Closed loop recirculation heater / chiller Manifold and connection tubing to dispense arm Single temperature delivered to dispense arm Electro-polished 5-gallon SS solvent canisters, low-level sensing Dual chemistry developer dispense system.
SVG 86-3是光刻的一個過程,使用光敏材料將圖樣從光掩模轉移到基板上。它是一種具有紫外線成像工藝的正型、無揮發性液體光致抗蝕劑設備。86-3光抗蝕劑由聚合物粘合劑系統和感光成分組成。感光元件包含感光劑、滅火器、酸發生器和溶劑。聚合物粘合劑單元含有聚乙烯醇、苯乙烯、丁二烯、丙烯酸等聚合物。用紫外線照射SVG 86-3光致抗蝕劑的成像過程被激活。這一過程是由感光元件和聚合物粘合劑機之間的反應驅動的。紫外線電磁輻射會激活滅火器,並防止敏化劑將能量從光傳遞到粘合劑工具。這被稱為「熄火」。酸發生器還與紫外線反應,轉化為酸,產生催化反應,導致粘合劑資產進一步降解。當光致抗蝕劑被照射時,粘合劑模型變得不溶解,並且可以被顯影溶液去除。然後,不溶性材料作為一個耐蝕刻屏障和保護底層防止蝕刻。另一方面,未輻照區域保留初始溶解度;它們被開發的解決方案移除,留下一個裸露的底層圖案層。86-3光致抗蝕劑與包括金屬和半導體表面在內的廣泛基板兼容。它也適用於典型的金屬蝕刻溶液和用於幹蝕刻工藝的溶液。再者,這種光致抗蝕劑可以與濕蝕、等離子體蝕刻、氧等離子體灰化等多種蝕刻工藝結合使用。此外,SVG 86-3是一種低溫、耐溶劑的設備。低溫固化工藝有助於降低成本和植物負荷,而溶劑電阻可防止抗蝕劑和基材之間的交叉汙染。抗蝕劑可以用常規的抗蝕劑剝離器和溶液去除。抗蝕劑系統還提供了對各種基材的出色附著力,包括金、鋁、不銹鋼和矽片。86-3單元是一種經濟、高效、可靠的光刻技術,適用於多種應用。它具有高分辨率,適用於各種基材和蝕刻工藝。它也是一種低溫、耐溶劑的機器,確保底物在整個光刻過程中保持其完整性。SVG 86-3光致抗蝕劑是圖案化層的絕佳選擇,為制造復雜零件和設計提供了可靠、低成本的生產工藝。
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