二手 SVG 88-3 #117937 待售

SVG 88-3
製造商
SVG
模型
88-3
ID: 117937
晶圓大小: 3"
single cabinet 2-track vapor prime / coat / bake system, 3" Configuration: Wafers: 3" round Silicon wafers, convertible up to 6" with kit option Process flow: left to right Track 1: send, HMDS vapor prime, chill, coat, bake, bake, chill, receive Track 2: send, HMDS vapor prime, chill, coat, bake, bake, chill, receive System specifications: Frame: Internal frame: standard powder coated black External panels: stainless steel System: Emergency stop access in front of system Rear system bulkhead fittings and facility connections: Process chemicals: EBR solvents, developer, DI water Process gasses: clean dry air, Nitrogen Process exhaust Cooling water System transport: Polyurethane Silicone Viton Automated transfer arm Serial processing Indexer module: Platform designed for SEMI standard 3" wafer cassettes Hard anodized aluminum Standard 3" SEMI standard cassette pitch indexing Capable of handling up to 6" SEMI standard wafer cassettes Photoresist coat module: Arc centering configured for 3" round silicon wafers Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM Programmable pivoting moving dispense arm: (1) Photoresist nozzle (3) Topside EBR TEFLON catch cup with built-in backside EBR Pre-dispense cup with programmable pre-dispense Digital vacuum switch Interlocked safety cover to stop process when removed Center collection 1 gallon polyethylene drain container, high level sensor 5-gallon SS canister with low level sensing for EBR solvent dispense Positive resist moving dispense developer module (aqueous) Arc centering configured for 3" round silicon wafers Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM Programmable pivoting moving dispense arm: (1) 1/4” O.D. developer nozzle (1) 1/4” O.D. DI water rinse nozzle (1) SS11001 developer spray nozzle (1) SS11001 DI water rinse nozzle Polyethylene catch cup with built-in arm home positioning off wafer Digital vacuum switch Interlocked safety cover to stop process when removed 2" Polyethylene drain to rear of system for facility connection 5-gallon SS canister with low level sensing for aqueous developer Chill plate module: Hard anodized aluminum surface Internal water channels for high efficiency heat transfer 3/8" Swagelok tubing input and output connections Hotplate oven module: Hard anodized Aluminum 3-pin HPO block assembly 3-pin stepper motor programmable wafer lift handling Enhanced heating element (Std. 120V, 450W) Optional enhanced heating element (High Temp. 120V, 750W) WATLOW temperature controller Auto tuning +/- 0.1% calibration accuracy Temperature range: 50ºC to 250ºC (Standard) Temperature range: 80ºC to 350ºC (High Temp.) Temperature uniformity: +/- 0.5ºC (at 100 ºC) Digital LED display Temperature readout to 0.1ºC RTD temperature probe Digital vacuum switch NetTRACK system manager: NetTRACK CPU board Industrial PC Multitasking Windowsxp application software HCIU card cage connection port NetTRACK system management software Recipe management Unlimited recipe writing Easy editing and copying Component exercise Real-time display of process set points Real-time processing data logging Four access security levels with password control Seamless integration with production server Configurable for all process