二手 SVG 86-3 #117950 待售
網址複製成功!
ID: 117950
晶圓大小: 3"
single cabinet developer system, 3"
Configuration:
Wafers: 3" round Silicon wafers, convertible up to 6" with kit option
Process flow: left to right
Track 1: send, HMDS vapor prime, chill, coat, bake, chill, receive
Track 2: send, bake, chill, MD develop, bake, chill, with flood expose, receive
System specifications:
Frame:
Internal frame: standard powder coated black
External panels: stainless steel
System:
Emergency stop access in front of system
Rear system bulkhead fittings and facility connections:
Process chemicals: EBR solvents, developer, DI water
Process gasses: clean dry air, Nitrogen
Process exhaust
Cooling water
System transport:
O-ring belt transfer
Polyurethane
Silicone
Viton
Serial processing
Indexer module:
Platform designed for SEMI standard 3" wafer cassettes
Hard anodized aluminum
Standard 3" SEMI standard cassette pitch indexing
Capable of handling up to 6" SEMI standard wafer cassettes
Photoresist coat module:
Arc centering configured for 3" round silicon wafers
Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM
Programmable pivoting moving dispense arm:
(1) Photoresist nozzle
(3) Topside EBR
TEFLON catch cup with built-in backside EBR
Pre-dispense cup with programmable pre-dispense
Digital vacuum switch
Interlocked safety cover to stop process when removed
Center collection 1 gallon polyethylene drain container, high level sensor
5-gallon SS canister with low level sensing for EBR solvent dispense
Positive resist moving dispense developer module (aqueous)
Arc centering configured for 3" round silicon wafers
Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM
Programmable pivoting moving dispense arm:
(1) 1/4” O.D. developer nozzle
(1) 1/4” O.D. DI water rinse nozzle
(1) SS11001 developer spray nozzle
(1) SS11001 DI water rinse nozzle
Polyethylene catch cup with built-in arm home positioning off wafer
Digital vacuum switch
Interlocked safety cover to stop process when removed
2" Polyethylene drain to rear of system for facility connection
5-gallon SS canister with low level sensing for aqueous developer
Chill plate module:
Hard anodized aluminum surface
Internal water channels for high efficiency heat transfer
3/8" Swagelok tubing input and output connections
Hotplate oven module:
Hard anodized Aluminum 3-pin HPO block assembly
3-pin stepper motor programmable wafer lift handling
Enhanced heating element (Std. 120V, 450W)
Optional enhanced heating element (High Temp. 120V, 750W)
WATLOW temperature controller
Auto tuning +/- 0.1% calibration accuracy
Temperature range: 50ºC to 250ºC (Standard)
Temperature range: 80ºC to 350ºC (High Temp.)
Temperature uniformity: +/- 0.5ºC (at 100 ºC)
Digital LED display
Temperature readout to 0.1ºC
RTD temperature probe
Digital vacuum switch
NetTRACK system manager:
NetTRACK CPU board
Industrial PC
Multitasking Windowsxp application software
HCIU card cage connection port
NetTRACK system management software
Recipe management
Unlimited recipe writing
Easy editing and copying
Component exercise
Real-time display of process set points
Real-time processing data logging
Four access security levels with password control
Seamless integration with production server
