二手 SVG 88-3 #117937 待售
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ID: 117937
晶圓大小: 3"
single cabinet 2-track vapor prime / coat / bake system, 3"
Configuration:
Wafers: 3" round Silicon wafers, convertible up to 6" with kit option
Process flow: left to right
Track 1: send, HMDS vapor prime, chill, coat, bake, bake, chill, receive
Track 2: send, HMDS vapor prime, chill, coat, bake, bake, chill, receive
System specifications:
Frame:
Internal frame: standard powder coated black
External panels: stainless steel
System:
Emergency stop access in front of system
Rear system bulkhead fittings and facility connections:
Process chemicals: EBR solvents, developer, DI water
Process gasses: clean dry air, Nitrogen
Process exhaust
Cooling water
System transport:
Polyurethane
Silicone
Viton
Automated transfer arm
Serial processing
Indexer module:
Platform designed for SEMI standard 3" wafer cassettes
Hard anodized aluminum
Standard 3" SEMI standard cassette pitch indexing
Capable of handling up to 6" SEMI standard wafer cassettes
Photoresist coat module:
Arc centering configured for 3" round silicon wafers
Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM
Programmable pivoting moving dispense arm:
(1) Photoresist nozzle
(3) Topside EBR
TEFLON catch cup with built-in backside EBR
Pre-dispense cup with programmable pre-dispense
Digital vacuum switch
Interlocked safety cover to stop process when removed
Center collection 1 gallon polyethylene drain container, high level sensor
5-gallon SS canister with low level sensing for EBR solvent dispense
Positive resist moving dispense developer module (aqueous)
Arc centering configured for 3" round silicon wafers
Brushless motor: 1 RPM spin speed programmability up to 6,000 RPM
Programmable pivoting moving dispense arm:
(1) 1/4” O.D. developer nozzle
(1) 1/4” O.D. DI water rinse nozzle
(1) SS11001 developer spray nozzle
(1) SS11001 DI water rinse nozzle
Polyethylene catch cup with built-in arm home positioning off wafer
Digital vacuum switch
Interlocked safety cover to stop process when removed
2" Polyethylene drain to rear of system for facility connection
5-gallon SS canister with low level sensing for aqueous developer
Chill plate module:
Hard anodized aluminum surface
Internal water channels for high efficiency heat transfer
3/8" Swagelok tubing input and output connections
Hotplate oven module:
Hard anodized Aluminum 3-pin HPO block assembly
3-pin stepper motor programmable wafer lift handling
Enhanced heating element (Std. 120V, 450W)
Optional enhanced heating element (High Temp. 120V, 750W)
WATLOW temperature controller
Auto tuning +/- 0.1% calibration accuracy
Temperature range: 50ºC to 250ºC (Standard)
Temperature range: 80ºC to 350ºC (High Temp.)
Temperature uniformity: +/- 0.5ºC (at 100 ºC)
Digital LED display
Temperature readout to 0.1ºC
RTD temperature probe
Digital vacuum switch
NetTRACK system manager:
NetTRACK CPU board
Industrial PC
Multitasking Windowsxp application software
HCIU card cage connection port
NetTRACK system management software
Recipe management
Unlimited recipe writing
Easy editing and copying
Component exercise
Real-time display of process set points
Real-time processing data logging
Four access security levels with password control
Seamless integration with production server