steps SECS-GEM compliant ports print out in MS Excel format 15” ELO color touch-screen, 1024 x 768 resolution at 75 Hz Ergotron monitor arm, (angles and height adjustable, SEMI compliant) Emergency stop button front Main breaker on power distribution box Barcode reader Flood exposure: Configured for 3" wafers (4" shutter opening) Lamp: 350W Wavelength: 365 nm Intensity range: 18mW to 24mW Module mounted on developer chill plate Exposure interface board to system software control Facilities requirements: Power (system): 208V, 3-phase, 60Hz, 5-wire, 35A Power (chiller): 120V, 1-phase, 60Hz, 3-wire, 15A Vacuum: 5 SCFM at 28" Hg, 3/8" OD tube Gas (CDA): 70 to 100 psig, 10 SCFM per system, 1/4" OD tube Gas (N2): 80 to 100 psig, 10 SCFM per system, 3/8" OD tube Process exhaust (coater/developer): 35 SCFM at 1.5" H2O/module, 4" duct Process exhaust (HPO): 10 SCFM at 1.5" H2O/module, 4" OD duct Cabinet exhaust (optional): 150 SCFM at 1.5" H2O, 4" OD duct Facilities connections: back of system System transport and installation: Transport: 4 wheels Securing: screw type mounting feet with pads Dimensions (W x D x H): 108 x 40 x 48" Options available for an additional cost: (Qty 4) IntelliGen Mini Photoresist dispense systems: 2-Stage Steppor motor technology and diaphragm design Filter Mounting bracked Interface cables (Qty 2) IntelliGen HV Photoresist dispense systems: 2-Stage Steppor motor technology and diaphragm design Filter Mounting bracked Interface cables (Qty 4) 451-15-1-S IDS 1/4 x 1/4 units with suckback valves: Bushings and compression nuts for input and output connections (1) output 0 to 15 PSI pressure For resist (0-80cp), Barli, and ARC (0-80cp) Power supply Interface cables Software (Qty 2) CYBOR 7500 precision chemical dispense pumps: Mid-range viscosity: 300 cp to 3000 cp 3/8" Flare-type connections KALREX O-rings Variable rate dispense High-torque stepper motor control Dispense volume: maximum 16ml Programmable suckback Multiple recipe select On-board single-pump controls RS232, RS485, LON communications Power supply Interface cables Software Chill plate closed loop temperature control unit: Connection tubing Can be shared with more than one chill plate Developer temperature control unit: Closed loop recirculation heater / chiller Manifold and connection tubing to dispense arm Single temperature delivered to dispense arm Electro-polished 5-gallon SS solvent canisters, low-level sensing Dual chemistry developer dispense system.
SVG 88-3是一種領先的可水顯影光刻設備,為最先進的半導體器件的光刻提供了極致的性能和分辨率。該系統由一個創新的雙層樹脂基薄膜組成,包含一個水性可顯影底層,以及一個水性可顯影底層。底層以經過高度改性的聚乙烯酚基聚合物為基礎,旨在提供優異的水溶性、良好的濕蝕和幹蝕性、優異的耐化學性以及優異的光學和電子束光刻分辨率。頂層以高密度聚乙烯混合物為基礎,可實現高對比度、清潔分辨率和快速水的開發。當用作負性光致抗蝕劑時,88-3單元不需要預處理,也不需要烘烤後步驟,增強了工藝靈活性。高對比度光和電子束光刻性能使其成為X射線源電路生成的一個有吸引力的選擇。SVG 88-3出色的線緣粗糙度導致非常高的圖像保真度和最小化的航空圖像偽影。頂層經過優化,可用於248-nm和248/365-nm混合光刻。與248/365-nm功率相比,它具有更好的線寬偏移和對比度。底層提供高分辨率能力和優異的水溶性,對於現代半導體器件光刻中的應用至關重要。雙層組合改善了對比度,提供了極好的耐蝕刻性能,與水性可顯影的光刻膠兼容,並提供低背景。與其他領先的光刻膠相比,88-3的水相近紅外圖像具有良好的對比度。這種能力使得它非常適合於亞波長成像,以及在幾次叠加曝光下執行的成像應用。SVG 88-3的負音在與高級光源配合使用時也提供高對比度,使其非常適合與高NA步進器和掃描工具配合使用。88-3機用作正光抗蝕劑時,具有優異的成像性能和高分辨率。高對比度和出色的蝕刻電阻使得小特征器件的可靠制造和避免邊緣顯微鏡。總體而言,SVG 88-3提供卓越的分辨率、蝕刻電阻、光學分辨率和高對比度成像,同時仍提供顯著的工藝簡化。其獨特的雙層組合使得它成為現代半導體器件制造的特別有吸引力的選擇。這種光刻工具是設計師的理想選擇,誰想要的最大性能和分辨率為他們的產品。
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