Configurable for all process steps
SECS-GEM compliant ports print out in MS Excel format
15” ELO color touch-screen, 1024 x 768 resolution at 75 Hz
Ergotron monitor arm, (angles and height adjustable, SEMI compliant)
Emergency stop button front
Main breaker on power distribution box
Barcode reader
Flood exposure:
Configured for 3" wafers (4" shutter opening)
Lamp: 350W
Wavelength: 365 nm
Intensity range: 18mW to 24mW
Module mounted on developer chill plate
Exposure interface board to system software control
Facilities requirements:
Power (system): 208V, 3-phase, 60Hz, 5-wire, 35A
Power (chiller): 120V, 1-phase, 60Hz, 3-wire, 15A
Vacuum: 5 SCFM at 28" Hg, 3/8" OD tube
Gas (CDA): 70 to 100 psig, 10 SCFM per system, 1/4" OD tube
Gas (N2): 80 to 100 psig, 10 SCFM per system, 3/8" OD tube
Process exhaust (coater/developer): 35 SCFM at 1.5" H2O/module, 4" duct
Process exhaust (HPO): 10 SCFM at 1.5" H2O/module, 4" OD duct
Cabinet exhaust (optional): 150 SCFM at 1.5" H2O, 4" OD duct
Facilities connections: back of system
System transport and installation:
Transport: 4 wheels
Securing: screw type mounting feet with pads
Dimensions (W x D x H): 96 x 40 x 48"
Options available for an additional cost:
(Qty 4) IntelliGen Mini Photoresist dispense systems:
2-Stage
Steppor motor technology and diaphragm design
Filter
Mounting bracked
Interface cables
(Qty 2) IntelliGen HV Photoresist dispense systems:
2-Stage
Steppor motor technology and diaphragm design
Filter
Mounting bracked
Interface cables
(Qty 4) 451-15-1-S IDS 1/4 x 1/4 units with suckback valves:
Bushings and compression nuts for input and output connections
(1) output
0 to 15 PSI pressure
For resist (0-80cp), Barli, and ARC (0-80cp)
Power supply
Interface cables
Software
(Qty 2) CYBOR 7500 precision chemical dispense pumps:
Mid-range viscosity: 300 cp to 3000 cp
3/8" Flare-type connections
KALREX O-rings
Variable rate dispense
High-torque stepper motor control
Dispense volume: maximum 16ml
Programmable suckback
Multiple recipe select
On-board single-pump controls
RS232, RS485, LON communications
Power supply
Interface cables
Software
Chill plate closed loop temperature control unit:
Connection tubing
Can be shared with more than one chill plate
Developer temperature control unit:
Closed loop recirculation heater / chiller
Manifold and connection tubing to dispense arm
Single temperature delivered to dispense arm
Electro-polished 5-gallon SS solvent canisters, low-level sensing
Dual chemistry developer dispense system.
SVG 86-3是光刻的一個過程,使用光敏材料將圖樣從光掩模轉移到基板上。它是一種具有紫外線成像工藝的正型、無揮發性液體光致抗蝕劑設備。86-3光抗蝕劑由聚合物粘合劑系統和感光成分組成。感光元件包含感光劑、滅火器、酸發生器和溶劑。聚合物粘合劑單元含有聚乙烯醇、苯乙烯、丁二烯、丙烯酸等聚合物。用紫外線照射SVG 86-3光致抗蝕劑的成像過程被激活。這一過程是由感光元件和聚合物粘合劑機之間的反應驅動的。紫外線電磁輻射會激活滅火器,並防止敏化劑將能量從光傳遞到粘合劑工具。這被稱為「熄火」。酸發生器還與紫外線反應,轉化為酸,產生催化反應,導致粘合劑資產進一步降解。當光致抗蝕劑被照射時,粘合劑模型變得不溶解,並且可以被顯影溶液去除。然後,不溶性材料作為一個耐蝕刻屏障和保護底層防止蝕刻。另一方面,未輻照區域保留初始溶解度;它們被開發的解決方案移除,留下一個裸露的底層圖案層。86-3光致抗蝕劑與包括金屬和半導體表面在內的廣泛基板兼容。它也適用於典型的金屬蝕刻溶液和用於幹蝕刻工藝的溶液。再者,這種光致抗蝕劑可以與濕蝕、等離子體蝕刻、氧等離子體灰化等多種蝕刻工藝結合使用。此外,SVG 86-3是一種低溫、耐溶劑的設備。低溫固化工藝有助於降低成本和植物負荷,而溶劑電阻可防止抗蝕劑和基材之間的交叉汙染。抗蝕劑可以用常規的抗蝕劑剝離器和溶液去除。抗蝕劑系統還提供了對各種基材的出色附著力,包括金、鋁、不銹鋼和矽片。86-3單元是一種經濟、高效、可靠的光刻技術,適用於多種應用。它具有高分辨率,適用於各種基材和蝕刻工藝。它也是一種低溫、耐溶劑的機器,確保底物在整個光刻過程中保持其完整性。SVG 86-3光致抗蝕劑是圖案化層的絕佳選擇,為制造復雜零件和設計提供了可靠、低成本的生產工藝。
還沒有評論