Configurable for all process steps
SECS-GEM compliant ports print out in MS Excel format
15” ELO color touch-screen, 1024 x 768 resolution at 75 Hz
Ergotron monitor arm, (angles and height adjustable, SEMI compliant)
Emergency stop button front
Main breaker on power distribution box
Barcode reader
Flood exposure:
Configured for 3" wafers (4" shutter opening)
Lamp: 350W
Wavelength: 365 nm
Intensity range: 18mW to 24mW
Module mounted on developer chill plate
Exposure interface board to system software control
Facilities requirements:
Power (system): 208V, 3-phase, 60Hz, 5-wire, 35A
Power (chiller): 120V, 1-phase, 60Hz, 3-wire, 15A
Vacuum: 5 SCFM at 28" Hg, 3/8" OD tube
Gas (CDA): 70 to 100 psig, 10 SCFM per system, 1/4" OD tube
Gas (N2): 80 to 100 psig, 10 SCFM per system, 3/8" OD tube
Process exhaust (coater/developer): 35 SCFM at 1.5" H2O/module, 4" duct
Process exhaust (HPO): 10 SCFM at 1.5" H2O/module, 4" OD duct
Cabinet exhaust (optional): 150 SCFM at 1.5" H2O, 4" OD duct
Facilities connections: back of system
System transport and installation:
Transport: 4 wheels
Securing: screw type mounting feet with pads
Dimensions (W x D x H): 108 x 40 x 48"
Options available for an additional cost:
(Qty 4) IntelliGen Mini Photoresist dispense systems:
2-Stage
Steppor motor technology and diaphragm design
Filter
Mounting bracked
Interface cables
(Qty 2) IntelliGen HV Photoresist dispense systems:
2-Stage
Steppor motor technology and diaphragm design
Filter
Mounting bracked
Interface cables
(Qty 4) 451-15-1-S IDS 1/4 x 1/4 units with suckback valves:
Bushings and compression nuts for input and output connections
(1) output
0 to 15 PSI pressure
For resist (0-80cp), Barli, and ARC (0-80cp)
Power supply
Interface cables
Software
(Qty 2) CYBOR 7500 precision chemical dispense pumps:
Mid-range viscosity: 300 cp to 3000 cp
3/8" Flare-type connections
KALREX O-rings
Variable rate dispense
High-torque stepper motor control
Dispense volume: maximum 16ml
Programmable suckback
Multiple recipe select
On-board single-pump controls
RS232, RS485, LON communications
Power supply
Interface cables
Software
Chill plate closed loop temperature control unit:
Connection tubing
Can be shared with more than one chill plate
Developer temperature control unit:
Closed loop recirculation heater / chiller
Manifold and connection tubing to dispense arm
Single temperature delivered to dispense arm
Electro-polished 5-gallon SS solvent canisters, low-level sensing
Dual chemistry developer dispense system.
SVG 88-3是一種領先的可水顯影光刻設備,為最先進的半導體器件的光刻提供了極致的性能和分辨率。該系統由一個創新的雙層樹脂基薄膜組成,包含一個水性可顯影底層,以及一個水性可顯影底層。底層以經過高度改性的聚乙烯酚基聚合物為基礎,旨在提供優異的水溶性、良好的濕蝕和幹蝕性、優異的耐化學性以及優異的光學和電子束光刻分辨率。頂層以高密度聚乙烯混合物為基礎,可實現高對比度、清潔分辨率和快速水的開發。當用作負性光致抗蝕劑時,88-3單元不需要預處理,也不需要烘烤後步驟,增強了工藝靈活性。高對比度光和電子束光刻性能使其成為X射線源電路生成的一個有吸引力的選擇。SVG 88-3出色的線緣粗糙度導致非常高的圖像保真度和最小化的航空圖像偽影。頂層經過優化,可用於248-nm和248/365-nm混合光刻。與248/365-nm功率相比,它具有更好的線寬偏移和對比度。底層提供高分辨率能力和優異的水溶性,對於現代半導體器件光刻中的應用至關重要。雙層組合改善了對比度,提供了極好的耐蝕刻性能,與水性可顯影的光刻膠兼容,並提供低背景。與其他領先的光刻膠相比,88-3的水相近紅外圖像具有良好的對比度。這種能力使得它非常適合於亞波長成像,以及在幾次叠加曝光下執行的成像應用。SVG 88-3的負音在與高級光源配合使用時也提供高對比度,使其非常適合與高NA步進器和掃描工具配合使用。88-3機用作正光抗蝕劑時,具有優異的成像性能和高分辨率。高對比度和出色的蝕刻電阻使得小特征器件的可靠制造和避免邊緣顯微鏡。總體而言,SVG 88-3提供卓越的分辨率、蝕刻電阻、光學分辨率和高對比度成像,同時仍提供顯著的工藝簡化。其獨特的雙層組合使得它成為現代半導體器件制造的特別有吸引力的選擇。這種光刻工具是設計師的理想選擇,誰想要的最大性能和分辨率為他們的產品。
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